| zavatra | PCB henjana (HDI) | Flexible PCB | PCB henjana-Flex |
| Layer Max | 2-68L | 8L | 68L |
| Layer anatiny Min Trace/Space | 1.4/1.4mil | 2/2mil | 2/2mil |
| Layer Min Trace/Space | 1.4/1.4mil | 3/3mil | 3/3mil |
| Layer anatiny Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 6oz | 3oz | 6oz |
| Min Drilling mekanika | 0.15mm/6mil | 0,15 mm | 0,15 mm |
| Min Laser Drilling | 0.05mm/3mil | 0,05 mm | 0,05 mm |
| Max Aspect Ratio (Drilling Mechanical) | 20:1 | / | 20:1 |
| Max Aspect Ratio (Laser Drill) | 1:1 | 1:1 | 1:1 |
| Interlayer Alignment | +/-0,254mm(1mil) | ± 0.05mm | ± 0.05mm |
| PTH Tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
| Fandeferana NPTH | ± 0.05mm | ± 0.05mm | ± 0.05mm |
| Countersink Tolerance | +0.15mm | ± 0.15mm | ± 0.15mm |
| Haben'ny birao | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Fandeferana hatevin'ny birao ( |
± 0.1mm | ± 0.05mm | ± 0.1mm |
| Fandeferana hatevin'ny birao (≥1.Omm) | ±8% | / | ±10% |
| Haben'ny birao min | 10*10mm | 5*5mm | 10*10mm |
| Max haben'ny birao | 1200mm * 750mm | 500*1200mm | 500*500mm |
| Fandrindrana drafitra | +/-0,075mm(3mil) | ± 0.05mm | ± 0.1mm |
| Ny BGA | 0,125mm (5mil) | 7 mil | 7 mil |
| Min SMT | 0.177*0.254mm(7*10mil) | 7*10mil | 7*10mil |
| Famafana saron-tava Min | 1,5mil | 2mil | 1,5mil |
| Tohodranon'i Min Solder Mask | 3mil | 3mil | 3mil |
| Maribolana | Fotsy, Mainty, Mena, Mavo | Fotsy, Mainty, Mena, Mavo | Fotsy, Mainty, Mena, Mavo |
| Ambany/Haavo Min | 4/23mil | 4/23mil | 4/23mil |
| Radius Miondrika Min (Bola tokana) | / | 3-6 x Haben'ny birao | 3-7 x Haben'ny birao Flexbile |
| Radius miondrika min (birao roa sosona) | / | 6-10 x Haben'ny birao | 6-11 x Haben'ny birao Flexbile |
| Radius miondrika min (Board multilayer) | / | 10-15 x Haben'ny birao | 10-16 x Haben'ny birao Flexbile |
| Radius Miondrika Min (Fiondrika Dinamika) | / | 20-40 x Haben'ny birao | 20-40 × hatevin'ny birao |
| Sakan'ny Fillet | / | 1.5+0.5mm | 1.5+0.5mm |
| Bow & Twist | 0,005 | / | 0,0005 |
| Fandeferana impedance | Tokan-tena: ±5Ω(≤50Ω),±7%(>50Ω) | Tokan-tena: ±5Ω(≤50Ω),±10%(>50Ω) | Tokan-tena: ±5Ω(≤50Ω), ±10%(>50Ω) |
| Fandeferana impedance | Fahasamihafana: ± 5Ω (≤50Ω), ± 7% (> 50Ω) | Fahasamihafana: ± 5Ω (≤50Ω), ± 10% (> 50Ω) | Fahasamihafana: ± 5Ω (≤50Ω), ± 10% (> 50Ω) |
| Solder Mask | Maitso, Mainty, Manga, Mena, Maitso mavo, Mavo, Fotsy, Volomparasy | Saron-tava solder maitso / PI mainty / PI mavo | Maitso, Mainty, Manga, Mena, Maitso Matt |
| Surface vita | Fametahana volamena Eiectronic, ENIG, Fametahana volamena mafy, Rantsana volamena, Volafotsy asitrika, ImmersionTin, HASL LF, OSP, ENEPIG, Fametahana volamena malefaka | Fametahana volamena elektronika, ENIG, Fametahana volamena mafy, Rantsana volamena, Volafotsy asitrika, Vifotsy, OSP, ENEPIG, Fametahana volamena malefaka | Fametahana volamena elektronika, ENIG, Fametahana volamena mafy, Rantsana volamena, Volafotsy immersio, HASL LF, OSP, ENEPIG, Fametahana volamena malefaka |
| Dingana manokana | Nalevina / jamba tamin'ny, dingana groove, be loatra, nandevina fanoherana / fahaiza-manao, fanerena mifangaro, RF, rantsantanana volamena, rafitra N + N, varahina matevina, fandavahana lamosina，HDI(5+2N+5) | rantsantanana volamena, lamination, adhesive conductive, sarimihetsika fiarovana, dome metaly | Nalevina/jamba tamin'ny alalan'ny, step groove, be loatra, nalevina fanoherana/fahaizana, fanerena mifangaro, RF, rantsan-tànana volamena, rafitra N + N, varahina matevina, fandavahana lamosina |
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