● Uri: PCB(2-68 layer) sample at batch manufacturing, nakamit ang mahuhusay na resulta sa HDI, high multi-layer PCB, FPC, Rigid-Flex, atbp.
● Espesyal na proseso: blind/buried hole, step groove, ultra size, buried resistance/capacity, hybrid pressing, rigid-flex, gold finger, N+N structure, heavy copper, back drilling.
● Mga karaniwang substrate: FR4 Tg/HIGH, Tg/Low DK, RO4350B, FR408HR, M4, M6, TU862, TU872, Rogers, IT968, atbp.
● Surface finish: HASL, Pb-free HASL, ENIG, Immersion Tin, Immersion silver, gold plating, OSP, ENIG+OSP, ENEPIG.
● Mga certification ng IISO9001/ISO14001/TS16949/UL//ISO13485/QC08000/GJB 9001C-2017.