PCB Surface Finish
| Pamwamba Pamwamba | Mtengo Wodziwika | Wopereka |
| Dipatimenti Yozimitsa Moto Wodzipereka | 0.3 ~ 0.55um, 0,25 ~ 0.35um | Enthone |
| Shikoku Chemical | ||
| VOMEREZANI | Kapena : 0.03 ~ 0.12um, Ni : 2.5 ~ 5um | ATO tech/Chuang Zhi |
| Sankhani ENIG | Kapena : 0.03 ~ 0.12um, Ni : 2.5 ~ 5um | ATO tech/Chuang Zhi |
| PRINCIPAL | Au: 0.05 ~ 0.125um, Pd: 0.05 ~ 0.3um, | Chuang Zhi |
| Mu: 3-10um | ||
| Golide Wolimba | Au : 0.127 ~ 1.5um , Ni : min 2.5um | Wolipira/EEJA |
| Golide Wofewa | Au : 0.127~0.5um , Ni : min 2.5um | EJA |
| Kumiza Tin | mph: 1m | Enthone / ATO tech |
| Kumiza Siliva | 0.127 ~ 0.45um | Macdermid |
| Kutsogolera kwaulere HASL | 1 ~ 25m | Nihon Superior |
Chifukwa chakuti mkuwa ulipo mu mawonekedwe a oxides mu mlengalenga, izo kwambiri zimakhudza solderability ndi magetsi ntchito PCBs. Choncho, m'pofunika kuchita pamwamba mapeto a PCBs. Ngati pamwamba pa PCBs sanamalizidwe, n'zosavuta kuyambitsa mavuto pafupifupi soldering, ndipo mu milandu kwambiri, ziyangoyango solder ndi zigawo zikuluzikulu sangathe soldered. Kumaliza kwa PCB kumatanthawuza njira yopangira kusanjikiza pamwamba pa PCB. Cholinga cha kumaliza kwa PCB ndikuwonetsetsa kuti PCB ili ndi solderability yabwino kapena ntchito yamagetsi. Pali mitundu yambiri yomaliza ya ma PCB.
Hot Air Solder Leveling (HASL)
Ndi njira yogwiritsira ntchito solder yosungunuka ya malata pamwamba pa PCB, kupukuta (kuiwombera) ndi mpweya wotentha woponderezedwa ndikupanga nsanjika ya zokutira zomwe zimagonjetsedwa ndi okosijeni yamkuwa komanso zimapereka kusungunuka kwabwino. Panthawi imeneyi, m'pofunika kuti adziwe zotsatirazi zofunika magawo : soldering kutentha, otentha mpweya mpeni kutentha, otentha mpweya mpeni kuthamanga, kumiza nthawi, kukweza liwiro, etc.
Ubwino wa HASL
1. Nthawi yotalikirapo yosungirako.
2. Kunyowetsa bwino kwa pedi ndi kuphimba kwa mkuwa.
3. Mtundu wogwiritsidwa ntchito kwambiri wa lead waulere (wotsatira wa RoHS).
4. Ukadaulo wokhwima, mtengo wotsika.
5. Oyenera kwambiri kuyang'anitsitsa maso ndi kuyesa magetsi.
Kufooka kwa HASL
1. Osayenera kulumikiza waya.
2. Chifukwa cha meniscus yachilengedwe ya solder yosungunuka, flatness ndi osauka.
3. Osagwiritsa ntchito ma switch a capacitive touch.
4. Kwa mapanelo owonda kwambiri, HASL sangakhale oyenera. Kutentha kwakukulu kwa kusamba kungapangitse gulu la dera kuti ligwedezeke.
2. Dipatimenti Yozimitsa Moto Wodzipereka
OSP ndiye chidule cha Organic Solderability Preservative, chomwe chimadziwikanso kuti pa solder. Mwachidule, OSP ndi kuti sprayed padziko mkuwa solder ziyangoyango kupereka filimu zoteteza zopangidwa organic mankhwala. Kanemayu ayenera kukhala ndi katundu monga kukana makutidwe ndi okosijeni, kukana kutenthedwa kwa kutentha ndi kukana chinyezi kuteteza mkuwa kuti usachite dzimbiri (makutidwe ndi okosijeni kapena kuphulika, etc.) m'malo abwinobwino. Komabe, muzitsulo zotsatizana ndi kutentha kwapamwamba, filimu yotetezerayi iyenera kuchotsedwa mosavuta ndi kutuluka mwamsanga, kuti malo owonekera bwino amkuwa azitha kugwirizanitsa nthawi yomweyo ndi solder wosungunuka kuti apange mgwirizano wamphamvu wa solder mu nthawi yochepa kwambiri. Mwa kuyankhula kwina, ntchito ya OSP ndikuchita ngati chotchinga pakati pa mkuwa ndi mpweya.
