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Pūnaehana kiaʻi makapō
Nā kuhikuhi hana huahana
| Ke ano o ka Papa Kaapuni | High-frequency Hybrid kaomi PCB+Metal edging PCB+impedance |
| papa pcb papa | 8L |
| mānoanoa papa pcb | 2.0mm |
| Nui hoʻokahi | 144*141.5mm/1PCS |
| Hoʻopau ʻili | aelike |
| Ka mānoanoa keleawe o loko | 18um |
| Ka mānoanoa keleawe o waho | 35um |
| Palekana Solder | ʻōmaʻomaʻo(GTS, GBS) |
| Pcb pale siliki | keʻokeʻo(GTO,GBO) |
| mea papa kaapuni | Rogers RO4350B 1E/1E 0200 (DK=3.48）（0.508mm）+ Nā Lapa Maʻamau S1000-2M FR-4、TG170 |
| ma ka lua | ʻO nā puka hoʻoheheʻe pale pale |
| ʻO ka mānoanoa o ka lua wili mechanical | 17W/㎡ |
| Ka nui o ka lua wili laser | / |
| Min ma ka nui | 0.2mm |
| Min laula laina/space | 8/10mil |
| Aperture | 10mil |
| Ke kaomi ʻana | 1 manawa |
| wili papa pcb | 1 manawa |
Hōʻoia maikaʻi
Pūnaehana hoʻokele maikaʻi:ISO 9001: 2015, ISO14001:2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000:2012SGS ,RBA,CQC,WCA & ESA,SQ MARK,Canon GA,Sony GP
kūlana kūlana PCB:IPC 1 ,IPC 2,IPC 3 ,GJB 362C-2021，AS9100
PCB kaʻina hana nui:IL/lmage, PatternPlating, I/L AOI, B/Oxide, Layup, Press, LaserDrilling, Drilling, PTH, PanelPlating, O/Llmage, PanelPlating, SESEtching, O/L AOI, S/Mask, Legend, SurfaceFinshed (ENIGENEPIG, ʻO ke gula paʻa, ke gula palupalu, HASL, LF-HASL, lmm Tin, lmm kala, OSP), Rout, ET, FV
ʻImi ʻimi
| Nā lako nānā | mea hoao |
| Umu | ʻO ka hoʻāʻo ʻana o ka mālama ʻana i ka ikehu wela |
| Mīkini hoʻāʻo pae hoʻohaumia Ion | ʻO ka hoʻomaʻemaʻe ionic |
| Mīkini hoʻāʻo paʻakai | Ho'āʻo paʻakai |
| DC kiʻekiʻe-volte ho'āʻo | ʻO ka hoʻāʻo ʻana o ka uila |
| Megger | ʻO ke kūʻokoʻa |
| Mīkini tensile universal | ʻO ka hoʻāʻo ikaika ʻili |
| CAF | ʻO ka hoʻāʻo ʻana o Ion migration, hoʻomaikaʻi i nā substrates PCB, hoʻomaikaʻi i ka hana PCB, etc. |
| OGP | Me ka hoʻohana ʻana i nā mea ana kiʻi 3D pili ʻole, i hui pū ʻia me ka paepae hoʻoneʻe XYZ axis a me ke aniani zoom maʻalahi, me ka hoʻohana ʻana i nā kumu loiloi kiʻi e hana i nā hōʻailona kiʻi e ka lolouila, hiki ke ʻike koke ʻia ke ana ʻana o nā anana geometric a me nā kūlana kūpono, a hiki i nā waiwai CPK ke ʻike. e kālailai ʻia. |
| ʻO ka mīkini hoʻomalu kū'ē laina laina | Ho'āʻo pale pale TCT Nā ʻano hana ʻole maʻamau, ʻike i nā mea hiki ke hōʻino i nā lako ʻōnaehana a me nā ʻāpana e hōʻoia inā ua hoʻolālā ʻia a hana ʻia paha ka huahana. |
| Nā lako nānā | mea hoao |
| Pahu anuanu a me ka wela | ʻO ka hoʻāʻo ʻana i ke anuanu a me ka wela, ke kiʻekiʻe a me ka haʻahaʻa haʻahaʻa |
