Musiyano uripo pakati peCeramic PCBs uye Traditional FR4 PCBs
Tisati takurukura nyaya iyi, ngatitangei kunzwisisa kuti ceramic PCBs chii uye kuti FR4 PCBs chii.
Ceramic Circuit Board inoreva rudzi rwedare redunhu rakagadzirwa zvichibva pane zveceramic, inozivikanwawo seCeramic PCB (yakadhindwa redunhu bhodhi). Kusiyana neyakajairwa girazi fiber reinforced plastic (FR-4) substrates, ceramic circuit boards inoshandisa ceramic substrates, iyo inogona kupa yakakwira tembiricha kugadzikana, nani mechanicha simba, zviri nani dielectric zvivakwa, uye hupenyu hurefu. Ceramic PCBs anonyanya kushandiswa mukupisa-tembiricha, yakakwirira-frequency, uye yakakwirira-simba maseketi, akadai semwenje eLED, magetsi amplifiers, semiconductor lasers, RF transceivers, sensors, uye microwave zvishandiso.
Circuit Board inoreva chinhu chakakosha chemidziyo yemagetsi, inozivikanwawo sePCB kana yakadhindwa redunhu bhodhi. Iyo inotakura yekuunganidza zvinhu zvemagetsi nekudhinda simbi yedunhu mapatani pane asiri-conductive substrates, uyezve kugadzira nzira dzinofambisa kuburikidza nemaitiro akadai semakemikari corrosion, electrolytic copper, uye kuchera.
Izvi zvinotevera kuenzanisa pakati peceramic CCL neFR4 CCL, kusanganisira misiyano yavo, zvakanakira uye zvazvakaipira.
| Hunhu | Ceramic CCL | FR4 CCL |
| Material Components | Ceramic | Girazi faibha yakasimbisa epoxy resin |
| Conductivity | N | UYE |
| Thermal Conductivity (W/mK) | 10-210 | 0.25-0.35 |
| Range of Ukobvu | 0.1-3mm | 0.1-5mm |
| Processing Dambudziko | High | Low |
| Manufacturing Cost | High | Low |
| Zvakanakira | Kugadzikana kwakanaka kwepamusoro-tembiricha, kuita kwakanaka kwedielectric, kusimba kwemechanicha, uye hupenyu hurefu hwebasa | Zvishandiso zvakajairika, mutengo wakaderera wekugadzira, nyore kugadzirisa, wakakodzera kune yakaderera-frequency application |
| Zvakaipa | Mutengo wekugadzira wakakwira, wakaoma kugadzirisa, wakakodzera chete kune yakakwirira-frequency kana yakakwirira-simba maapplication | Kusagadzikana dielectric nguva dzose, hombe tembiricha inoshanduka, yakaderera mechini simba, uye kubatwa nekunyorova |
| Maitiro | Parizvino, kune marudzi mashanu akajairika eceramic thermal CCLs, kusanganisira HTCC, LTCC, DBC, DPC, LAM, nezvimwe. | IC carrier board, Rigid-Flex board, HDI yakavigwa/bofu kuburikidza nebhodhi, rimwe divi bhodhi, mativi maviri bhodhi, akawanda-layer board. |
Ceramic PCB
Nzvimbo dzekushandisa dzezvinhu zvakasiyana:
Alumina Ceramic (Al2O3): Iyo ine yakanakisa insulation, yakakwirira-tembiricha kugadzikana, kuoma, uye mechanical simba kuti rive rakakodzera repamusoro-simba magetsi emagetsi.
Aluminium Nitride Ceramics (AlN): Iine high thermal conductivity uye yakanaka kugadzikana kwekushisa, inokodzera midziyo yemagetsi yemagetsi uye minda yemwenje ye LED.
Zirconia ceramics (ZrO2): ine simba rakakwirira, kuoma kwakakwirira uye kupfeka kusagadzikana, yakakodzera kune yakakwirira-voltage midziyo yemagetsi.
