Kusiyana pakati pa Ceramic PCBs ndi Traditional FR4 PCBs
Tisanakambirane nkhaniyi, choyamba timvetsetse kuti ma PCB a ceramic ndi chiyani ma FR4 PCBs.
Ceramic Circuit Board imatanthawuza mtundu wa bolodi wozungulira wopangidwa kutengera zida zadothi, zomwe zimadziwikanso kuti Ceramic PCB (bolodi losindikizidwa). Mosiyana ndi magalasi omwe amapangidwa ndi pulasitiki (FR-4), matabwa a ceramic amagwiritsa ntchito magawo a ceramic, omwe angapereke kutentha kwapamwamba, mphamvu zamakina, mphamvu zama dielectric, komanso moyo wautali. Ma PCB a Ceramic amagwiritsidwa ntchito kwambiri potengera kutentha kwambiri, ma frequency apamwamba, komanso mabwalo amphamvu kwambiri, monga magetsi a LED, ma amplifiers amagetsi, ma semiconductor lasers, ma transceivers a RF, masensa, ndi zida za microwave.
Circuit Board amatanthauza zinthu zoyambira pamagetsi, zomwe zimadziwikanso kuti PCB kapena bolodi yosindikizidwa. Ndi chonyamulira chosonkhanitsira zida zamagetsi posindikiza zitsulo zamagawo pazigawo zopanda ma conductive, kenako ndikupanga njira zoyendetsera njira monga kuwononga mankhwala, mkuwa wa electrolytic, ndi kubowola.
Zotsatirazi ndikuyerekeza pakati pa ceramic CCL ndi FR4 CCL, kuphatikizapo kusiyana kwawo, ubwino ndi kuipa.
| Makhalidwe | Ceramic CCL | Mtengo wa FR4 CCL |
| Zida Zakuthupi | Ceramic | Galasi CHIKWANGWANI cholimbitsa epoxy resin |
| Conductivity | N | NDI |
| Thermal Conductivity (W/mK) | 10-210 | 0.25-0.35 |
| Kuchuluka kwa Makulidwe | 0.1-3 mm | 0.1-5 mm |
| Kuvuta Kukonza | Wapamwamba | Zochepa |
| Mtengo Wopanga | Wapamwamba | Zochepa |
| Ubwino wake | Kukhazikika kwabwino kwa kutentha kwambiri, magwiridwe antchito abwino a dielectric, mphamvu zamakina apamwamba, komanso moyo wautali wautumiki | Zida zodziwika bwino, zotsika mtengo zopangira, kukonza kosavuta, koyenera kugwiritsa ntchito pafupipafupi |
| Zoipa | Mtengo wapamwamba wopanga, kukonza kovuta, koyenera kugwiritsa ntchito pafupipafupi kwambiri kapena kugwiritsa ntchito mphamvu zambiri | Kusakhazikika kwa dielectric, kusintha kwakukulu kwa kutentha, mphamvu zochepa zamakina, komanso kutengeka ndi chinyezi |
| Njira | Pakali pano, pali mitundu isanu wamba wa ceramic matenthedwe CCLs, kuphatikizapo HTCC, LTCC, DBC, DPC, LAM, etc. | IC carrier board, Rigid-Flex board, HDI yokwiriridwa/khungu kudzera pa bolodi, bolodi lokhala ndi mbali imodzi, bolodi lokhala ndi mbali ziwiri, bolodi lamitundu yambiri |
Ceramic PCB
Magawo ogwiritsira ntchito zinthu zosiyanasiyana:
Alumina Ceramic (Al2O3): Ili ndi zotchingira zabwino kwambiri, kukhazikika kwa kutentha kwambiri, kuuma, ndi mphamvu zamakina kuti ikhale yoyenera pazida zamagetsi zamagetsi.
Aluminium Nitride Ceramics (AlN): Yokhala ndi matenthedwe apamwamba kwambiri komanso kukhazikika kwamafuta abwino, ndiyoyenera pazida zamagetsi zamphamvu kwambiri komanso magawo owunikira a LED.
