Mtengo wa FPC

1.FPC—Flexible Printed Circuit, yodalirika kwambiri komanso yosinthika yosindikizidwa yopangidwa ndi kukokera pa zojambula zamkuwa pogwiritsa ntchito filimu ya poliyesitala kapena polyimide ngati gawo lapansi kuti lipange chozungulira.

2.Mawonekedwe a Zogulitsa: ① Kukula kwakung'ono ndi kulemera kopepuka : kukwaniritsa zosowa za kachulukidwe kakang'ono, kakang'ono, kopepuka, kuonda komanso kudalirika kwamayendedwe odalirika; ② Kusinthasintha kwakukulu : Kutha kusuntha ndikukula momasuka mu danga la 3D, kukwaniritsa msonkhano wophatikizika ndi waya.

Pulogalamu ya FPC:

kamera, kamera ya kanema, CD-ROM, DVD, hard drive, laputopu, telefoni, foni yam'manja, chosindikizira, makina a fax, TV, zida zamankhwala, zamagetsi zamagalimoto, zakuthambo ndi zida zankhondo.

Malinga ndi kuchuluka kwa zigawo zoyendetsera, zitha kugawidwa m'mbali imodzi, bolodi yokhala ndi mbali ziwiri ndi bolodi yamitundu yambiri.

Bolodi la mbali imodzi : kondakitala mbali imodzi yokha

Bolodi lam'mbali ziwiri : pali ma kondakitala awiri mbali zonse ziwiri, ndikukhazikitsa kulumikizana kwa magetsi pakati pa ma kondakita awiri okhala ndi dzenje (kudzera) ngati mlatho. Kupyolera mu dzenje ndi kabowo kakang'ono ka mkuwa komwe kamakhala pa khoma la dzenje lomwe lingathe kulumikizidwa ndi mabwalo kumbali zonse ziwiri.

Multilayer board : ili ndi magawo atatu kapena kupitilira apo, okhala ndi masanjidwe olondola.

Kupatula bolodi lokhala ndi mbali imodzi, kuchuluka kwa zigawo za board olimba nthawi zambiri kumakhala kofanana, monga zigawo 2, 4, 6, 8, makamaka chifukwa mawonekedwe osanjikizana osanjikizana ndi asymmetric ndipo amakonda kupotoza. Komano, flexible PCB ndi yosiyana monga palibe vuto warping, kotero 3-wosanjikiza, 5-wosanjikiza, etc. zambiri.

Chojambula chamkuwa chimagawidwa kukhala Electro-Deposited copper (ED Copper) ndi Rolled Annealed copper (RA Copper)

1 oz ≈ 35um

OZ kwenikweni ndi gawo lolemera, lofanana ndi 1/16 pounds, pafupifupi 28.35g.

M'makampani opanga ma boardboard, makulidwe a 1oz mkuwa wokhazikika mkati mwa phazi limodzi la wquare amatanthauzidwa kuti 1oz. Chifukwa chake nthawi zina makasitomala amafunsa 28.35g yamkuwa, tiyenera kuzindikira nthawi yomweyo kuti izi ndizofunikira pa 1oz yamkuwa.

Ntchito ya solder mask: ① kutchinjiriza pamwamba ② kuteteza dera ndi kupewa kuwonongeka kwa dera ③ kuteteza zinthu zakunja conductive kulephera mu dera ndi kuchititsa mabwalo aafupi.

Pali mitundu iwiri ya zida za solder mask: inki ndi chophimba

Inki yomwe imagwiritsidwa ntchito pogulitsira chigoba nthawi zambiri imakhala yowoneka bwino ndipo imatchedwa chithunzi chamadzimadzi, chofupikitsidwa ngati LPI. Nthawi zambiri zimapezeka zobiriwira, zakuda, zoyera, zofiira, zachikasu, zabuluu, ndi zina.

Coverlay, yemwe amapezeka muchikasu (ena amatchedwa amber), wakuda ndi woyera. Black ili ndi mdima wabwino ndipo yoyera imakhala ndi mawonekedwe apamwamba, omwe amatha kulowa m'malo mwa inki yoyera pama board osinthika a backlight.

Pankhani ya bolodi yosinthika, inki ndi coerlay zitha kugwiritsidwa ntchito ngati chigoba cha soler. Ndiye pali kusiyana kotani pakati pa ubwino ndi kuipa kwa ziwirizi? Chonde onani zomwe zili pansipa:

Ntchito yomaliza yomaliza ndikuletsa kutsekemera kwa mkuwa, kupereka zowotcherera kapena zomangira.

Nthawi zambiri pamakhala njira zingapo zomaliza pamwambazi monga pansipa: mafotokozedwe omaliza.

OSP: Organic solderability preservatives OSP: 0.2-0.5um

Kupaka malata a Ni/Au: 4-20um

ENIG: Electroless Nickel Immersion Gold ENIG: 0.05-0.1um

Kupaka Sn/Tin Kupaka golide: 0.1-1um

Kumiza Sn/Tin Kumiza Tin: 0.3-1.2um

Kumiza Ag Kumiza Ag: 0.07-0.2um.

Kuyerekeza mtengo : Plating Ni/Au(ENIG)> Kumiza Ag> Plating Sn/Tin (Kumiza Sn/Tin)> OSP.

