Hiki i ka Hui PCB
SMT, ʻo ka inoa piha ka ʻenehana mauna luna. ʻO SMT kahi ala e kau ai i nā ʻāpana a i ʻole nā ʻāpana ma luna o nā papa. Ma muli o ka hopena maikaʻi aʻe a ʻoi aku ka maikaʻi, ua lilo ʻo SMT i ke ala mua i hoʻohana ʻia i ke kaʻina hana o ka hui PCB.
ʻO nā pono o ka hui SMT
1. Ka nui liʻiliʻi a me ka māmā
ʻO ka hoʻohana ʻana i ka ʻenehana SMT e hōʻuluʻulu i nā ʻāpana ma luna o ka papa e kōkua pololei i ka hōʻemi ʻana i ka nui holoʻokoʻa a me ke kaumaha o nā PCB. ʻO kēia ala hui e hiki ai iā mākou ke hoʻokomo i nā mea hou aʻe i loko o kahi ākea i hiki ke hoʻokō i nā hoʻolālā paʻa a me ka hana ʻoi aku ka maikaʻi.
2. hilinaʻi kiʻekiʻe
Ma hope o ka hōʻoia ʻana o ka prototype, ʻaneʻane maʻalahi ke kaʻina hana SMT holoʻokoʻa me nā mīkini kikoʻī, e hōʻemi ana i nā hewa i hana ʻia e ka hana lima. Mahalo i ka automation, hōʻoia ka ʻenehana SMT i ka hilinaʻi a me ka kūlike o nā PCB.
3. Hoʻopakele kālā
ʻIke pinepine ʻia ka hui ʻana o SMT ma o nā mīkini ʻakomi. ʻOiai ke kiʻekiʻe o ke kumukūʻai hoʻokomo o nā mīkini, kōkua nā mīkini maʻalahi e hōʻemi i nā hana lima i ka wā o nā kaʻina SMT, kahi e hoʻomaikaʻi nui ai i ka hana hana a hoʻohaʻahaʻa i nā kumukūʻai hana i ka wā lōʻihi. A ʻoi aku ka liʻiliʻi o nā mea i hoʻohana ʻia ma mua o ka hui ʻana i loko o ka puka, a e hoʻemi ʻia ke kumukūʻai.
| Hiki iā SMT: 19,000,000 helu / lā | |
| Lako Hoao | X-RAY mea hoʻopololei ʻole, ʻImi ʻatikala mua, A0I, mea ʻike ICT, BGA Rework Instrument |
| Ka māmā holo | 0.036 S/pcs (Ke kūlana maikaʻi loa) |
| Nā ʻāpana Spec. | Pūʻolo liʻiliʻi liʻiliʻi |
| ʻO ka pololei o nā mea hana liʻiliʻi | |
| IC chip pololei | |
| Kauʻia PCB Spec. | Ka nui o ka substrate |
| Mānoanoa lepo | |
| Kickout Rate | 1. Impedance Capacitance Ratio: 0.3% |
| 2.IC me ka kickout ole | |
| ʻAno Papa | POP/PCB maʻamau/FPC/Rigid-Flex PCB/metala PCB |
| DIP hiki i kēlā me kēia lā | |
| laina hoʻopili DIP | 50,000 helu / lā |
| DIP laina kūʻai aku | 20,000 helu / lā |
| laina hoʻāʻo DIP | 50,000pcs PCBA / lā |
| Hiki ke hana i na lako SMT nui | ||
| Mīkini | Kaulana | ʻĀpana |
| Mea Paipalapala GKG GLS | Paʻi PCB | 50x50mm~610x510mm |
| pololei paʻi | ±0.018mm | |
| Nui kiʻi | 420x520mm-737x737mm | |
| ka laulā o ka mānoanoa PCB | 0.4-6mm | |
| Mīkini hoʻohui pū ʻia | ʻO ka sila hoʻoili PCB | 50x50mm~400x360mm |
| Wehewehe | ʻO ka sila hoʻoili PCB | 50x50mm~400x360mm |
| YAMAHA YSM20R | ina e lawe 1 papa | L50xW50mm -L810xW490mm |
| SMD theoretical māmā holo | 95000CPH(0.027 s/chip) | |
| Laulā hui | 0201(mm) -45*45mm mea e kau ana ke kiekie: ≤15mm | |
| Ka pololei o ka hui | CHIP+0.035mmCpk ≥1.0 | |
| Ka nui o nā ʻāpana | 140 ʻano (8mm scroll) | |
| YAMAHA YS24 | ina e lawe 1 papa | L50xW50mm -L700xW460mm |
| SMD theoretical māmā holo | 72,000CPH(0.05 s/chip) | |
| Laulā hui | 0201(mm)-32*mm mea e kau ana ke kiekie: 6.5mm | |
| Ka pololei o ka hui | ±0.05mm, ±0.03mm | |
| Ka nui o nā ʻāpana | 120 ʻano (8mm scroll) | |
| YAMAHA YSM10 | ina e lawe 1 papa | L50xW50mm ~L510xW460mm |
| SMD theoretical māmā holo | 46000CPH(0.078 s/ʻoki) | |
