Menene Majalisar BGA?
Taro na BGA yana nufin tsarin hawan Ball Grid Array (BGA) akan PCB ta amfani da dabarar siyar da sake kwarara. BGA wani abu ne mai hawa sama wanda ke amfani da tsararrun ƙwallayen siyarwa don haɗin wutar lantarki. Yayin da allon da'irar ke wucewa ta cikin tanda mai sake fitarwa, waɗannan ƙwallayen siyar suna narkewa, suna samar da haɗin lantarki.
Ma'anar BGA
BGA:Ball Grid Array
Rarraba BGA
PBGA:plasticBGA filastik rufe BGA
CBGA:BGA don marufi BGA yumbura
CCGA:Rukunin yumbura BGA al'amudin yumbu
Kunshin BGA a siffa
TBGA:tef BGA tare da ginshiƙin grid ball
Matakan Majalisar BGA
Tsarin taron BGA yawanci ya ƙunshi matakai masu zuwa:
Shiri na PCB: An shirya PCB ta hanyar amfani da manna solder zuwa gammaye inda za'a dora BGA. The solder manna ne cakuda solder gami barbashi da juyi, wanda taimaka tare da soldering tsari.
Wuraren BGAs: BGAs, waɗanda suka ƙunshi haɗaɗɗen guntun da'ira tare da ƙwallan siyarwa a ƙasa, ana sanya su akan PCB da aka shirya. Ana yin wannan yawanci ta amfani da injunan karba da wuri mai sarrafa kansa ko wasu kayan haɗin gwiwa.
Sake Soldering: PCB ɗin da aka haɗa tare da sanya BGAs ana wucewa ta cikin tanda mai sake fitarwa. Tanda mai sake kunnawa yana dumama PCB zuwa takamaiman zafin jiki wanda ke narkar da manna mai siyar, yana haifar da ƙwallan solder na BGAs don sake gudana da kafa haɗin lantarki tare da pads na PCB.
Sanyaya da Dubawa: Bayan aikin sake dawo da siyar, ana sanyaya PCB don ƙarfafa haɗin gwiwar solder. Sannan ana bincikar duk wani lahani, kamar rashin daidaituwa, guntun wando, ko haɗin haɗin gwiwa. Ana iya amfani da dubawar gani ta atomatik (AOI) ko duban X-ray don wannan dalili.
Tsari na biyu: Dangane da ƙayyadaddun buƙatun, ƙarin matakai kamar tsaftacewa, gwaji, da suturar tsari na iya yin aiki bayan taron BGA don tabbatar da aminci da ingancin samfuran da aka gama.
Amfanin Majalisar BGA
BGA Ball Grid Array
Saukewa: EBGA680L
LBGA 160L
PBGA 217L Plastic Ball Grid Array
Saukewa: SBGA192L
Saukewa: TSBGA680L
Farashin CLCC
CNR
CPGA Ceramic Pin Grid Array
Kunshin Layin Layi Dual DIP
DIP-taba
FBGA
1. Ƙananan sawun ƙafa
Marufi na BGA ya ƙunshi guntu, haɗin haɗin kai, ɗan ƙaramin bakin ciki, da murfin rufewa. Akwai ƴan abubuwan da aka fallasa kuma kunshin yana da ƙarancin adadin fil. Gabaɗaya tsayin guntu akan PCB na iya zama ƙasa da milimita 1.2.
2. Karfi
Kundin BGA yana da ƙarfi sosai. Ba kamar QFP tare da farar mil 20, BGA ba ta da fil waɗanda za su iya tanƙwara ko karya. Gabaɗaya, cirewar BGA yana buƙatar amfani da tashar sake aikin BGA a yanayin zafi mai girma.
3. Lower parasitic inductance da capacitance
Tare da gajeren fil da ƙananan tsayin taro, marufi na BGA yana nuna ƙarancin inductance da ƙarfin aiki, yana haifar da kyakkyawan aikin lantarki.
4. Ƙara sararin ajiya
Idan aka kwatanta da sauran nau'ikan marufi, marufi na BGA yana da kashi ɗaya bisa uku na ƙarar kuma kusan sau 1.2 yankin guntu. Ƙwaƙwalwar ƙwaƙwalwa da samfuran aiki ta amfani da fakitin BGA na iya cimma fiye da ninki 2.1 cikin ƙarfin ajiya da saurin aiki.
5. Babban kwanciyar hankali
Sakamakon fadada fil kai tsaye daga tsakiyar guntu a cikin marufi na BGA, hanyoyin watsawa don sigina daban-daban suna taƙaice yadda ya kamata, rage raguwar siginar da haɓaka saurin amsawa da ƙarfin tsoma baki. Wannan yana haɓaka kwanciyar hankali na samfurin.
6. Kyakkyawan zafi mai zafi
BGA yana ba da kyakkyawan aikin watsar da zafi, tare da zafin jiki na guntu yana gabatowa yanayin zafi yayin aiki.
7. Mai dacewa don sake yin aiki
An shirya filayen marufi na BGA da kyau a ƙasa, yana sauƙaƙa gano wuraren da suka lalace don cirewa. Wannan yana sauƙaƙe sake aikin kwakwalwan kwamfuta na BGA.
8. Nisantar hargitsin wayoyi
Marufi na BGA yana ba da damar sanya wuta da fitilun ƙasa da yawa a tsakiya, tare da maƙallan I/O da aka sanya a gefen. Za'a iya yin riga-kafi akan ma'aunin BGA, guje wa ruɗaɗɗen wayoyi na fitilun I/O.
RichPCBA BGA Taro Capabilities
RICHPCBA sanannen masana'anta ne na duniya don ƙirƙira PCB da taron PCB. Sabis na taro na BGA ɗaya ne daga cikin nau'ikan sabis da muke bayarwa. PCBWay na iya samar muku da ingantaccen taro mai inganci da tsadar BGA don PCBs ɗin ku. Mafi ƙarancin farar taron BGA da za mu iya ɗauka shine 0.25mm 0.3mm.
A matsayin mai bada sabis na PCB tare da shekaru 20 na gwaninta a masana'antar PCB, ƙirƙira da taro, RICHPCBA yana da kyakkyawan tushe. Idan akwai buƙatar taron BGA, da fatan za a iya tuntuɓar mu!