Nzvimbo dzekushandisa dzemaitiro akasiyana:
HTCC (High Temperature Co fired Ceramics): Inokodzera kushandiswa kwepamusoro-kupisa uye kwepamusoro-simba, zvakadai semagetsi emagetsi, aerospace, satellite communication, optical communication, mishonga yezvokurapa, magetsi emotokari, petrochemical nemamwe maindasitiri. Mienzaniso yezvigadzirwa zvinosanganisira ma LED-akakwirira, magetsi amplifiers, inductors, sensors, simba rekuchengetedza capacitors, nezvimwe.
LTCC (Low Temperature Co fired Ceramics): Inokodzera kugadzirwa kwemidziyo yemicrowave yakadai seRF, microwave, antenna, sensor, filter, power divider, etc. Mukuwedzera, inogona kushandiswawo mune zvekurapa, motokari, aerospace, kutaurirana, zvemagetsi nemimwe minda. Mienzaniso yechigadzirwa inosanganisira microwave modules, antenna modules, pressure sensors, gasi sensors, acceleration sensors, microwave filters, magetsi dividers, nezvimwe.
DBC (Direct Bond Copper): Inokodzera kupisa kupisa kwepamusoro-simba semiconductor zvishandiso (senge IGBT, MOSFET, GaN, SiC, nezvimwewo) ine yakanakisa yekupisa conductivity uye mechanical simba. Mienzaniso yechigadzirwa inosanganisira mamodule emagetsi, magetsi emagetsi, emagetsi emagetsi emotokari, nezvimwe.
DPC (Direct Plate Copper Multilayer Printed Circuit Board): inonyanya kushandiswa kupisa kupisa kwemagetsi emagetsi emagetsi emhando yepamusoro ane hunhu hwekusimba kwepamusoro, kukwirira kwekushisa kwekushisa, uye kushanda kwemagetsi. Mienzaniso yechigadzirwa inosanganisira mwenje we LED, UV LEDs, COB LEDs, nezvimwe.
LAM (Laser Activation Metallization yeHybrid Ceramic Metal Laminate): inogona kushandiswa pakupisa kupisa uye magetsi ekuita optimization mune yakakwirira-simba LED mwenje, simba modules, magetsi emagetsi, uye mamwe minda. Mienzaniso yechigadzirwa inosanganisira marambi e LED, mamodule emagetsi, madhiraivha emotokari yemagetsi, nezvimwe.
FR4 PCB
IC inotakura mabhodhi, Rigid-Flex mabhodhi uye HDI bofu/kuvigwa kuburikidza nemabhodhi anowanzo shandiswa mhando dzePCB, dzinoiswa mumaindasitiri akasiyana uye zvigadzirwa sezvinotevera:
IC carrier board: Inowanzo shandiswa kudhindwa redunhu bhodhi, rinonyanya kushandiswa pakuongorora chip uye kugadzira mumidziyo yemagetsi. Zvishandiso zvakajairika zvinosanganisira semiconductor kugadzirwa, kugadzira zvemagetsi, aerospace, mauto, uye mamwe minda.
Rigid-Flex bhodhi: Ibhodhi rinoumbwa rinobatanidza FPC nePCB yakaoma, ine zvakanakira ese ari maviri anochinjika uye akaomarara edunhu mabhodhi. Zvishandiso zvakajairika zvinosanganisira zvemagetsi zvevatengi, midziyo yekurapa, mota dzemagetsi, aerospace, uye mamwe minda.
HDI bofu / kuvigwa kuburikidza nebhodhi: Iyo yakakwirira-density yekubatanidza yakadhindwa yedunhu bhodhi ine yakakwirira mutsara density uye diki aperture kuti uwane kurongedza kudiki uye kuita kwepamusoro. Zvishandiso zvakajairika zvinosanganisira nharembozha, makomputa, zvemagetsi zvevatengi, uye mamwe minda.