Le Eseesega i le va o Ceramic PCBs ma masani FR4 PCBs
Aʻo leʻi talanoaina lenei mataupu, seʻi o tatou malamalama muamua po o le a le PCB ceramic ma le mea FR4 PCBs.
Ceramic Circuit Board o lo'o fa'atatau i se ituaiga o laupapa fa'asalalau e gaosia e fa'atatau i mea fa'amea, e ta'ua fo'i o le Ceramic PCB (lolomi laupapa fa'asalalau). E le pei o mea faʻapipiʻi faʻapipiʻi faʻamalosi faʻamaʻi tioata (FR-4), o laupapa faʻasalalau sima e faʻaogaina mea faʻapipiʻi sima, lea e mafai ona maua ai le maualuga o le vevela, sili atu le malosi faʻainisinia, sili atu mea dielectric, ma umi le ola. Ceramic PCBs e masani ona faʻaaogaina i le maualuga o le vevela, maualuga-televave, ma le maualuga o le eletise, e pei o moli LED, eletise eletise, laser semiconductor, transceivers RF, masini, ma masini microwave.
O le Komiti Fa'atonu e fa'atatau i se mea fa'avae mo vaega fa'aeletoroni, e ta'ua fo'i o se PCB po'o se laupapa fa'asalalau lolomi. O se va'a mo le fa'apipi'iina o mea fa'aeletoroni e ala i le lolomiina o fa'asologa o ta'amilosaga u'amea i luga o mea e le fa'aaogaina, ona fa'atupuina ai lea o ala fa'ata'ita'i e ala i fa'agasologa e pei o vaila'au fa'ama'i, kopa eletise eletise, ma le viliina.
O loʻo taua i lalo se faʻatusatusaga i le va o le CCL ceramic ma le FR4 CCL, e aofia ai o latou eseesega, lelei ma le le lelei.
| Uiga | Ceramic CCL | FR4 CCL |
| Vaega Mea | Ceramic | Epoxy resin fa'amalosia alava tioata |
| Conductivity | N | MA |
| Fa'avevela vevela(W/mK) | 10-210 | 0.25-0.35 |
| Avanoa o Mafiafia | 0.1-3mm | 0.1-5mm |
| Faigata Fai | Maualuga | Maulalo |
| Tau o le gaosiga | Maualuga | Maulalo |
| Tulaga lelei | Lelei maualuga-maualuga mautu, lelei dielectric faatinoga, maualuga le malosi o masini, ma le umi o le auaunaga | Mea masani, tau gaosiga maualalo, faʻaogaina faigofie, talafeagai mo faʻaoga maualalo |
| Fa'aletonu | O le tau maualuga o le gaosiga, faʻalavelave faigata, naʻo le talafeagai mo faʻaoga maualuga poʻo le malosi | E le mautu le dielectric faifai pea, suiga tetele o le vevela, maualalo le malosi faʻainisinia, ma le faʻafefe i le susu |
| Fa'agasologa | I le taimi nei, e lima ituaiga masani o ceramic thermal CCLs, e aofia ai le HTCC, LTCC, DBC, DPC, LAM, ma isi. | IC fe'avea'i laupapa, Rigid-Flex laupapa, HDI tanumia/tauaso e ala i laupapa, laupapa itu-tasi, laupapa itu-lua, laupapa fa'apipi'i tele |
Ceramic PCB
Fa'aoga fanua o mea eseese:
Alumina Ceramic (Al2O3): O loʻo i ai le faʻaogaina lelei, faʻamautu maualuga, maʻaʻa, ma le malosi faʻainisinia e talafeagai mo masini eletise eletise.
Aluminum Nitride Ceramics (AlN): Faʻatasi ai ma le maualuga o le faʻaogaina o le vevela ma le faʻamautuina lelei o le vevela, e fetaui lelei mo masini eletise eletise ma faʻamalama moli LED.
