Rigid-flex Board
Magis efficax Provectus Technology & Perfect Solutio.
commoda Rigid-flex Board
Hodie, consilium in dies auget miniaturizationem, sumptus humilis et celeritas productorum alta, praesertim in mercatu mobili fabrica, quod plerumque electronicos ambitus densitatis electronici involvit. Tabula Rigid-flex utens optima electio erit pro machinis periphericis per IO connexis. Septem commoda maiora ex consilio requisita ad materias tabulas flexibiles integrandas et rigidas tabulas in processu fabricando, 2 materias subiectas cum prepreg iungentes, ac deinde nexum electricae deducentium per foramina vel caeca/sepultas vias infra assequendas interpositas :
3D conventus ad redigendum circuitus
Melius nexum fidem
Reducere numerum partium et partium
Melior est impedimentum constantiae
Potest designare maxime complexu positis structuram
Magis turpis aspectus deducendi consilium
Redigendum magnitudine
Rigidum-flexum tabula est quae rigiditatem et flexibilitatem coniungit, tam rigiditatem tabulae rigidae quam flexibilitatem tabulae flexibilis expediens.
Semi FPC
Facultatem Roadmap
| Item | Flex Rigid | Regal | Semi-flex |
| Figura |  |  |  |
| Flexibile Material | Polyimide | FR4 + Coverlay (Polyimide) | FR4 |
| Crassitudo flexibilis | 0.025~ 0.1mm (Exclude aeris) | 0.05~ 0.1mm (Exclude aeris) | Crassitudo mansit: 0.25+/‐0.05mm (Material dedicata: EM825(I)) |
| inflexio angulus | Max 180° | Max 180° | Max 180°(Flex layer≤2) Max 90°(Flex layer>2) |
| Flexuralis patientia;IPC‐TM‐650, Method 2.4.3. | | |
QUOD' | |
| Tendens Test; 1) Mandrel diam: 6.25mm | |||
| Applicationem | LENTO ad install & Dynamic (una parte) | Flex ut install | Flex ut install |
| Superficiem Conclusio | Typical Value | Supplier | |
| Voluntarius Department |  | 0.2~0.6um; | Enthone Shikoku chemica |
| CONVENIEO |  | Au:0.03~0.12um, Ni:2.5~5um | ATO tech/Chuang Zhi |
| ENIG selectivum |  | Au:0.03~0.12um, Ni:2.5~5um | ATO tech/Chuang Zhi |
| PRINCIPALIS |  | Au : 0.05~0.125um, Pd : 0.05~0.125um,Ni :5~10um | Chuang Zhi |
| Durum Aurum |  | Au:0.2~1.5um, Ni: min 2.5um | Payer |
| Mollis aurum |  | Au:0.15~0.5um, Ni: min 2.5um | EJA |
| baptisma Tin |  | Min: 1um | Enthone / ATO tech |
| immersio Argentea |  | 0.15~0.45um | Macdermid |
| HASL & Ne gratis HASL (OS) |  | 1~25um | Nihon Superior |
Au/Ni Type
● Aurum patella dividi potest in aurum tenue, et aurum crassum secundum crassitudinem. Fere aurum infra 4u»(0.41um) aurum tenue, et aurum supra 4u» aurum spissum dicitur. ENIG solum aurum facere, non crassum aurum potest. Solum lamina auri potest utrumque tenue et crassum aurum facere. Maximam crassitudinem auri pinguis in tabula flexibili super 40u esse potest". Aurum crassum maxime adhibetur in ambitibus operandis, cum vinculo vel indumento resistentiae requisitis.
