| Item | Rigidum PCB（HDI） | Flexibile PCB | Rigidum-flex PCB |
| Max Layer | 2-68L | 8L | 68L |
| Interiorem Stratum Min Vestigium / Space | 1.4/1.4mil | 2/2mil | 2/2mil |
| De Stratum Min Vestigium / Space | 1.4/1.4mil | 3/3mil | 3/3mil |
| Interior Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 6oz | 3oz | 6oz |
| Min Mechanica EXERCITATIO | 0.15mm/6mil | 0.15mm | 0.15mm |
| Min Laser EXERCITATIO | 0.05mm/3mil | 0.05mm | 0.05mm |
| Max aspectus ratio (Mechanical EXERCITATIO) | 20:1 | / | 20:1 |
| Max aspect ratio (laser EXERCITATIO) | 1, 1; | 1, 1; | 1, 1; |
| Interlayer Gratia diei et noctis | +/-0.254mm(1mil) | ±0.05mm | ±0.05mm |
| PTH Tolerantia | ±0.072mm | ±0.072mm | ±0.072mm |
| NPTH tolerantia | ±0.05mm | ±0.05mm | ±0.05mm |
| Tolerantia countersink | +0.15mm | ±0.15mm | ±0.15mm |
| Tabula Crassitudo | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Tabula Crassitudo Tolerantia (1.Omm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Tabula Crassitudo TOLERATIO(≥1.Omm) | ±8% | / | ±10% |
| Min Board Size | 10*10mm | 5*5mm | 10*10mm |
| Max Board Size | 1200mm*750mm | 500*1200mm | 500*500mm |
| Forma Gratia diei et noctis | +/-0.075mm(3mil) | ±0.05mm | ±0.1mm |
| mea BGA | 0.125mm(5mil) | 7mil | 7mil |
| Min SMT | 0.177*0.254mm(7*10mil) | 7* 10mil | 7* 10mil |
| Min Solder larva Clearance | 1.5mil | 2mil | 1.5mil |
| Min Solder Mask Dam | 3mil | 3mil | 3mil |
| Legend | Album, nigrum, rubrum, Yellow | Album, nigrum, rubrum, Yellow | Album, nigrum, rubrum, Yellow |
| Min Legend Latitudo / Altitudo | 4/23mil | 4/23mil | 4/23mil |
| Min tendentes Radius (Single Board) | / | 3-6 x Board Crassitudo | 3-7 x Flexbile Board Crassitudo |
| Min tendentes Radius (Double Parte Board) | / | 6-10 x Board Crassitudo | 6-11 x Flexbile Board Crassitudo |
| Min tendentes Radius (Multilayer Board) | / | 10-15 x Tabula Crassitudo | 10-16 x Flexbile Board Crassitudo |
| Min tendentes Radius (Dynamic tendentes) | / | 20-40 x Board Crassitudo | 20-40 Board Crassitudo |
| Cola Infula Latitudo | / | 1.5+0.5mm | 1.5+0.5mm |
| Arcum & Twist | 0.005 | / | 0.0005 |
| Impedimentum Tolerantia | Unius Ended: ±5Ω(≤50Ω)，±7%(＞50Ω) | Single-Edition: ±5Ω(≤50Ω), ±10%(＞50Ω) | Unius Ended: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Impedimentum Tolerantia | Differentialis: ±5Ω(≤50Ω)，±7%(＞50Ω) | Differentialis: ±5Ω(≤50Ω), ±10%(＞50Ω) | Differentialis: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Os vendit | Viridis,Nigrum,Blue,Red,Matt Viridis,Yellow,White,Purple | Green Solder larva / Niger PI / Yellow PI | Viridis,Nigrum,Blue,Red, Matt Green |
| Superficiem Conclusio | Eiectronicum aurum obsitum, ENIG, Obstructio auri dura, Digitus Aurum, Immersionem Argentum, ImmersionTin, HASL LF, OSP, ENEPIG, Obstructio auri mollis | Electronic lamina aurum, ENIG, aurum obsitum, digitus auri, immersio Argenti, immersio plumbi, OSP, ENEPIG, lamina mollis auri | Electronic lamina auri, ENIG, Obstructio auri dura, Digitus Aurum, Immersio Argenti, Immersio plumbi, HASL LF, OSP, ENEPIG, Obstructio auri mollis |
| Processus specialis | Buried/via caeca, sulcus gradus, cupressus, sepultus resistentiae/capacitas, pressus mixtus, RF, digitus auri, N+N compages, aeris densa, dorsum EXERCITATIO ，HDI(5+2N+5) | aurum finger、lamination、Conductive tenaces、Shielding film、metal dome | Buried/caeca via, sulcus gradus, oversized, sepultus resistentia/capacitas, pressus mixtus, RF, digitus auri, N+N compages, aeris densa, terebratio dorsi |
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