Ziintoni eziziimfama nezingcwatywayo?
vias Blind: Xa icala elinye kuphela vias kwi umaleko engaphandle PCB, kuthiwa vias imfama.
Wangcwatywa vias: Xa omabini amacala vias bangcwatywa umaleko engaphakathi PCB, kuthiwa vias wangcwatywa.
Zenziwa njani ii-vias ezingaboniyo nezingcwatywayo?
Ezi ndlela zintathu zilandelayo zinokudala i-vias eyimfama kwaye ingcwatywe:
Ukwemba oomatshini ngobunzulu obusisigxina
I-lamination elandelelanayo kunye nokugrumba
Naliphi na i-lamination kunye nokugrumba
Yintoni imfama ngenkqubo yokuvelisa?
Okokuqala, sithetha nge-laser drill blind ngokusebenzisa imingxunya. I-PCB ayiboni ngenkqubo yokwenziwa ngolu hlobo lulandelayo:
1) gqibezela zonke iileyile zangaphakathi kuqala;
2) Laminate ezimbini ngaphandle umaleko prepreg kunye sheet copper phezu sele sele sele igqityiwe yangaphakathi ibhodi PCB;
3) ukubhola ubunzulu obulawulwayo obuyimfama ngePCB ngelaser.
Nceda uqaphele ukuchaneka kubaluleke kakhulu kwiimfama nge-pad.
Ngokumalunga nomatshini wokuqhuba ungaboni ngemingxunya, sithatha iiPCB ezinomaleko-4 kunye ne-vias eyimfama kumaleko 1 ukuya kumaleko wesi-2 umzekelo, inkqubo ngolu hlobo lulandelayo:
1) ukuvelisa i-1 kunye ne-2 njengomgangatho we-PCB ye-2-layer, ngoko kuya kubakho u-drills kwi-1 ukuya kwi-2;
2) Laminate iibhodi ezimbini ezingundoqo kunye ukuze sifumane i-4-layer PCB, kunye nokugrumba i-plating ngokusebenzisa imingxuma;
3) xa PCB igqityiwe, ufumana PTH ukusuka umaleko 1 ukuya 4 kunye vias eyimfama ukusuka umaleko 1 ukuya 2.
Ziziphi iingenelo zokusebenzisa ii-vias ezingaboniyo nezingcwatywayo?
Iinzuzo zokusebenzisa iimfama kunye nokungcwatywa zichazwe ngezantsi:
Ukunciphisa ubungakanani kunye nobunzima bePCB
Ukunciphisa inani leeleya
Ukunciphisa iindleko zokuveliswa kweentlobo ezininzi zeePCB ukususela ekuhlanganiseni imisebenzi emininzi
Ukuphucula ukuhambelana kwe-electromagnetic
Ukwandisa iimpawu zeemveliso zombane
Ukwenza umsebenzi woyilo ube lula kwaye ukhawuleze
Yeyiphi imingeni yokusebenzisa ii-vias ezingaboniyo nezingcwatywayo?
I-miniaturization ye-diameters yee-vias ezingaboniyo kunye nokungcwatywa kubeka iimfuno eziphezulu kwimveliso ye-PCB.
Iinjineli ezinamava kakhulu ziyafuneka ukuyila iimfama kunye nokungcwatywa ngePCBs.
Kungumceli mngeni ngakumbi ukudibanisa iimfama kunye nokungcwatywa nge-PCBs kuba zihlala zineephedi ezincinci, ezifana neepads ze-BGA.
Yintoni ubumfama obuqhelekileyo nge-aspect ratio?
Kwibhodi ye-laser drill blind vias board, ukungaboni okuqhelekileyo nge-aspect ratio yi-1:1.
Kungcwatywa ngantoni?
I-Vis engcwatywe kwi-PCB idlula imingxunya phakathi kweeleya zangaphakathi. Sithatha 6 umaleko imfama / wangcwatywa ngokusebenzisa ibhodi yesekethe umzekelo: vias imfama can nge imingxuma ukusuka umaleko 2-3, 2-4, 2-5, 3-4, 3-5 kunye 4-5.
Ungcwatywe nge vs blind nge
Iimfama ngokudlula kwaye zingcwatywe nge-HDI PCBs eziqhele ukusetyenziswa, zihlala zikho kwiibhodi zesekethe ezixineneyo eziphezulu ngaxeshanye. Kodwa ziintlobo ezahlukeneyo zee-vias.