Taro na BGA yana nufin tsarin hawan Ball Grid Array (BGA) akan PCB ta amfani da dabarar siyar da sake kwarara. BGA wani abu ne mai hawa sama wanda ke amfani da tsararrun ƙwallayen siyarwa don haɗin wutar lantarki. Yayin da allon kewayawa ke wucewa ta cikin tanda mai sake fitarwa, waɗannan ƙwallayen solder ɗin suna narkewa, suna samar da haɗin lantarki.

An binne / makafi ta hanyar, tsagi mai tsayi, girman girman, juriya / iyawa, gauraye matsa lamba, RF, yatsa na zinari, tsarin N + N, jan ƙarfe mai kauri, hakowa baya, HDI(5+2N+5)

RO4350B,RO4450F,RO 4000serials,R04003C,92ML,RO3010RT6010LM,RO3003,RO4360G2,RT6002,RO3006,5R04 5870,duroid® 5880,ULTRALAM200016002 1RO3003,RO3730,RO3850,RO4534,RO4730,RO4360series,RT,D6010Im, Saukewa: TMM10

Saboda gaskiyar cewa jan ƙarfe yana samuwa a cikin nau'i na oxides a cikin iska, yana tasiri sosai ga solderability da aikin lantarki na PCBs. Sabili da haka, wajibi ne don aiwatar da ƙarshen PCBs. Idan fuskar PCBs ba ta ƙare ba, yana da sauƙi don haifar da matsalolin siyar da kama-da-wane, kuma a cikin lokuta masu tsanani, pads da kayan aikin ba za a iya siyar da su ba. Ƙarshen PCB yana nufin tsarin ƙirƙirar Layer na wucin gadi akan PCB. Dalilin gamawar PCB shine don tabbatar da cewa PCB yana da ingantaccen solderability ko aikin lantarki. Akwai nau'ikan gamawa da yawa don PCBs.

Mun himmatu wajen samar da ƙirar PCB mai inganci da injiniyan lantarki ta tsaya ɗaya sama da shekaru goma, muna cin amanar abokin ciniki tare da farashi mai gasa da sabis masu inganci. Ko da kuwa girman aikin ku, za mu iya saduwa da buƙatun ƙira daga ra'ayin samfur zuwa samarwa. Cikakken ikon ƙirar mu na PCB yana tabbatar da fahimtar buƙatun fasaha na aikin ku da ƙirar ƙira ta DFM, ba tare da buƙatar ƙirar ƙira da yawa ba, wanda zai zama muhimmin mahimmanci ga abokan ciniki don canzawa daga ƙirar samfuri zuwa kasuwa.