| item | Matibay na PCB(HDI) | Flexible na PCB | Rigid-Flex PCB |
| Max Layer | 2-68L | 8L | 68L |
| Inner Layer Min Trace/Space | 1.4/1.4mil | 2/2mil | 2/2mil |
| Out Layer Min Trace/Space | 1.4/1.4mil | 3/3mil | 3/3mil |
| Inner Layer Max Copper | 6oz | 2oz | 6oz |
| Out Layer Max Copper | 6oz | 3oz | 6oz |
| Min Mechanical Drilling | 0.15mm/6mil | 0.15mm | 0.15mm |
| Min Laser Drilling | 0.05mm/3mil | 0.05mm | 0.05mm |
| Max Aspect Ratio (Mechanical Drilling) | 20:1 | / | 20:1 |
| Max Aspect Ratio (Laser Drilling) | 1:1 | 1:1 | 1:1 |
| Interlayer Alignment | +/-0.254mm(1mil) | ±0.05mm | ±0.05mm |
| Pagpaparaya ng PTH | ±0.075mm | ±0.075mm | ±0.075mm |
| Pagpaparaya ng NPTH | ±0.05mm | ±0.05mm | ±0.05mm |
| Countersink Tolerance | +0.15mm | ±0.15mm | ±0.15mm |
| Kapal ng Lupon | 0.20-12mm | 0.1-0.5mm | 0.4-3mm |
| Pagpapahintulot sa Kapal ng Lupon(＜1.Omm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Pagpapahintulot sa Kapal ng Lupon(≥1.Omm) | ±8% | / | ±10% |
| Min Laki ng Board | 10*10mm | 5*5mm | 10*10mm |
| Max na Sukat ng Board | 1200mm*750mm | 500*1200mm | 500*500mm |
| Pag-align ng Balangkas | +/-0.075mm(3mil) | ±0.05mm | ±0.1mm |
| BGA ko | 0.125mm(5mil) | 7mil | 7mil |
| Min SMT | 0.177*0.254mm(7*10mil) | 7*10mil | 7*10mil |
| Min Solder Mask Clearance | 1.5mil | 2mil | 1.5mil |
| Min Solder Mask Dam | 3mil | 3mil | 3mil |
| Alamat | Puti, Itim, Pula, Dilaw | Puti, Itim, Pula, Dilaw | Puti, Itim, Pula, Dilaw |
| Min Lapad/Taas ng Legend | 4/23mil | 4/23mil | 4/23mil |
| Min Bending Radius (Single Board) | / | 3-6 x Kapal ng Lupon | 3-7 x Flexbile Board Thickness |
| Min Bending Radius (Double Side Board) | / | 6-10 x Kapal ng Lupon | 6-11 x Flexbile Board Thickness |
| Min Bending Radius(Multilayer Board) | / | 10-15 x Kapal ng Lupon | 10-16 x Flexbile Board Thickness |
| Min Bending Radius(Dynamic Bending) | / | 20-40 x Kapal ng Lupon | 20-40 × Kapal ng Lupon |
| Pilitin ang Lapad ng Fillet | / | 1.5+0.5mm | 1.5+0.5mm |
| Bow & Twist | 0.005 | / | 0.0005 |
| Impedance Tolerance | Single-Ended: ±5Ω(≤50Ω),±7%(＞50Ω) | Single-Ended: ±5Ω(≤50Ω),±10%(＞50Ω) | Single-Ended: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Impedance Tolerance | Differential: ±5Ω(≤50Ω),±7%(＞50Ω) | Differential: ±5Ω(≤50Ω),±10%(＞50Ω) | Differential: ±5Ω(≤50Ω), ±10%(＞50Ω) |
| Panghinang Mask | Berde, Itim, Asul, Pula, Matt Green, Dilaw, Puti, Lila | Green Solder Mask/Black PI/Yellow PI | Berde, Itim, Asul, Pula, Matt Green |
| Ibabaw ng Tapos | Eiectronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,ImmersionTin,HASL LF,OSP,ENEPIG,Soft gold plating | Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersion Tin,OSP,ENEPIG,Soft gold plating | Electronic gold plating,ENIG,Hard gold plating,Gold Finger,Immersion Silver,Immersio Tin,HASL LF,OSP,ENEPIG,Soft gold plating |
| Espesyal na Proseso | Nakabaon/nabulag sa pamamagitan ng, step groove, sobrang laki, nakabaon na resistensya/kapasidad, halo-halong presyon, RF, gintong daliri, istraktura ng N+N, makapal na tanso, pagbabarena sa likod，HDI(5+2N+5) | gintong daliri, lamination, conductive adhesive, shielding film, metal dome | Nakabaon/nabulag sa pamamagitan ng, step groove, sobrang laki, nakabaon na resistensya/kapasidad, halo-halong presyon, RF, gintong daliri, istraktura ng N+N, makapal na tanso, pagbabarena sa likod |
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