Ubwino wa OSP
1. Zosavuta komanso zotsika mtengo; Kumapeto kwa pamwamba ndikupaka utoto wopopera.
2. Pamwamba pa solder pad ndi yosalala kwambiri, yokhala ndi flatness yofanana ndi ENIG.
3. Zopanda zotsogola (zogwirizana ndi miyezo ya RoHS) komanso ndizogwirizana ndi chilengedwe.
4. Zokonzanso.
Kufooka kwa OSP
1. Kusanyowa bwino.
2. Mawonekedwe omveka bwino komanso owonda a filimuyo amatanthauza kuti n'zovuta kuyeza ubwino mwa kuyang'anitsitsa ndi kuyang'ana pa intaneti.
3. Moyo waufupi wautumiki, zofunikira zazikulu zosungirako ndi kusamalira.
4. Kusatetezedwa bwino kwakutidwa ndi mabowo.
Kumiza Siliva
Siliva ali ndi mankhwala okhazikika. The PCB kukonzedwa ndi luso siliva kumizidwa akadali kupereka zabwino magetsi ntchito ngakhale pamene poyera kutentha, chinyezi ndi zoipitsidwa malo, komanso kusunga solderability wabwino ngakhale kutaya kuwala kwake. Kumizidwa Siliva ndikusintha komwe siliva wosanjikiza amayikidwa mwachindunji pamkuwa. Nthawi zina, siliva womiza amaphatikizidwa ndi zokutira za OSP kuti siliva asachite ndi sulfide m'chilengedwe.
Ubwino Womiza Siliva
1. High solderability.
2. Kukhazikika bwino kwa pamwamba.
3. Mtengo wotsika komanso kutsogolera kwaulere (zogwirizana ndi miyezo ya RoHS).
4. Yogwirizana ndi Al wire kugwirizana.
Kufooka kwa Siliva Womiza
1. Zofunika zosungirako zapamwamba komanso zosavuta kuipitsidwa.
2. Short msonkhano zenera nthawi mutatha kutulutsa mu phukusi.
3. Zovuta kuyesa magetsi.
Kumiza Tin
Popeza solder yonse ndi malata, wosanjikiza wa malata amatha kufanana ndi mtundu uliwonse wa solder. Pambuyo powonjezera zowonjezera zowonjezera pazitsulo zomizidwa ndi malata, mawonekedwe a malata amatulutsa mawonekedwe a granular, kuthana ndi mavuto omwe amadza chifukwa cha ndevu za malata ndi kusamuka kwa malata, komanso kukhala ndi kukhazikika kwabwino kwa kutentha ndi kusungunuka.
Njira ya Immersion Tin imatha kupanga zitsulo zamkuwa zamkuwa zamkuwa kuti zipangitse malata omiza kukhala osungunuka bwino popanda kuphwanyidwa kulikonse kapena kufalikira kwapakati.
Ubwino Womiza Tin
1. Yogwira ku mizere yopingasa yopanga.
2. Imagwiritsidwa ntchito pokonza mawaya abwino komanso kutsekemera kopanda lead, makamaka kumagwiritsidwa ntchito pakupanga crimping.
3. Kusalala kwabwino kwambiri, kogwira ntchito ku SMT.
Kufooka kwa Tin Kumiza
1. Kufunika kosungirako kwakukulu, kungapangitse kuti zala zisinthe mtundu.
2. Ndevu za malata zingayambitse mabwalo afupiafupi komanso zovuta zolumikizira mafupa, potero zimachepetsa nthawi ya alumali.
