ʻO ka ʻokoʻa ma waena o nā PCB Ceramic a me nā PCB FR4 kuʻuna
Ma mua o ke kūkākūkā ʻana i kēia pilikia, e hoʻomaopopo mua kākou i nā PCB ceramic a me nā mea FR4 PCB.
ʻO ka Papa Kaapuni Ceramic e pili ana i kahi ʻano o ka papa kaapuni i hana ʻia ma muli o nā mea seramika, ʻike ʻia hoʻi he Ceramic PCB (paʻi kaapuni paʻi). ʻAʻole like me nā substrates aniani fiber reinforced plastic (FR-4), hoʻohana nā papa kaapuni seramika i nā substrates seramika, hiki ke hāʻawi i ke kūpaʻa wela kiʻekiʻe, ʻoi aku ka ikaika mechanical, ʻoi aku ka maikaʻi o nā waiwai dielectric, a me ka lōʻihi o ke ola. Hoʻohana nui ʻia nā PCB Ceramic i ka wela kiʻekiʻe, kiʻekiʻe-frequency, a me ka mana kiʻekiʻe, e like me nā kukui LED, nā mana amplifiers, semiconductor lasers, RF transceivers, sensors, a me nā polokalamu microwave.
ʻO ka Papa Kaapuni e pili ana i kahi mea maʻamau no nā ʻāpana uila, ʻike ʻia hoʻi he PCB a i ʻole ka papa kaapuni paʻi. He mea lawe ia no ka hui ʻana i nā ʻāpana uila ma ke paʻi ʻana i nā ʻano kaapuni metala ma nā substrates non-conductive, a laila hana i nā ala conductive ma o nā kaʻina hana e like me ka corrosion kemika, electrolytic copper, a me ka wili.
Eia ka hoʻohālikelike ʻana ma waena o ka ceramic CCL a me FR4 CCL, me kā lākou ʻokoʻa, nā pono a me nā hemahema.
| Nā hiʻohiʻona | CCL seramika | FR4 CCL |
| Mea Mea Mea | Keramika | Epoxy resin i hoʻoikaika ʻia ke aniani fiber |
| ʻO ka hoʻokō | N | A ME |
| ʻO ka hoʻoili wela (W/mK) | 10-210 | 0.25-0.35 |
| Laulā o ka mānoanoa | 0.1-3mm | 0.1-5mm |
| Paʻakikī i ka hana ʻana | Kiʻekiʻe | Haʻahaʻa |
| Uku Hana Hana | Kiʻekiʻe | Haʻahaʻa |
| Pono | ʻO ke kūpaʻa kiʻekiʻe kiʻekiʻe, ka hana dielectric maikaʻi, ka ikaika mechanical kiʻekiʻe, a me ke ola lōʻihi | ʻO nā mea maʻamau, nā kumukūʻai hana haʻahaʻa, ka hana maʻalahi, kūpono no nā noi haʻahaʻa |
| Nā pōʻino | ʻO ke kumukūʻai hana kiʻekiʻe, ka hana paʻakikī, kūpono wale no nā noi kiʻekiʻe a i ʻole nā mana kiʻekiʻe | Paʻa paʻa dielectric mau, hoʻololi nui ka wela, haʻahaʻa ikaika mechanical, a me ka maʻalahi i ka makū |
| Nā hana | I kēia manawa, ʻelima mau ʻano maʻamau o nā CCL thermal ceramic, me ka HTCC, LTCC, DBC, DPC, LAM, etc. | Papa lawe IC, Papa Rigid-Flex, HDI kanu ʻia/makapō ma o ka papa, papa ʻaoʻao hoʻokahi, papa ʻaoʻao ʻelua, papa ʻāpana nui. |
ʻO ka PCB seramika
Nā kahua noi o nā mea like ʻole:
Alumina Ceramic (Al2O3): Loaʻa iā ia ka insulation maikaʻi loa, ke kūpaʻa kiʻekiʻe-mehana, ka paʻakikī, a me ka ikaika mechanical e kūpono i nā mea uila uila kiʻekiʻe.
Aluminum Nitride Ceramics (AlN): Me ke kiʻekiʻe o ka thermal conductivity a me ke kūpaʻa wela maikaʻi, kūpono ia no nā mea uila uila kiʻekiʻe a me nā māla kukui LED.