Zirconia ceramics (ZrO2): zokhala ndi mphamvu zambiri, zolimba kwambiri komanso kukana kuvala, ndizoyenera zida zamagetsi zamagetsi.
Magawo ogwiritsira ntchito njira zosiyanasiyana:
HTCC (High Temperature Co fired Ceramics): Yoyenera kugwiritsa ntchito kutentha kwambiri komanso mphamvu zambiri, monga zamagetsi zamagetsi, zakuthambo, satellite communication, optical communication, zida zamankhwala, zamagetsi zamagalimoto, petrochemical ndi mafakitale ena. Zitsanzo zazinthu zimaphatikizapo ma LED amphamvu kwambiri, amplifiers mphamvu, inductors, masensa, ma capacitor osungira mphamvu, ndi zina.
LTCC (Low Temperature Co fired Ceramics): Yoyenera kupanga zida za microwave monga RF, microwave, antenna, sensa, fyuluta, chogawa mphamvu, etc. Kuphatikiza apo, ingagwiritsidwe ntchito pachipatala, magalimoto, ndege, kulankhulana, zamagetsi ndi zina. Zitsanzo zazinthu zikuphatikiza ma module a microwave, ma antenna modules, sensor sensors, ma sensor agesi, masensa mathamangitsidwe, zosefera za microwave, zogawa mphamvu, ndi zina zambiri.
DBC (Direct Bond Copper): Yoyenera kutaya kutentha kwa zida zamphamvu za semiconductor (monga IGBT, MOSFET, GaN, SiC, etc.) zokhala ndi matenthedwe abwino kwambiri komanso mphamvu zamakina. Zitsanzo zazinthu zimaphatikizapo ma module amphamvu, zamagetsi zamagetsi, owongolera magalimoto amagetsi, ndi zina.
DPC (Direct Plate Copper Multilayer Printed Circuit Board): imagwiritsidwa ntchito makamaka pakuyatsa kutentha kwa magetsi amphamvu kwambiri a LED okhala ndi mawonekedwe amphamvu kwambiri, matenthedwe apamwamba, komanso magwiridwe antchito amagetsi apamwamba. Zitsanzo zazinthu zikuphatikiza magetsi a LED, ma LED a UV, ma COB LED, ndi zina.
LAM (Laser Activation Metallization for Hybrid Ceramic Metal Laminate): ingagwiritsidwe ntchito pochotsa kutentha ndi kukhathamiritsa kwamagetsi pamagetsi amphamvu kwambiri a LED, ma modules amphamvu, magalimoto amagetsi, ndi zina. Zitsanzo zazinthu zikuphatikiza magetsi a LED, ma module amagetsi, madalaivala agalimoto yamagetsi, ndi zina zambiri.
FR4 PCB
IC carrier boards, Rigid-Flex board ndi HDI akhungu/okwiriridwa kudzera m'mabokosi amagwiritsidwa ntchito mitundu ya PCBs, yomwe imagwiritsidwa ntchito m'mafakitale ndi zinthu zosiyanasiyana motere:
IC carrier board: Ndi bolodi yosindikizidwa yomwe imagwiritsidwa ntchito kwambiri poyesa chip ndi kupanga pazida zamagetsi. Ntchito zodziwika bwino zimaphatikizapo kupanga semiconductor, kupanga zamagetsi, zakuthambo, zankhondo, ndi zina.
Rigid-Flex board: Ndi gulu lazinthu zophatikizika lomwe limaphatikiza FPC ndi PCB yolimba, yokhala ndi zabwino zonse zama board osinthika komanso okhwima. Zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo zamagetsi zamagetsi, zida zamankhwala, zamagetsi zamagalimoto, zowulutsira ndege, ndi zina.
HDI osawona / kukwiriridwa kudzera pa bolodi: Ndi bolodi yolumikizira yotalikirana kwambiri yosindikizidwa yokhala ndi mizere yayikulu komanso kabowo kakang'ono kuti mukwaniritse zolongedza zazing'ono komanso magwiridwe antchito apamwamba. Ntchito zodziwika bwino zimaphatikizapo kulumikizana ndi mafoni, makompyuta, zamagetsi zamagetsi, ndi zina.