| Keʻena mahana a me ka haʻahaʻa mau | Electrochemical corrosion a me ka ho'āʻo kū'ē kū'ē |
| ipu hao | Hoʻāʻo solderability |
| RoHS | Hōʻike RoHS |
| Mea hōʻike impedance | AC impedance a me ka mana poho waiwai |
| Lako hoao uila | E ho'āʻo i ka hoʻomau kaapuni o ka huahana |
| Mīkini nila lele | ʻO ka insulation kiʻekiʻe a me ka haʻahaʻa haʻahaʻa e hana ana i ka hoʻāʻo |
| ʻO ka mīkini nānā puka piha piha | E nānā i nā ʻano lua ʻano like ʻole, e like me nā puka poepoe, nā puka pōkole, nā puka lōʻihi, nā puka nui ʻole, porous, nā puka liʻiliʻi, nā puka nui a me nā puka liʻiliʻi, a me nā hana nānā ʻana o ka plug plug. |
| AOI | AOI 'akomi scans PCBA huahana ma kiʻekiʻe-definition CCD pahupaʻiwikiō, ohi i na kiʻi, hoʻohālikelike i nā helu ho'āʻo me qualified parameters i loko o ka waihona, a ma hope o kiʻi kaʻina hana, nānā no ka liʻiliʻi defects i hiki ke nānā 'ia ma ka pahu hopu PCB. ʻAʻohe mea e pakele ai mai nā hemahema kaapuni |
He aha ka Pūnaehana Nānā Makapō (BSM)?
ʻO kahi Blind Spot Monitoring System (BSM) kahi ʻenehana palekana kaʻa ʻokiʻoki i hoʻolālā ʻia e ʻike a nānā i nā wahi makapō ma nā ʻaoʻao ʻelua o kāu kaʻa, e kōkua ana iā ʻoe e pale i ka hiki ke hoʻokuʻi ʻia. Eia ka nānā pono ʻana i nā hana nui a me nā pōmaikaʻi o kahi Pūnaehana Nānā Makapō.
Nā Hana Nui o ka Pūnaehana Nānā Makapō
ʻIke Makapō: Ke hoʻohana nei i nā mea ʻike kiʻekiʻe (maʻa mau radar a i ʻole nā kāmeʻa), ʻike ka ʻōnaehana i nā kaʻa a i ʻole nā mea pale i nā wahi makapō, e hāʻawi ana i nā mākaʻikaʻi manawa maoli.
Kokua Hoʻololi Lane: Hiki ke hoʻohui pū ʻia nā ʻōnaehana hoʻokele makapō kiʻekiʻe me nā ʻōnaehana hoʻokele a me ka braking o kāu kaʻa. Kōkua kēia hiʻohiʻona iā ʻoe i ka wā e hoʻololi ai i ke ala, hoʻomaikaʻi i ka palekana holoʻokoʻa a pale i nā hui ʻana.
ʻenehana kiʻekiʻe: Hoʻohui i nā ʻōnaehana radar a me nā ʻōnaehana kamera no ka ʻike pololei a hilinaʻi.
ʻO ka hoʻopukapuka kālā ʻana i kahi Pūnaehana Mākaʻikaʻi Makapō kahi hana akamai no kēlā me kēia kaʻa e ʻimi nei e hoʻonui i nā hiʻohiʻona palekana o kā lākou kaʻa. E makaʻala i kou puni a e hoʻokele me ka hilinaʻi me ka ʻike e nānā pono ana kāu ʻōnaehana BSM i kou mau wahi makapō.
Nā Pōmaikaʻi o nā Pūnaehana Nānā Makapō
Hoʻonui i ka palekana: Hoʻemi nui i ka pilikia o nā ulia pōpilikia ma ka hoʻomaopopo ʻana i nā mea hoʻokele i nā kaʻa ma ko lākou mau makapō.
Ke Kaʻa ʻAʻohe Stress-Free: Hāʻawi i ka maluhia o ka noʻonoʻo, ʻoi aku ka nui o ka wā e hoʻololi ai i ke ala a me ka hui ʻana ma nā alaloa.