Mosiyana ndi bolodi lolimba, bolodi losinthika silikhala lolimba komanso mphamvu zamakina ngati bolodi lolimba, kotero silingakhazikitsidwe bwino ndi zomangira kapena kuyika mipata yamakhadi. Nthawi zambiri, ndikofunikira kukonza pa chipangizocho ndi zomatira kumbali ziwiri kuti FPC isagwedezeke pambuyo pa msonkhano. Kuphatikiza apo, zomatira zambali ziwiri zitha kugwiritsidwanso ntchito kumangirira zolimba ku FPC.

DST (Double-Sided Tape), yomwe imadziwikanso kuti Pressure-Sensitive Adhesive (PSA), ndi zomatira za mbali ziwiri zomwe zimagwiritsidwa ntchito pa FPC.

Pressure Sensitive Adhesive imatha kugawidwa kukhala zomatira wamba, zomatira zotentha kwambiri, zomatira zomata komanso zomatira zamatenthedwe.

Zomatira wamba zikuphatikiza 3M467,3M468, zomatira zomwe zimaphatikizanso 3M9703,3M9713

Zomatira zotentha zotentha zimaphatikizapo 3M8805,3M9882

Zomatira zosagwirizana ndi kutentha kwambiri zimatanthawuza zomatira zomwe zimatha kupirira kutentha kwa SMT kwakanthawi kochepa, zomwe zimagwiritsidwa ntchito pama board omwe amafunikira kuyika kwa SMT. Zomatira zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo 3M9460,3M9077,3M9079,TESA8853, etc.

Pali mitundu ingapo ya stiffener monga pansipa:

Zitsulo Zosapanga dzimbiri (SS) : Makasitomala ena amawonetsa SUS pazojambula zawo, koma zenizeni, izi ndizitsulo zolimba. SUS ndi mtundu womwe umagwiritsidwa ntchito kwambiri wazitsulo.

AL: Aluminium

FR4

Polyimide

Polyester

Electro-Magnetic Interference (EMI) ndi chinthu chodziwika bwino, makamaka m'mabwalo othamanga kwambiri, kuti zitsimikizire kukhulupirika kwa chizindikiro popanda kupotoza, kutetezedwa kwamagetsi ndikofunikira.Zida zomwe zimagwiritsidwa ntchito poteteza maginito a FPC makamaka zimaphatikizapo inki ya siliva ndi filimu ya inki ya siliva. .

Inki ya siliva ndi chinthu chofanana ndi phala chokhala ndi tinthu tachitsulo tasiliva ndi utomoni. Itha kusindikizidwa pa FPC ngati inki yotchinga silika mu bolodi lolimba, kenako yophikidwa ndi kulimba. Pofuna kupewa oxidation ya siliva mumlengalenga, wosanjikiza wa inki kapena filimu yoteteza nthawi zambiri imasindikizidwa pa inki ya siliva kuti itetezedwe.

Zomwe zimagwiritsidwa ntchito nthawi zambiri zimagawidwa kukhala nkhungu ya mpeni ndi chitsulo. Kulondola kwa nkhungu ya mpeni ndi otsika, ndikulolera kopanga pafupifupi +/-0.3mm. Kulondola kwa nkhungu zachitsulo ndikwapamwamba, ndi nkhungu wamba wachitsulo pafupifupi +/-0.1mm ndi nkhungu yolondola yachitsulo mpaka +/-0.05mm. Chifukwa chake mtengo wa nkhungu zachitsulo ndi kangapo kapena kambirimbiri kuposa wa nkhungu za mpeni.

Zoumba za mpeni zimadziwikanso kuti zida zofewa, komanso zitsulo zomwe zimadziwikanso kuti zida zolimba.

Gwiritsani ntchito chida chowunikira chamagetsi kuti muwonetsetse kuti pali zolakwika zazikulu monga zotseguka, zazifupi, ndi zina zambiri pamagawo azogulitsa. Mugawo la sampuli, kuchuluka kwake kumakhala kochepa, kuti apulumutse mtengo wotsegulira chimango choyesera, kafukufuku wowuluka amagwiritsidwa ntchito poyesa. Komabe, kuyezetsa ma probe owuluka ndizovuta ndipo kumatenga nthawi yayitali kupangitsa kuti ntchito ikhale yochepa. Chifukwa chake, kuyesa kumachitika pogwiritsa ntchito chimango choyesera (chikhazikitso, jig) panthawi yopanga misa.

Zowonongeka zomwe zingapezeke pakuwunika magetsi ndi izi: chinthu; tsegulani; mwachidule.

Chenjezo liyenera kuperekedwa pakuwonongeka kwa zolakwika pakuwunika kwamagetsi: zikanda pazigawo zomaliza zomwe zimayambitsidwa ndi ma probe oyendera magetsi.

Yendetsani mwatsatanetsatane zinthu zomwe zamalizidwa molingana ndi miyezo yoyendera

Pali njira zingapo zowunikira molingana ndi zofunikira zosiyanasiyana zazinthu zomwe zili pansipa:

① kuyang'ana pazithunzi

② kuyang'ana kwa microscopic (osachepera 10X)

Yang'anani makamaka mawonekedwe, kuphatikiza zokopa, mano, makwinya, makutidwe ndi okosijeni, matuza, kusakhazikika kwa chigoba cha solder, kubowola molakwika, mipata yozungulira, mkuwa wotsalira, zinthu zakunja, ndi zina zambiri.