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Papa PCB hoʻonui mana kamaʻilio
Nā kuhikuhi hana huahana
| Ke ano o ka Papa Kaapuni | High-frequency Hybrid kaomi PCB+Metal edging+resin plug puka |
| papa pcb papa | 8L |
| mānoanoa papa pcb | 2.0mm |
| Nui hoʻokahi | 104.9*108.4mm/1PCS |
| Hoʻopau ʻili | aelike |
| Ka mānoanoa keleawe o loko | 35um |
| Ka mānoanoa keleawe o waho | 35um |
| Solder Masking | ʻōmaʻomaʻo(GTS, GBS) |
| Pcb pale siliki | keʻokeʻo(GTO,GBO) |
| mea papa kaapuni | ʻO Rogers RO4350B+ Nā Lapa Maʻamau S1000-2M,FR-4,TG170 |
| ma ka lua | puka resini |
| ʻO ka mānoanoa o ka lua wili mechanical | 11W/㎡ |
| Ka nui o ka lua wili laser | / |
| Min ma ka nui | 0.3mm |
| Min laula laina/space | 5/7mil |
| Lakiō puka | 7mil |
| Ke kaomi ʻana | 1 manawa |
| wili papa pcb | 1 manawa |
Hōʻoia maikaʻi
Pūnaehana hoʻokele maikaʻi:ISO 9001: 2015, ISO14001:2015, IATF16949: 2016, OHSAS 18001: 2007, QC080000:2012SGS , RBA, CQC, WCA & ESA, SQ MARK, Canon GA, Sony GP
kūlana kūlana PCB:IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
PCB kaʻina hana nui:IL/lmage, PatternPlating, I/L AOI, B/Oxide, Layup, Press, LaserDrilling, Drilling, PTH, PanelPlating, O/Llmage, PanelPlating, SESEtching, O/L AOI, S/Mask, Legend, SurfaceFinshed (ENIGENEPIG, ʻO ke gula paʻa, ke gula palupalu, HASL, LF-HASL, lmm Tin, lmm kala, OSP), ʻAla, ET, FV
ʻImi ʻimi
| Nā lako nānā | mea hoao |
| umu | ʻO ka hoʻāʻo ʻana o ka mālama ʻana i ka ikehu wela |
| Mīkini hoʻāʻo pae hoʻohaumia Ion | ʻO ka hoʻomaʻemaʻe ionic |
| Mīkini hoʻāʻo paʻakai | Ho'āʻo paʻakai |
| DC kiʻekiʻe-volte ho'āʻo | ʻO ka hoʻāʻo ʻana o ka uila |
| Megger | Kūleʻa hoʻokaʻawale |
| Mīkini tensile universal | ʻO ka hoʻāʻo ikaika ʻili |
| CAF | ʻO ka hoʻāʻo ʻana o Ion migration, hoʻomaikaʻi i nā substrates PCB, hoʻomaikaʻi i ka hana PCB, etc. |
| OGP | Me ka hoʻohana ʻana i nā mea ana kiʻi 3D pili ʻole, i hui pū ʻia me ka paepae hoʻoneʻe XYZ axis a me ke aniani zoom maʻalahi, me ka hoʻohana ʻana i nā kumu loiloi kiʻi e hana i nā hōʻailona kiʻi e ka lolouila, hiki ke ʻike koke ʻia ke ana ʻana o nā anana geometric a me nā kūlana kūpono, a hiki i nā waiwai CPK ke ʻike. e kālailai ʻia. |
| ʻO ka mīkini hoʻomalu kū'ē laina laina | Ho'āʻo pale pale TCT Nā ʻano hana ʻole maʻamau, ʻike i nā mea hiki ke hōʻino i nā lako ʻōnaehana a me nā ʻāpana e hōʻoia inā ua hoʻolālā ʻia a hana ʻia paha ka huahana. |
| Nā lako nānā | mea hoao |
| Pahu anuanu a me ka wela | ʻO ka hoʻāʻo ʻana i ke anuanu a me ka wela, ke kiʻekiʻe a me ka haʻahaʻa haʻahaʻa |
| Keʻena mahana a me ka haʻahaʻa mau | Electrochemical corrosion a me ka ho'āʻo kū'ē kū'ē |
| ipu hao | Hoʻāʻo solderability |
| RoHS | Hōʻike RoHS |
| Mea hōʻike impedance | AC impedance a me ka mana poho waiwai |
| Lako hoao uila | E ho'āʻo i ka hoʻomau kaapuni o ka huahana |
| Mīkini nila lele | ʻO ka insulation kiʻekiʻe a me ka haʻahaʻa haʻahaʻa e hana ana i ka hoʻāʻo |
