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DPC Ceramic Substrate: uburyo bwiza bwo gupakira ibinyabiziga bya LiDAR

2024-05-28 17:23:00

Imikorere ya LiDAR (Light Detection and Ranging) nugusohora ibimenyetso bya lazeri ya infragre no kugereranya ibimenyetso byagaragaye nyuma yo guhura nimbogamizi nibimenyetso byasohotse, kugirango tubone amakuru nkumwanya, intera, icyerekezo, umuvuduko, imyifatire, nuburyo bwa intego. Iri koranabuhanga rishobora kugera ku kwirinda inzitizi cyangwa kugendana ubwigenge. Nka sensor yo mu rwego rwo hejuru, LiDAR ifatwa nkurufunguzo rwo kugera ku rwego rwo hejuru rwo gutwara ibinyabiziga byigenga, kandi akamaro kayo karagenda bigaragara.


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Inkomoko yumucyo ya Laser igaragara mubintu byingenzi bigize ibinyabiziga LiDAR. Kugeza ubu, VCSEL (vertical cavity surface isohora laser) isoko yumucyo yabaye ihitamo ryambere rya Hybrid ikomeye-LiDAR na flash LiDAR mumodoka kubera igiciro cyayo gito cyo gukora, kwizerwa cyane, impande zinyuranye, no guhuza 2D byoroshye. Chip ya VCSEL irashobora kugera ku ntera ndende yo gutahura, kumenya neza ukuri, no kubahiriza amahame akomeye y’umutekano w'amaso muri moteri ya Hybrid ikomeye-leta LiDAR. Mubyongeyeho, bashoboza Flash LiDAR kugera kubintu byoroshye kandi byagutse, kandi bifite inyungu zingenzi.

Nyamara, imikorere ya foto yamashanyarazi ya VCSEL ni 30-60% gusa, ibyo bikaba bitera ingorane zo gukwirakwiza ubushyuhe no gutandukanya amashyanyarazi. Mubyongeyeho, VCSEL ifite ingufu nyinshi cyane, irenga 1.000W / mm2, bityo bisaba gupakira vacuum. Ibi bisaba substrate kugirango ikore cavity ya 3D hamwe na lens kugirango ishyirwe hejuru ya chip. Kubwibyo, kugera ku gukwirakwiza neza ubushyuhe, gutandukanya amashyanyarazi, no guhuza ibipimo byo kwagura ubushyuhe ni ibintu byingenzi bitekerezwaho muguhitamo ibikoresho bya VCSEL.

Ceramic substrates yahindutse ibikoresho byiza byo gupakira ibikoresho bya LiDAR yimodoka.

DPC (Directeur Copper Plating) ceramic substrate ifite ubushyuhe bwumuriro mwinshi, izirinda cyane, izunguruka ryumuzunguruko mwinshi, hejuru yubuso buringaniye, hamwe na coefficente yo kwagura ubushyuhe ihuye na chip. Batanga kandi verticale ihuza guhuza ibisabwa bya VCSEL.

1. Gukwirakwiza ubushyuhe buhebuje

DPC ceramic substrate ifite verticale ihuza imiyoboro, ikora imiyoboro yigenga yimbere. Bitewe nuko ububumbyi ari insulator hamwe nuyobora amashyuza, barashobora kugera kubitandukanya nubushyuhe kandi bagakemura neza ikibazo cyo gukwirakwiza ubushyuhe bwa chip ya VCSEL.

2. Kwizerwa cyane

Ubucucike bw'amashanyarazi ya VCSEL buri hejuru cyane, kandi kudahuza kwaguka k'ubushyuhe hagati ya chip na substrate birashobora gukurura ibibazo by'ingutu. Coefficient yo kwagura ubushyuhe bwa ceramic substrates irahuza cyane na VCSEL. Byongeye kandi, DPC ceramic substrate irashobora guhuza ibyuma byububiko hamwe nubutaka bwa ceramic kugirango bibe umwobo ufunze, ufite imiterere yegeranye, nta ntera ihuza intera, hamwe n’umuyaga mwinshi.

3. Guhuza guhagaritse

Gupakira VCSEL bisaba kwishyiriraho lens hejuru ya chip, kubwibyo hagomba gushyirwaho akavuyo ka 3D muri substrate. DPC ceramic substrates ifite ibyiza byo guhuza vertical hamwe nubwizerwe buhanitse, bikwiranye na vertical eutectic guhuza.

Mu rwego rwo guteza imbere ibinyabiziga bifite ubwenge, ibikoresho byubutaka bigira uruhare runini mugutezimbere ubwenge bwimodoka nshya zingufu. Nka shingiro ryikoranabuhanga ryose, guhanga udushya mu ikoranabuhanga ryibikoresho ni ngombwa mu gushyigikira iterambere ry’inganda zose.