| Laulā hui | 0201(mm)-45*mm mea e kau ana ke kiekie: 15mm | |
| Ka pololei o ka hui | ±0.035mm Cpk ≥1.0 | |
| Ka nui o nā ʻāpana | 48 ʻano (8mm reel)/15 ʻano o nā pā IC maʻalahi | |
| JT TEA-1000 | Hiki ke hoʻololi ʻia kēlā me kēia ala ʻelua | W50~270mm substrate/hoʻokahi track hiki adjustable W50*W450mm |
| Kiʻekiʻe o nā ʻāpana ma PCB | luna/lalo 25mm | |
| Ka māmā holo conveyor | 300~2000mm/sec | |
| ALeader ALD7727D AOI ma ka pūnaewele | Hoʻoholo/Lāʻike ʻike/Ka wikiwiki | Koho: 7um/piksel FOV:28.62mmx21.00mm Kūlana:15um pika FOV:61.44mmx45.00mm |
| ʻIke i ka wikiwiki | ||
| Pūnaehana pāʻālua | ka ʻike ʻana i ke code bar maʻalahi (ka code bar a i ʻole QR code) | |
| Ka laulā o ka nui o ka PCB | 50x50mm(min)~510x300mm(max) | |
| 1 track paʻa | Hoʻopaʻa ʻia ka track 1, hiki ke hoʻoponopono ʻia ka track 2/3/4; ʻo ka min. ʻO ka nui ma waena o 2 a me 3 track he 95mm; ʻO ka nui kiʻekiʻe ma waena o 1 a me 4 track he 700mm. | |
| Laina hoʻokahi | ʻO 550mm ka laulā o ka track. ʻO ke ala ʻelua: ʻo 300mm ka laula ʻelua ala nui (ka laulā hiki ke ana); | |
| Ka laulā o ka mānoanoa PCB | 0.2mm-5mm | |
| ʻO ka hoʻomaʻemaʻe PCB ma waena o luna a me lalo | ʻO ka ʻaoʻao luna PCB: 30mm / PCB ʻaoʻao lalo: 60mm | |
| 3D SPI SINIC-TEK | Pūnaehana pāʻālua | ka ʻike ʻana i ke code bar maʻalahi (ka code bar a i ʻole QR code) |
| Ka laulā o ka nui o ka PCB | 50x50mm(min)~630x590mm(max) | |
| Ka pololei | 1μm, kiʻekiʻe: 0.37um | |
| Hiki hou | 1um (4sigma) | |
| Ka māmā holo o ke kahua ʻike | 0.3s / kahua ʻike | |
| Ka manawa ʻike wahi kuhikuhi | 0.5s / kiko | |
| Kiʻekiʻe kiʻekiʻe o ka ʻike | ± 550um~1200μm | |
| Max ana kiekie o warping PCB | ±3.5mm~±5mm | |
| Ka palena iki o ka papa | 100um (e pili ana i kahi pad soler me ke kiʻekiʻe o 1500um) | |
| Ka nui ho'āʻo liʻiliʻi | rectangle 150um, poepoe 200um | |
| Kiʻekiʻe o ka ʻāpana ma PCB | luna/lalo 40mm | |
| PCB mānoanoa | 0.4-7mm | |
| Unicomp X-Ray mea ike 7900MAX | ʻAno pahu māmā | ʻano paʻa |
| Volta paipu | 90kV | |
| Ka mana puka kiʻekiʻe | 8W | |
| Ka nui kālele | 5μm | |
| Mea ʻimi | FPD wehewehe kiʻekiʻe | |
| Nui pika | ||
| Ka nui ʻike pono | 130*130[mm] | |
| Pika matrix | 1536*1536[pika] | |
| Pākuʻi pā | 20fps | |
| Hoʻonui ʻōnaehana | 600X | |
| Hoʻonohonoho hoʻokele | Hiki ke huli koke i nā kiʻi kino | |
| Ana 'akomi | Hiki ke ana ʻakomi i nā ʻōhū i nā mea uila i hoʻopaʻa ʻia e like me BGA & QFN | |
| ʻIke ʻakomi CNC | E kākoʻo i ka helu hoʻokahi a me ka hoʻohui matrix, e hana wikiwiki i nā papahana a nānā iā lākou | |
| Hoʻonui geometric | 300 manawa | |
| Mea paahana ana like ole | Kākoʻo i nā ana geometric e like me ka mamao, ke kihi, ke anawaena, polygon, etc | |
| Hiki ke ʻike i nā laʻana ma kahi kihi 70 degere | Aia ka ʻōnaehana i ka hoʻonui a hiki i 6,000 | |
| ʻIke BGA | ʻOi aku ka hoʻonui nui, ʻoi aku ka maʻalahi o ke kiʻi, a maʻalahi hoʻi ke ʻike i nā hui solder BGA a me nā māwae tini | |
| kahua | Hiki ke hoʻonohonoho i nā kuhikuhi X, Y a me Z; Hoʻonohonoho kuhikuhi o nā paipu X-ray a me nā mea ʻike X-ray | |