| ʻO ka mīkini nānā puka piha piha | E nānā i nā ʻano lua ʻano like ʻole, e like me nā puka poepoe, nā puka pōkole, nā puka lōʻihi, nā puka nui ʻole, porous, nā puka liʻiliʻi, nā puka nui a me nā puka liʻiliʻi, a me nā hana nānā ʻana o ka plug plug. |
| AOI | AOI 'akomi scans PCBA huahana ma kiʻekiʻe-definition CCD pahupaʻiwikiō, ohi i na kiʻi, hoʻohālikelike i nā helu ho'āʻo me qualified parameters i loko o ka waihona, a ma hope o kiʻi kaʻina hana, nānā no ka liʻiliʻi defects i hiki ke nānā 'ia ma ka pahu hopu PCB. ʻAʻohe mea e pakele ai mai nā hemahema kaapuni |
Nā polokalamu PCB kiʻekiʻe
E koho i nā mea kiʻekiʻe-frequency a me nā ʻenehana hana me nā waiwai DK a me DF like ʻole e hoʻokō i nā hiʻohiʻona noiʻi o nā PCB kiʻekiʻe kiʻekiʻe like ʻole: ka lawe ʻana i ka ʻikepili uila, WiFi, 4G, 5G, 6G, Microwave umu, kamaʻilio satellite, hoʻolaha lekiō, kamaʻilio kelepona, hoʻolaha kīwī, GPS, kaohi mamao, ka nānā ʻana, ke kamaʻilio maʻamau, ke kauoha mamao, ka mana lako, 76 ~ 81GHz millimeter wave radar, lōʻihi millimeter wave anti-collision radar, millimeter wave anti-collision radar no ka drone, satellite communication terminal antenna a kiʻekiʻe-wikiwiki backboard.
ʻO ke alapine kiʻekiʻe (HF): ʻO ka laulā kiʻekiʻe ma kahi o 3MHz a me 30MHz.
Radio Frequency (RF): E pili ana i ka laina alapine mai kahi o 3kHz a i 300GHz.
Microwave: Aia ka laulā ma waena o 300MHz a me 300GHz.
He aha ka dielectric mau o RO4350B?
Loaʻa i ka RO4350B kahi mau dielectric (Dk) ma kahi o 3.48, he waiwai paʻa ke ana ʻia ma ke alapine o 10 GHz. Hana kēia dielectric mau i ka RO4350B i mea kūpono no nā noi kiʻekiʻe e like me ka microwave a me nā ʻōnaehana kamaʻilio RF, no ka mea, hāʻawi ia i nā hiʻohiʻona paʻa paʻa.
Palapala noi
Loaʻa i ka HDI PCB kahi ākea o nā hiʻohiʻona noiʻi ma ke kahua uila, e like me:
-Big Data & AI: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka maikaʻi o ka hōʻailona, ke ola pākaukau a me ka hoʻohui ʻana o nā kelepona paʻa, ʻoiai e hōʻemi ana i ko lākou kaumaha a me ka mānoanoa. Hiki i ka HDI PCB ke kākoʻo i ka hoʻomohala ʻana i nā ʻenehana hou e like me ke kamaʻilio 5G, AI a me IoT, etc.
-Automobile: Hiki i ka HDI PCB ke hoʻokō i ka paʻakikī a me ka hilinaʻi o nā ʻōnaehana uila, ʻoiai e hoʻomaikaʻi ana i ka palekana, hōʻoluʻolu a me ka naʻauao o nā kaʻa. Hiki ke hoʻohana ʻia i nā hana e like me ka radar automotive, hoʻokele, ʻoliʻoli a me ke kōkua hoʻokele.
-Medical: Hiki i ka HDI PCB ke hoʻomaikaʻi i ka pololei, ka ʻike a me ke kūpaʻa o nā mea lapaʻau, ʻoiai e hōʻemi ana i ko lākou nui a me ka hoʻohana ʻana i ka mana. Hiki ke hoʻohana ʻia i nā kahua e like me ke kiʻi ʻana i ka lāʻau lapaʻau, ka nānā ʻana, ka maʻi maʻi a me ka mālama ʻana.
ʻO nā noi nui o HDI PCB aia i nā kelepona paʻalima, nā kāmela kikohoʻe, AI, nā mea lawe IC, nā kamepiula, nā uila uila, robots, drones, etc.