ʻO Zirconia ceramics (ZrO2): me ka ikaika kiʻekiʻe, ka paʻakikī kiʻekiʻe a me ke kūpaʻa ʻana, kūpono ia no nā mea uila uila kiʻekiʻe.
Nā kahua noi o nā kaʻina hana like ʻole:
ʻO HTCC (High Temperature Co fired Ceramics): He kūpono no nā noi kiʻekiʻe a me nā mana kiʻekiʻe, e like me ka uila uila, aerospace, kamaʻilio satellite, kamaʻilio optical, nā mea lapaʻau, nā uila uila, petrochemical a me nā ʻoihana ʻē aʻe. ʻO nā hiʻohiʻona huahana nā LED mana kiʻekiʻe, nā mana amplifiers, inductors, sensors, capacitors mālama ikehu, etc.
LTCC (Low Temperature Co fired Ceramics): He kūpono no ka hana ʻana i nā mea microwave e like me RF, microwave, antenna, sensor, kānana, mana divider, etc. Eia kekahi, hiki ke hoʻohana ʻia i ka lāʻau lapaʻau, automotive, aerospace, kamaʻilio, uila a me nā ʻoihana ʻē aʻe. ʻO nā hiʻohiʻona huahana nā modula microwave, nā modula antenna, nā mea ʻike kaomi, nā mea ʻike kinoea, nā mea ʻike wikiwiki, nā kānana microwave, nā mea hoʻokaʻawale mana, etc.
DBC (Direct Bond Copper): He kūpono no ka hoʻoheheʻe ʻana i ka wela o nā mea semiconductor mana kiʻekiʻe (e like me IGBT, MOSFET, GaN, SiC, a me nā mea ʻē aʻe) me ka conductivity thermal maikaʻi loa a me ka ikaika mechanical. ʻO nā hiʻohiʻona huahana nā modula mana, nā uila uila, nā mea hoʻokele kaʻa uila, etc.
DPC (Direct Plate Copper Multilayer Printed Circuit Board): hoʻohana nui ʻia no ka hoʻopau ʻana i ka wela o nā kukui LED kiʻekiʻe me nā hiʻohiʻona o ka ikaika kiʻekiʻe, ka conductivity thermal kiʻekiʻe, a me ka hana uila kiʻekiʻe. ʻO nā hiʻohiʻona huahana nā kukui LED, UV LED, COB LEDs, etc.
LAM (Laser Activation Metallization for Hybrid Ceramic Metal Laminate): hiki ke hoʻohana ʻia no ka hoʻopau ʻana i ka wela a me ka hoʻokō ʻana i ka hana uila i nā kukui LED kiʻekiʻe, nā modula mana, nā kaʻa uila, a me nā māla ʻē aʻe. ʻO nā hiʻohiʻona huahana nā kukui LED, nā modula mana, nā mea hoʻokele kaʻa kaʻa uila, etc.
FR4 PCB
ʻO nā papa lawe IC, nā papa Rigid-Flex a me HDI makapō / kanu ʻia ma o nā papa he mau ʻano PCB, i hoʻohana ʻia i nā ʻoihana like ʻole a me nā huahana penei:
Papa lawe IC: He papa kaapuni paʻi maʻamau ia, hoʻohana nui ʻia no ka hoʻāʻo ʻana i ka chip a me ka hana ʻana i nā mea uila. ʻO nā noi maʻamau ka hana semiconductor, hana uila, aerospace, pūʻali koa, a me nā mea ʻē aʻe.
Papa Rigid-Flex: He papa waiwai ia e hoʻohui i ka FPC me ka PCB paʻa, me nā pono o nā papa kaapuni maʻalahi a paʻa. ʻO nā noi maʻamau e pili ana i nā mea uila uila, nā mea lapaʻau, nā uila uila, aerospace, a me nā mea ʻē aʻe.
HDI makapō / kanu ʻia ma o ka papa: He papa kaapuni paʻi paʻi kiʻekiʻe kiʻekiʻe me ka nui o ka laina kiʻekiʻe a me ka puka liʻiliʻi e loaʻa ai ka ʻeke liʻiliʻi a me ka hana kiʻekiʻe. Loaʻa nā noi maʻamau i nā kamaʻilio paʻa lima, nā kamepiula, nā mea hoʻohana uila, a me nā kahua ʻē aʻe.