Zirconia ceramics (ZrO2): faʻatasi ai ma le malosi maualuga, maualuga le maʻaʻa ma le ofuina o le teteʻe, e talafeagai mo mea eletise eletise maualuga.
Fa'aoga fanua o faiga eseese:
HTCC (High Temperature Co fired Ceramics): E fetaui lelei mo le maualuga o le vevela ma le maualuga o le eletise, e pei o le eletise eletise, vaalele, fesoʻotaʻiga satelite, fesoʻotaʻiga mata, mea faʻafomaʻi, masini eletise, petrochemical ma isi pisinisi. O faʻataʻitaʻiga o oloa e aofia ai LED maualuga, faʻamalosi eletise, inductors, sensors, capacitors teuina le malosi, ma isi.
LTCC (Low Temperature Co fired Ceramics): E talafeagai mo le gaosiga o masini microwave e pei o RF, microwave, antenna, sensor, faamama, vaeluaga o le eletise, ma isi. E le gata i lea, e mafai foi ona faʻaaogaina i fomaʻi, taʻavale, aerospace, fesoʻotaʻiga, faaeletonika ma isi matata. O faʻataʻitaʻiga o oloa e aofia ai masini microwave, faʻaoga antenna, masini faʻamalosi, masini kesi, masini faʻavavevave, masini microwave, vaeluaga eletise, ma isi.
DBC (Direct Bond Copper): E fetaui lelei mo le faʻafefeina o le vevela o masini semiconductor maualuga (e pei o le IGBT, MOSFET, GaN, SiC, ma isi) faʻatasi ai ma le faʻaleleia lelei o le vevela ma le malosi faʻainisinia. O faʻataʻitaʻiga o oloa e aofia ai masini eletise, eletise eletise, taʻavale eletise, ma isi.
DPC (Direct Plate Copper Multilayer Printed Circuit Board): e masani ona faʻaaogaina mo le faʻafefeina o le vevela o moli eletise maualuga ma uiga o le malosi maualuga, maualuga le vevela, ma le maualuga o le eletise. O faʻataʻitaʻiga o oloa e aofia ai moli LED, UV LED, COB LED, ma isi.
LAM (Laser Activation Metallization for Hybrid Ceramic Metal Laminate): e mafai ona faʻaogaina mo le faʻafefe o le vevela ma le faʻaogaina o le eletise i le maualuga o moli moli, eletise eletise, taavale eletise, ma isi fanua. O faʻataʻitaʻiga o oloa e aofia ai moli LED, eletise eletise, taʻavale afi taʻavale eletise, ma isi.
FR4 PCB
IC felauaiga laupapa, Rigid-Flex laupapa ma HDI tauaso / tanumia e ala laupapa e masani ona faaaoga ituaiga o PCBs, lea e faaaogaina i alamanuia eseese ma oloa e pei ona taua i lalo:
IC felauaiga laupapa: O se laupapa matagaluega lolomi e masani ona faʻaaogaina, e masani ona faʻaaogaina mo suʻega vaʻa ma gaosiga i masini eletise. O talosaga masani e aofia ai le gaosiga o le semiconductor, gaosiga fa'aeletoroni, aerospace, militeri, ma isi matā'upu.
Rigid-Flex board: O se laupapa meafaitino tu'ufa'atasia e tu'ufa'atasia le FPC ma le PCB malosi, fa'atasi ai ma le lelei o laupapa fa'afeso'ota'i fe'avea'i ma malo. O talosaga masani e aofia ai mea fa'akomepiuta fa'atau, mea fa'afoma'i, mea fa'aeletonika ta'avale, va'alele, ma isi matā'upu.
HDI tauaso / tanumia e ala i le laupapa: O se laupapa fesoʻotaʻi lolomi lolomi maualuga ma maualuga le maualuga o laina ma laʻititi laʻititi e maua ai le afifiina laʻititi ma maualuga le faʻatinoga. O fa'aoga masani e aofia ai feso'ota'iga fe'avea'i, komipiuta, mea fa'akomepiuta fa'atau, ma isi matā'upu.