Menene PCB Back Drilling?
Tsarin PCB baya hakowa, kuma ake magana a kai a matsayin sarrafawa zurfin hakowa, ya ƙunshi cire stub a multilayer PCBs don ƙirƙirar vias. Manufar hakowa baya shine don sauƙaƙe kwararar sigina tsakanin layuka daban-daban na allon ba tare da tsangwama daga stubs maras so ba.
Don samar da ƙarin bayani game da tsarin hakowa na baya, bari mu yi la'akari da misali.
A ce akwai PCB mai Layer 12 tare da ramin ramin da ke haɗa layi na farko da na 12. Manufar ita ce haɗi kawai Layer na farko zuwa Layer na 9, yayin da ba a haɗa na 10 zuwa na 12th ba. Duk da haka, matakan da ba a haɗa su ba suna haifar da "stubs" wanda zai iya tsoma baki tare da hanyar sigina, yana haifar da matsalolin sigina. Hakowa baya ya ƙunshi fitar da waɗannan stubs daga gefen allon baya don inganta watsa sigina.
Menene manufar PCB baya hakowa?
Ana amfani da hakowa na baya na PCB don cire ɓangaren da ba a yi amfani da shi na ramin da aka yi amfani da shi ba (ta) wanda ya wuce ƙarshen Layer na PCB. Wannan tsari yana taimakawa rage al'amurran da suka shafi mutuncin sigina, kamar stub resonance da tunanin sigina, wanda zai iya faruwa a cikin ƙirar dijital mai sauri.
Menene "rabobin al'amari"?
FAQ game da bugu na allon kewayawa › TERMINOLOGY
Alakar da ke tsakanin diamita na rami da tsayinsa. Lokacin da masana'anta suka bayyana cewa samar da su yana da "rabo" na 8:1 yana nufin, alal misali, diamita na rami shine 0.20 mm a cikin PCB mai kauri 1.60 mm.
Don tsarin HDI, yanayin yanayin microvia yana iyakance zuwa 1: 1, amma 0.7-0.8: 1 ya fi dacewa don sauƙaƙe plating.
Menene amfanin PCB baya hakowa?
Fa'idodin hakowa na PCB na baya sun haɗa da ingantaccen siginar siginar, rage asarar sakawa, ingantaccen sarrafa magana, da haɓaka bandwidth. Ta hanyar cire ɓangaren da ba a yi amfani da shi ta ganga ba, hakowa baya yana rage girman sautin stub da tunanin sigina, yana haifar da tsabta da ingantaccen watsa sigina.