3. Zovuta kuyesa magetsi.
4. Njirayi imaphatikizapo ma carcinogens.
VOMEREZANI
ENIG (Electroless Nickel Immersion Gold) ndi chotchingira chomwe chimagwiritsidwa ntchito kwambiri pamtunda wopangidwa ndi zigawo ziwiri zachitsulo, pomwe faifi tambala amayikidwa mwachindunji pa mkuwa ndiyeno maatomu agolide amakutidwa pamkuwa potengera kusamuka. Makulidwe a nickel wamkati wosanjikiza nthawi zambiri amakhala 3-6um, ndipo makulidwe akunja kwa golide nthawi zambiri amakhala 0.05-0.1um. Nickel imapanga chotchinga chotchinga pakati pa solder ndi mkuwa. Ntchito ya golidi ndikuletsa nickel oxidation panthawi yosungidwa, potero kukulitsa moyo wa alumali, koma kumizidwa kwa golide kungathenso kutulutsa bwino kwambiri pamwamba.
Mayendedwe a ENIG ndi: kuyeretsa-->etching-->chothandizira-->mankhwala a nickel plating-->gold deposition-->kutsuka zotsalira
Ubwino wa ENIG
1. Yoyenera kuwotchera wopanda lead (RoHS compliant).
2. Kusalala kwapamwamba kwambiri.
3. Utali wa alumali moyo ndi cholimba pamwamba.
4. Oyenera Al waya kugwirizana.
Kufooka kwa ENIG
1. Zokwera mtengo chifukwa chogwiritsa ntchito golide.
2. Njira yovuta, yovuta kulamulira.
3. Easy kupanga wakuda PAD chodabwitsa.
Electrolytic Nickel/Golide (golide wolimba / golide wofewa)
Golide wa nickel Electrolytic amagawidwa kukhala "golide wolimba" ndi "golide wofewa". Golide wolimba amakhala ndi chiyero chochepa ndipo amagwiritsidwa ntchito kwambiri mu zala zagolide (zolumikizira m'mphepete mwa PCB), zolumikizira za PCB kapena madera ena osamva kuvala. Kukhuthala kwa golidi kumatha kusiyanasiyana malinga ndi zofunikira. Golide wofewa ali ndi chiyero chapamwamba ndipo amagwiritsidwa ntchito kwambiri polumikiza mawaya.
Ubwino wa Electrolytic Nickel/Golide
1. Utali wa alumali moyo.
2. Oyenera kukhudzana lophimba ndi waya kugwirizana.
3. Golide wolimba ndi woyenera kuyesa magetsi.
4. Zopanda zotsogola (zogwirizana ndi RoHS)
Kufooka kwa Electrolytic Nickel/Golide
1. Kumaliza kokwera mtengo kwambiri.
2. Electroplating golide zala amafuna mawaya owonjezera conductive.
3. Akadakhala kuti golide alibe solderability. Chifukwa cha makulidwe a golide, zigawo zokulirapo zimakhala zovuta kuzigulitsa.
PRINCIPAL
Electroless Nickel Electroless Palladium Immersion Gold kapena ENEPIG ikugwiritsidwa ntchito kwambiri pakumaliza kwa PCB. Poyerekeza ndi ENIG, ENEPIG imawonjezera gawo lina la palladium pakati pa faifi tambala ndi golide kuti ateteze wosanjikiza wa faifi tambala ku dzimbiri komanso kupewa kupanga mapepala akuda omwe amapangidwa mosavuta pomaliza ENIG pamwamba. Makulidwe a faifi tambala ndi pafupifupi 3-6um, makulidwe a palladium ndi pafupifupi 0.1-0.5um ndi makulidwe a golide ndi 0.02-0.1um. Ngakhale makulidwe a golide ndi ochepa kuposa ENIG, ENEPIG ndiyokwera mtengo. Komabe, kutsika kwaposachedwa kwamitengo ya palladium kwapangitsa kuti mtengo wa ENEPIG ukhale wotsika mtengo.
Ubwino wa ENEPIG
1. Ili ndi zabwino zonse za ENIG, palibe chodabwitsa cha pad.
2. Oyenera kwambiri kulumikiza mawaya kuposa ENIG.
3. Palibe chiopsezo cha dzimbiri.
4. Kusunga nthawi yayitali, kutsogoza kwaulere (RoHS imagwirizana)
Kufooka kwa ENEPIG
1. Njira yovuta, yovuta kulamulira.
2. Mtengo wapamwamba.
3. Ndi njira yatsopano komanso yosakhwima.