FPC

1.FPC—Flexible Printed Circuit, inovimbika zvakanyanya uye inochinjika yakadhindwa dunhu rakagadzirwa nekusungirira pafoiri yemhangura uchishandisa polyester firimu kana polyimide se substrate kugadzira dunhu.

2.Chigadzirwa Hunhu: ① Hukuru hudiki uye huremu huremu : kusangana nezvinodiwa zvehurefu-density, miniaturization, huremu, hutete uye yakakwirira kuvimbika nzira dzekusimudzira; ② High flexibility: inogona kufamba uye kuwedzera zvakasununguka mu 3D nzvimbo, kuwana yakasanganiswa yechikamu musangano uye waya yekubatanidza.

FPC application:

kamera, vhidhiyo kamera, CD-ROM, DVD, hard drive, laptop, runhare, mbozhanhare, printer, fax muchina, TV, midziyo yekurapa, zvemagetsi zvemotokari, aerospace uye zvigadzirwa zvemauto.

Zvinoenderana nehuwandu hwema conductive layer, inogona kukamurwa kuita rimwe-sided board, kaviri-sided board uye akawanda-layer board.

Single-sided board: conductor kune rimwe divi chete

Bhodhi rine mativi maviri: kune maviri maconductor pamativi ese, uye kumisikidza kubatanidza magetsi pakati pemakondakita maviri neburi (via) sebhiriji. A through hole igomba diki rakavharwa nemhangura pamadziro egomba rinokwanisa kubatanidzwa nemaseketi mativi ese.

Multi-layer board : ine 3 kana anopfuura akaturikidzana emakondakita, ane mamwe chaiwo marongerwo.

Kunze kwebhodhi-rimwe divi bhodhi, huwandu hwematanho ebhodhi akaomesesa anowanzo kunyange, senge 2, 4, 6, 8 akaturikidzana, kunyanya nekuti isinganzwisisike dhizaini stacking chimiro asymmetric uye inonamira bhodhi warping. Kune rimwe divi, inochinjika PCB yakasiyana sezvo pasina dambudziko re warping, saka 3-layer, 5-layer, nezvimwe zvakajairika.

Copper foil inokamurwa kuita Electro-Deposited mhangura (ED Copper) uye Rolled Annealed mhangura (RA Copper)

1oz ≈ 35um

OZ ihwo huremu huremu hwakaenzana ne1/16 pound, ingangoita 28.35g.

Muindasitiri yebhodhi redunhu, ukobvu hwe1oz mhangura yakaiswa furati mukati meimwe wquare tsoka inotsanangurwa se1oz. Saka dzimwe nguva vatengi vanokumbira 28.35g yemhangura, isu tinofanira kubva taziva kuti ichi chinodiwa pa1oz yemhangura.

Basa remasolder mask: ① pamusoro pekuvhara ② chengetedza dunhu uye kudzivirira kukuvadzwa kwedunhu ③ kudzivirira zvinhu zvinoitisa zvekunze kuti zvisatadza kupinda mudunhu uye kukonzera mapfupi maseketi.

Kune mhando mbiri dze solder mask zvinhu: inki uye yekufukidza

Iyo inki inoshandiswa kugadzira mask yemasolder inowanzoita photosensitive uye inonzi liquid photo imagealble, yakapfupikiswa seLPI. Kazhinji inowanikwa mugirinhi, dema, chena, tsvuku, yero, bhuruu, nezvimwe.

Coverlay, inowanzowanikwa yero (mamwe anonzi amber), dema nechena. Dema ine blackout yakanaka uye chena ine high reflectivity, iyo inogona kutsiva inki chena yebacklight flexible board.

Panyaya yebhodhi inoshanduka, zvese inki uye coerlay zvinogona kushandiswa soler mask. Saka ndeipi kuenzanisa pakati pezvakanakira nekuipira kwezviviri izvi? Ndokumbira utarise tafura iri pazasi:

Basa rekupedzisa kwepamusoro nderokudzivirira mhangura yepamusoro oxidation, kupa welding kana bonding layer.

Kune kazhinji nzira dzinoverengeka dzekupedzisa pamusoro senge pazasi: yakatarwa yekupedzisa kwepamusoro.

OSP: Organic solderability preservatives OSP: 0.2-0.5um

Kuputira Ni/Au Kupfekedza Tin:4-20um

ENIG: Electroless Nickel Immersion Gold ENIG: 0.05-0.1um

Kuputira Sn/Tin Kuisa goridhe: 0.1-1um

Kunyudza Sn/Tin Kunyudzwa Tin:0.3-1.2um

Kunyudza Ag Kunyudzwa Ag:0.07-0.2um.

Mutengo wekuenzanisa : Plating Ni/Au(ENIG) > Kunyudza Ag > Plating Sn/Tin (Immersion Sn/Tin) > OSP.

