| Ntho | PCB e thata (HDI) | PCB e feto-fetohang | Regid-Flex PCB |
| Max Layer | 2-68L | 8L | 68L |
| Inner Layer Min Trace/Space | 1.4/1.4mil | 2/2 mil | 2/2 mil |
| Out Layer Min Trace/Space | 1.4/1.4mil | 3/3 mil | 3/3 mil |
| Lera le ka hare Max Koporo | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 6oz | 3oz | 6oz |
| Min Mechanical Drilling | 0.15mm / 6mil | 0.15 limilimithara | 0.15 limilimithara |
| Min Laser Drilling | 0.05mm / 3mil | 0.05 limilimithara | 0.05 limilimithara |
| Max Aspect Ratio(Mechanical Drilling) | 20:1 | / | 20:1 |
| Max Aspect Ratio(Laser Drilling) | 1:1 | 1:1 | 1:1 |
| Ho tsamaisana le Interlayer | +/-0.254mm(1mil) | ± 0.05 limilimithara | ± 0.05 limilimithara |
| Mamello ea PTH | ± 0.075mm | ± 0.075mm | ± 0.075mm |
| NPTH Mamello | ± 0.05 limilimithara | ± 0.05 limilimithara | ± 0.05 limilimithara |
| Mamello ea Countersink | + 0.15 limilimithara | ± 0.15 limilimithara | ± 0.15 limilimithara |
| Botenya ba Boto | 0.20-12 limilimithara | 0.1-0.5mm | 0.4-3 limilimithara |
| Mamello ea Botenya ba Boto(＜1.Omm) | ±0.1mm | ± 0.05 limilimithara | ±0.1mm |
| Mamello ea Botenya ba Boto(≥1.Omm) | ±8% | / | ±10% |
| Min Board Size | 10 * 10 limilimithara | 5 * 5 limilimithara | 10 * 10 limilimithara |
| Boholo ba Boto | 1200mm * 750mm | 500 * 1200mm | 500 * 500mm |
| Tsepamiso ea Kemiso | +/-0.075mm(3mil) | ± 0.05 limilimithara | ±0.1mm |
| BGA ea ka | 0.125mm(5mil) | 7 mil | 7 mil |
| Min SMT | 0.177*0.254mm(7*10mil) | 7*10mil | 7*10mil |
| Min Solder Mask Clearance | 1.5mil | 2 mil | 1.5mil |
| Letamo la Mask la Min Solder | 3 mil | 3 mil | 3 mil |
| Tšōmo | Bosoeu, Botsho, Bokhubelu, Bosehla | Bosoeu, Botsho, Bokhubelu, Bosehla | Bosoeu, Botsho, Bokhubelu, Bosehla |
| Min Legend Bophara/Botelele | 4/23 mil | 4/23 mil | 4/23 mil |
| Min Bending Radius(Boto e le 'ngoe) | / | 3-6 x Botenya ba Boto | 3-7 x Flexbile Board Botenya |
| Min Bending Radius(Double Side Board) | / | 6-10 x Botenya ba Boto | 6-11 x Flexbile Board Botenya |
| Min Bending Radius(Multilayer Board) | / | 10-15 x Botenya ba Boto | 10-16 x Flexbile Board Botenya |
| Min Bending Radius(Ho Kobela ka Matla) | / | 20-40 x Botenya ba Boto | 20-40 × Botenya ba Boto |
| Senya Bophara ba Fillet | / | 1.5+0.5mm | 1.5+0.5mm |
| Bow & Sotha | 0.005 | / | 0.0005 |
| Mamello ea Impedance | Qetello e le 'Ngoe: ±5Ω(≤50Ω) ±7%(＞50Ω) | Qetello e le 'Ngoe: ±5Ω(≤50Ω),±10%(＞50Ω) | Qetello e le 'Ngoe: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Mamello ea Impedance | Phapano: ±5Ω(≤50Ω) ±7%(＞50Ω) | Phapano: ±5Ω(≤50Ω),±10%(＞50Ω) | Phapano: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Mask ea solder | Botala, Boso, Boputsoa, Bokhubelu, Matt Green, Yellow, White, Purple | Green Solder Mask / Black PI / Yellow PI | Botala, Botsho, Boputsoa, Bofubedu, Matt Green |
| Surface Finish | Ho roala ha khauta ea Eiectron, ENIG, Ho rala khauta e thata, Monoana oa Khauta, Silivera e qoelisoang, Tin ea ho qoelisoa, HASL LF, OSP, ENEPIG, Ho rala khauta e bonolo | Plating ea khauta ea elektronike, ENIG, Ho rala khauta e thata, Monoana oa Khauta, Silevera e qoelisoang, Tin ea ho qoelisoa, OSP, ENEPIG, Ho rala khauta e bonolo | Ho rala khauta ea elektronike, ENIG, Ho rala khauta e thata, Monoana oa Khauta, Silevera e Immersion, Immersio Tin, HASL LF, OSP, ENEPIG, Ho rala khauta e bonolo |
| Mokhoa o Khethehileng | E patoa / e foufetse ka, groove ea mehato, e kholo ho feta tekano, khanyetso e patiloeng / bokhoni, khatello e tsoakiloeng, RF, monoana oa khauta, sebopeho sa N+N, koporo e teteaneng, ho cheka mokokotlo, HDI(5+2N+5) | monoana oa khauta, lamination, sekhomaretsi se tsamaisang, Filimi e sireletsang, tšepe ea tšepe | E patoa / e foufetse ka, groove ea mehato, e fetelletseng, ho hanyetsa / bokhoni, khatello e tsoakiloeng, RF, monoana oa khauta, sebopeho sa N+ N, koporo e teteaneng, ho cheka ka morao |
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