He aha ka dielectric mau o RO4350B?
Hiki ke hoʻololi iki ka dielectric mau (Dk) o RO4350B me ke alapine, ʻoiai he liʻiliʻi kēia hoʻololi. Hoʻolālā ʻia ʻo RO4350B ma ke ʻano he microwave hana kiʻekiʻe a me ka mea noi alapine radio, me kahi dielectric paʻa paʻa (Dk) i hoʻolālā ʻia e hoʻololi i nā koi alapine like ʻole.
Ma kāna pepa ʻikepili ʻenehana, hāʻawi maʻamau ʻo Rogers Corporation i kahi waiwai mau dielectric ma kahi alapine kikoʻī (e like me 10 GHz), ʻo ia ka 3.48 no RO4350B. ʻO ia ke ʻano o ka hoʻolālā ʻana a me ka loiloi ʻana i ke kūpono o ka papa kaapuni RO4350B no nā noi kikoʻī, hiki ke noʻonoʻo ʻia kēia waiwai mau dielectric.
Eia naʻe, ma ka maʻamau, i ka loiloi ʻana i ka hana o kekahi mea ma nā alapine like ʻole, he mea nui e hoʻomaopopo i ke ʻano o kona mau dielectric i ʻokoʻa me ka alapine, no ka mea hiki ke hoʻopili i ka wikiwiki hoʻolaha a me ka nalowale o nā hōʻailona. ʻOiai ua hoʻolālā ʻia ka waiwai Dk o RO4350B i mea paʻa, hiki ke hōʻike i nā ʻokoʻa liʻiliʻi ma luna o kahi ākea ākea. Ma ke kaʻina hana hoʻolālā o nā noi kiʻekiʻe-frequency, ʻōlelo pinepine ʻia e nānā i ka ʻikepili kikoʻī kikoʻī kikoʻī o nā mea e loaʻa ai ka ʻike waiwai waiwai.
Palapala noi
Loaʻa i ka HDI PCB kahi ākea o nā hiʻohiʻona noiʻi ma ke kahua uila, e like me:
-Big Data & AI: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka maikaʻi o ka hōʻailona, ke ola pākaukau a me ka hoʻohui ʻana o nā kelepona paʻa, ʻoiai e hōʻemi ana i ko lākou kaumaha a me ka mānoanoa. Hiki i ka HDI PCB ke kākoʻo i ka hoʻomohala ʻana i nā ʻenehana hou e like me ke kamaʻilio 5G, AI a me IoT, etc.
-Automobile: Hiki i ka HDI PCB ke hoʻokō i ka paʻakikī a me ka hilinaʻi o nā ʻōnaehana uila, ʻoiai e hoʻomaikaʻi ana i ka palekana, hōʻoluʻolu a me ka naʻauao o nā kaʻa. Hiki ke hoʻohana ʻia i nā hana e like me ka radar automotive, hoʻokele, ʻoliʻoli a me ke kōkua hoʻokele.
-Medical: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka pololei, ka ʻike a me ka paʻa o nā mea lapaʻau, ʻoiai e hōʻemi ana i ko lākou nui a me ka hoʻohana ʻana i ka mana. Hiki ke hoʻohana ʻia ma nā kahua e like me ke kiʻi ʻana i ka lāʻau lapaʻau, ka nānā ʻana, ka ʻike a me ka mālama ʻana.
Palapala noi
ʻO nā noi nui o HDI PCB aia i nā kelepona paʻalima, nā kāmela kikohoʻe, AI, nā mea lawe IC, nā kamepiula, nā uila uila, robots, drones, etc.
-Medical: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka pololei, ka ʻike a me ka paʻa o nā mea lapaʻau, ʻoiai e hōʻemi ana i ko lākou nui a me ka hoʻohana ʻana i ka mana. Hiki ke hoʻohana ʻia ma nā kahua e like me ke kiʻi ʻana i ka lāʻau lapaʻau, ka nānā ʻana, ka ʻike a me ka mālama ʻana.