● Aurum patella in aurum molle et durum genus dividi potest. Aurum molle vulgare est aurum purum, aurum autem durum est cobaltum in quo aurum. Eo ipso quod cobaltum additur duritia iacui auri valde 150HV auget ut obviam acti requisitis resistentiae.
| Materia Type | Properties | Supplier | |
| Rigidum Material | Normalis damnum | DK>4.2, DF>0.02 | NanYa / EMC / TUC / ITEQ / ShengYi / Isola / Doosan etc. |
| Medio Loss | DK>4.1, DF:0.015~0.02 | NanYa/EMC/TUC/ITEQ etc. | |
| Low Loss | DK:3.8~4.1, DF:0.008~0.015 | EMC / NanYa / TUC / Isola / Panasonic etc. | |
| Ipsum Maximum damnum | DK:3.0~3.8, DF:0.004~0.008 | EMC / Panasonic / Rogers / TUC / ISOLA / ITEQ / NanYa etc. | |
| Ultra Maximum damnum | DK | ROGERIUS / TUC/ITEQ/ PANASONICA / ISOLA etc. | |
| BT | Color：White / Black | MGC / Hitachi / NanYa / ShengYi etc. | |
| Aeris Foil | Standard | Roughness(RZ)=6.34um | NanYa, KB, LCY |
| RTF | Roughness(RZ)=3.08um | NanYa, KB, LCY | |
| VLP | Roughness(RZ)=2.11um | MITSUI, Circuitus Foil | |
| HVLP | Asperitas(RZ)=1.74um | MITSUI, Circuitus Foil | |
| Materia Type | Normal DK/DF | Minimum DK/DF | |||
| Properties | Supplier | Properties | Supplier | ||
| Flex Materia | FCCL (With ED & RA) | Normal Polyimide DK:3.0~3.3 DF:0.006~0.009 | Thinflex / Panasonic / Taiflex | Mutata Polyimide DK:2.8~3.0 DF:0.003~0.007 | Thinflex / Taiflex |
| Coverlay (Nigrum/Yellow) | Normal Tenaces DK:3.3~3.6 Df:0.01~0.018 | Taiflex / Dupont | Modified Adhesive DK:2.8~3.0 DF:0.003~0.006 | Taiflex / Arisawa | |
| Vinculum film (Crassitudo: um 15/25/40) | Normalis epoxy DK:3.6~4.0 DF:0.06 | Taiflex / Dupont | Modified epoxy DK:2.4~2.8 DF:0.003~0.005 | Taiflex / Arisawa | |
| S/M Ink | Persona vendit; Color: Viridis / Blue / Nigrum / Alba / Crocus / Red | Normalis epoxy DK:4.1 DF:0.031 | Taiyo / OTC / AMC | Modified epoxy DK:3.2 DF:0.014 | Taiyo |
| Legenda atramentum | Colo colui cultum: Black / White / Yellow Inkjet Color: Alba | AMC | |||
| Alia materia | IMS | Insulae Metallicae Substrates (cum Al vel Cu) | EMC / Ventec | ||
| Princeps Scelerisque Conductive | 1.0 / 1.6 / 2.2 (W/M*K) | ShengYi / Ventec | |||
| I | Folium argenteum (SF‐PC6000‐U1 / SF‐PC8600‐C) | Tatsuta | |||
Casio & High Frequency Material (flexibile)
| DK | Df* | Materia Type | |
| FCCL (Polyimide) | 3.0~3.3 | 0.006~0.009 | Panasonic R‐775 series, Thinflex A series, Thinflex W series, Taiflex 2up series |
| FCCL (Polyimide) | 2.8~3.0 | 0.003~0.007 | Thinflex LK series, Taiflex 2FPK seriei |
| FCCL (LCP) | 2.8~3.0 | 0.002 | Thinflex LC series, Panasonic R‐ 705T se, Taiflex 2CPK series |
| Coverlay | 3.3~3.6 | 0.01~0.018 | Dupont FR series; Taiflex FGA series; Taiflex FHB series; Taiflex FHK series |
| Coverlay | 2.8~3.0 | 0.003~0.006 | Arisawa C23 series; Taiflex FXU series |
| Vinculum Sheet | 3.6~4.0 | 0.06 | Taiflex BT series; Dupont FR series |
| Vinculum Sheet | 2.4~2.8 | 0.003~0.005 | Arisawa A23F seriem; Taiflex BHF seriem |
Back Drill Technology
● Vestigia Microstrip non habeant vias, ab vestigiorum parte explorandae sunt.
