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Qhov txawv ntawm Ceramic PCBs thiab Traditional FR4 PCBs

2024-05-23 IB

Ua ntej sib tham txog qhov teeb meem no, cia peb nkag siab txog dab tsi ceramic PCBs yog dab tsi thiab FR4 PCBs yog dab tsi.

Ceramic Circuit Board yog hais txog ib hom Circuit Court board tsim los ntawm cov khoom siv ceramic, los yog Ceramic PCB (luam Circuit Board). Tsis zoo li cov iav fiber ntau reinforced yas (FR-4) substrates, ceramic circuit boards siv ceramic substrates, uas tuaj yeem muab kev ruaj ntseg kub dua, zoo dua mechanical zog, zoo dielectric zog, thiab ntev lifespan. Ceramic PCBs yog siv nyob rau hauv high-temperature, high-frequency, thiab high-power circuits, xws li LED teeb, lub hwj chim amplifiers, semiconductor lasers, RF transceivers, sensors, thiab microwave.

Circuit Board hais txog cov khoom siv yooj yim rau cov khoom siv hluav taws xob, tseem hu ua PCB lossis luam tawm Circuit Board. Nws yog cov khoom thauj khoom siv rau kev sib sau cov khoom siv hluav taws xob los ntawm kev luam ntawv hlau Circuit Court qauv ntawm cov khoom siv tsis zoo, thiab tom qab ntawd tsim cov kev coj ua los ntawm cov txheej txheem xws li tshuaj lom neeg corrosion, electrolytic tooj liab, thiab drilling.

Cov hauv qab no yog kev sib piv ntawm ceramic CCL thiab FR4 CCL, nrog rau lawv qhov sib txawv, qhov zoo thiab qhov tsis zoo.

 

Yam ntxwv

Ceramic CCL

FR4 CCL

Cov khoom siv

Ceramic

iav fiber reinforced epoxy resin

Kev coj ua

N

THIAB

Thermal conductivity (W / mK)

10-210 : kuv

0.25-0.35 Nws

Ntau yam ntawm Thickness

0.1-3 hli

0.1-5 hli

Kev ua haujlwm nyuaj

Siab

Tsawg

Tus nqi tsim khoom

Siab

Tsawg

Qhov zoo

Zoo siab-kub stability, zoo dielectric kev ua tau zoo, siab mechanical zog, thiab ntev kev pab cuam lub neej

Cov khoom siv sib xws, cov nqi tsim khoom tsawg, kev ua haujlwm yooj yim, tsim nyog rau kev siv tsawg zaus

Qhov tsis zoo

Cov nqi tsim khoom siab, kev ua haujlwm nyuaj, tsuas yog tsim nyog rau kev siv lub zog siab lossis lub zog siab

Tsis ruaj tsis khov dielectric tsis tu ncua, kub hloov pauv loj, tsis tshua muaj zog txhua yam, thiab susceptibility rau ya raws

Cov txheej txheem

Tam sim no, muaj tsib hom ceramic thermal CCLs, xws li HTCC, LTCC, DBC, DPC, LAM, thiab lwm yam.

IC carrier board, Rigid-Flex board, HDI faus / dig muag ntawm lub rooj tsavxwm, ib leeg-sab pawg thawj coj saib, ob-sided board, ntau txheej board

Ceramic PCB

Daim ntawv thov teb ntawm cov khoom sib txawv:

Alumina Ceramic (Al2O3): Nws muaj cov rwb thaiv tsev zoo heev, qhov kub thiab txias stability, hardness, thiab txhua yam muaj zog kom haum rau cov khoom siv hluav taws xob muaj zog.

Aluminium Nitride Ceramics (AlN): Nrog cov thermal conductivity thiab zoo thermal stability, nws yog haum rau high-power electronics thiab LED teeb pom kev zoo teb.

Zirconia ceramics (ZrO2): nrog lub zog siab, siab hardness thiab hnav tsis kam, nws tsim nyog rau cov khoom siv hluav taws xob siab.