Kusiyana nebhodhi rakasimba, bhodhi rinoshanduka harina kusimba kwakafanana uye simba remachanical sebhodhi rakasimba, saka haigone kugadziriswa zvakanaka ne screws kana kuisa makadhi slots. Kazhinji, zvinodikanwa kuigadzirisa pamudziyo nekaviri-mativi adhesive kudzivirira FPC kubva pakuzununguka mushure mekusangana. Pamusoro pezvo, kaviri-mativi anonamira anogona zvakare kushandiswa kubatanidza stiffener kuFPC.

DST (Double-Sided Tape), inozivikanwawo sePressure-Sensitive Adhesive (PSA), inonamira yakapetwa kaviri inoshandiswa kuFPC.

Pressure Sensitive Adhesive inogona kukamurwa kuita yakajairwa adhesive, yakakwirira-tembiricha inodzivirira inonamira, conductive adhesive uye thermal conductive adhesive.

Zvakajairika zvinonamira zvinosanganisira 3M467,3M468, conductive adhesives zvinosanganisira 3M9703,3M9713.

Thermal conductive adhesives inosanganisira 3M8805,3M9882

Yakakwira-tembiricha inodzivirira inonamira inoreva kunamira iyo inogona kumira SMT yakakwirira tembiricha kwenguva pfupi, inoshandiswa kumabhodhi anoda SMT kukwira. Anowanzo shandiswa adhesives anosanganisira 3M9460,3M9077,3M9079,TESA8853, etc.

Kune marudzi akawanda e-stiffeners sepazasi:

Stainless Simbi (SS): Vamwe vatengi vanoratidza SUS pamifananidzo yavo, asi muchokwadi, iyi isimbi inoomesa. SUS imhando inowanzoshandiswa yesimbi mashizha.

AL:Aluminum

FR4

Polyimide

Polyester

Electro-Magnetic Interference (EMI) chinhu chinowanzoitika, kunyanya mumaseketi akakwira-frequency, kuve nechokwadi chekuvimbika kwechiratidzo pasina kukanganisa, kudzivirira kwemagetsi kunodiwa. Zvishandiso zvinoshandiswa pakudzivirira kwemagetsi eFPC zvinonyanya zvinosanganisira sirivheri inki uye sirivheri inki firimu. .

Silver inki chinhu chakafanana nenamira chine simbi yesirivha zvidimbu uye resin. Inogona kudhindwa paFPC senge sirika sikirini ingi mubhodhi rakaomarara, uye yobva yabikwa nekuomeswa. Kuti udzivise oxidation yesirivha mumhepo, jira reinki kana firimu rinodzivirira rinowanzodhindwa painki yesirivha yekudzivirira.

Zviumbwa zvinowanzoshandiswa zvakakamurwa kuita banga nesimbi mold. Iko kurongeka kwebanga mold kwakadzikira, nekugadzira kushivirira kweinenge +/-0.3mm. Kurongeka kwesimbi mold kwakakwira, ine yakajairika simbi mold inoita +/-0.1mm uye chaiyo simbi mold inosvika +/-0.05mm. Nekuda kwechikonzero mutengo wezviumbwa zvesimbi zvakati wandei kana kunyange gumi zvakapetwa kupfuura zvezvipfuyo zvebanga.

Mabanga mold anozivikanwawo sezvishandiso zvakapfava, uye zviumbwa zvesimbi zvinozivikanwawo sezvishandiso zvakaoma.

Shandisa chigadziriso chemagetsi chekuongorora kuti uwane simba rakazara pachigadzirwa kuti utarise kukanganisa kwakakomba sekuvhurika, pfupi, nezvimwewo mumaseketi echigadzirwa. Muchikamu chesampling, huwandu hwacho hudiki, kuitira kuchengetedza mutengo wekuvhura furemu yekuyedza, probe inobhururuka inoshandiswa pakuyedza. Nekudaro, kuyedzwa kwekuongorora kubhururuka kwakaoma uye kunotora nguva yakareba zvichikonzera kushomeka kwekuita. Naizvozvo, kuyedzwa kunoitwa uchishandisa yekuyedza furemu (fixture, jig) panguva yekugadzirwa kwemazhinji.

Izvo zvinokanganisa zvinogona kuwanikwa panguva yekuongorora magetsi zvinosanganisira: chinhu; open; pfupi.

Kuchenjerera kunofanirwa kubhadharwa pakuitika kwekukanganisa panguva yekuongorora magetsi: madhiri pamativi ekupedzisira anokonzerwa nemagetsi ekuongorora probes.

Ita ongororo yakazara yezvigadzirwa zvemunhu zvakapedzwa zvinoenderana nemazinga ekuongorora

Pane nzira dzinoverengeka dzekuongorora zvinoenderana nezvinodiwa zvakasiyana zvechigadzirwa sepazasi:

① kuongorora kwekuona

② microscopic kuongorora (zvishoma 10X)

Kunyanya ongorora chitarisiko, kusanganisira makwara, mazino, makwinya, oxidation, blistering, solder mask misalignment, kudhirowa zvisizvo, magaba edunhu, mhangura yakasara, zvinhu zvekunze, nezvimwe.