● Vestigium in secunda parte probandum ex parte secundario (In latere launch in parte debet).
● Consilium est ut stripline vestigia probentur ex quacunque parte per stipulam maxime reducantur.
● Optimi proventus pro stripline obtinebuntur adhibitis brevibus vias quae backdrilled.
Product Applicationem:Automotive radar sensorem
Product Details:
4 Stratum PCB cum materia hybrid (Hydrocarbon FR4 + Standard)
Stack up: 4L HDI / Asymmetric
Provocare:
High frequency material with Standard FR4 Lamination
Imperium altius terebro
Product Applicationem:Automotive radar sensorem
Product Details:
4 Stratum PCB cum materia hybrid (Hydrocarbon FR4 + Standard)
Stack up: 4L HDI / Asymmetric
Provocare:
High frequency material with Standard FR4 Lamination
Imperium altius terebro
Product Applicationem:
Basi statione
Product Details:
XXX Stratis (materiam homogeneam)
Stack up: High layer count / Symmetric
Provocare:
Registration pro singulis stratis
Princeps aspectus ratio PTH
Critica lamination parametri
Product Applicationem:
Memoria
Product Details:
Stack up: 16 Stratis Anylayer
IST Test: Condition:25‐190℃ Time:3 min, 190‐25℃ Time:2min, 1500 Cycles. Resistentia mutatio rate≤10%, Test methodus: IPC‐TM650‐2.6.26. Consequuntur: Pass.
Provocare:
Laminating plus quam VI temporibus
Laser vias accurationis
Product Applicationem:
Memoria
Product Details:
Stack up: Cavity
Materia: Standard FR4
Provocare:
Using De "cap technology in Rigidorum PCB"
Registration inter stratis
Minus exprimendum per gradus regio
Processus criticus convellens pro G/F
Product Applicationem:
Camera Module / Notebook
Product Details:
Stack up: Cavity
Materia: Standard FR4
Provocare:
Using De "cap technology in Rigidorum PCB"
Programma laseris criticae et parametri in processu De‐cap
Product Applicationem:
Lucernae Automotiva
Product Details:
Stack up: IMS / Heatsink
Materia: Metal + Glue/Prepreg + PCB
Provocare:
Aluminium basis et basis aeris
Scelerisque conductivity
FR4+ Glue/Prepreg + Al lamination
commoda:
Magni caloris dissipatio
Product Details:
Materia summa celeritate (Homogeneous)
Stack up: Nummus aeris Embedded / Symmetric
Provocare:
Accuratio nummi dimensionis
Cura laminationis ostium
Critica resinae fluxus
Product Applicationem:
Automotive / Industrial / Base Statio
Product Details:
Internum tabulatum basis aeris 6OZ
Stratum externum basis aeris 3OZ/6OZ Stack up:
6OZ pondus aeris in strato interno
Provocare:
6OZ lacuna aeris repleta cum epoxy
Non pereffluamus in lamination processus
Product Applicationem:
Smart phone / SD Card / SSD
Product Details:
Stack up: HDI / Anylayer
Materia: Standard FR4
Provocare:
Valde humilis profile / RTF Cu foil
Plating uniformitas
Princeps senatus arida film
LDI Patefacio (Laser Direct Image)
Product Applicationem:
Communicatio / SD Card / Optical Module
Product Details:
Stack up: HDI / Anylayer
Materia: Standard FR4
Provocare:
Nullum intervallum ad digiti marginem cum PCB in lamina auri processus
Speciali repugnant film
Product Applicationem:
Industriae
Product Details:
Stack up: Rigid‐Flex
Cum Eccobond ad Rigid‐Flex mutatio
Provocare:
Velocitatem critica movens profundumque ad hastile
Pressura aeris critica parametri