Daim ntawv thov teb ntawm cov txheej txheem sib txawv:

HTCC (High Temperature Co raug rho tawm haujlwm Ceramics): Haum rau kev siv kub thiab hluav taws xob, xws li hluav taws xob hluav taws xob, aerospace, satellite kev sib txuas lus, kev sib txuas lus kho qhov muag, khoom siv kho mob, automotive electronics, petrochemical thiab lwm yam lag luam. Cov khoom piv txwv muaj xws li high-power LEDs, lub zog amplifiers, inductors, sensors, lub zog cia capacitor, thiab lwm yam.

LTCC (Low Temperature Co fired Ceramics): Tsim nyog rau kev tsim cov khoom siv microwave xws li RF, microwave, kav hlau txais xov, sensor, lim, fais fab faib, thiab lwm yam. Tsis tas li ntawd, nws kuj tuaj yeem siv rau hauv kev kho mob, tsheb, aerospace, kev sib txuas lus, electronics thiab lwm yam kev lag luam. Cov khoom piv txwv muaj xws li microwave modules, kav hlau txais xov modules, siab sensors, roj sensors, acceleration sensors, microwave filters, hwj chim dividers, thiab lwm yam.

DBC (Direct Bond Copper): Tsim nyog rau cov cua kub dissipation ntawm high-power semiconductor li (xws li IGBT, MOSFET, GaN, SiC, thiab lwm yam) nrog zoo thermal conductivity thiab mechanical zog. Cov khoom piv txwv muaj xws li fais fab modules, fais fab electronics, hluav taws xob tsheb controllers, thiab lwm yam.

DPC (Direct Phaj Copper Multilayer Printed Circuit Board): feem ntau yog siv rau cov cua kub dissipation ntawm high-power LED teeb nrog cov yam ntxwv ntawm kev siv siab, siab thermal conductivity, thiab hluav taws xob ua haujlwm siab. Cov khoom piv txwv muaj xws li LED teeb, UV LEDs, COB LEDs, thiab lwm yam.

LAM (Laser Activation Metallization for Hybrid Ceramic Metal Laminate): tuaj yeem siv rau cov cua sov dissipation thiab kev ua tau zoo ntawm hluav taws xob hauv cov teeb pom kev siab LED, lub zog hluav taws xob, tsheb hluav taws xob, thiab lwm yam. Cov khoom piv txwv muaj xws li LED teeb, lub zog modules, hluav taws xob tsheb tsav tsheb, thiab lwm yam.

FR4 PCB

IC carrier boards, Rigid-Flex boards thiab HDI qhov muag tsis pom / faus ntawm cov laug cam yog feem ntau siv hom PCBs, uas yog siv rau hauv kev lag luam sib txawv thiab cov khoom raws li hauv qab no:

IC carrier board: Nws yog cov khoom siv hluav taws xob uas nquag siv, feem ntau yog siv rau kev kuaj nti thiab tsim khoom hauv cov khoom siv hluav taws xob. Cov kev siv feem ntau suav nrog kev tsim khoom semiconductor, kev tsim hluav taws xob, aerospace, tub rog, thiab lwm yam.

Rigid-Flex board: Nws yog cov khoom siv sib xyaw ua ke uas sib xyaw FPC nrog cov PCB nruj, nrog rau qhov zoo ntawm ob qho tib si hloov pauv thiab nruj Circuit Court boards. Cov ntawv thov muaj xws li cov neeg siv khoom siv hluav taws xob, khoom siv kho mob, khoom siv hluav taws xob tsheb, aerospace, thiab lwm yam.

HDI qhov muag tsis pom / muab faus ntawm lub rooj tsavxwm: Nws yog qhov sib txuas ntawm cov khoom siv hluav taws xob sib txuas nrog cov kab ntau dua thiab cov aperture me dua kom ua tiav cov ntim me me thiab kev ua haujlwm siab dua. Cov ntawv thov muaj xws li kev sib txuas lus ntawm tes, khoos phis tawj, khoom siv hluav taws xob, thiab lwm yam.