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Uhlalutyo lweTekhnoloji yokuGwaba ngasemva kwi-High Speed PCB Design
2024-04-08 17:37:03
Kutheni kufuneka senze uyilo lweBackdrill?
Okokuqala, amacandelo onxibelelwano olukwisantya esiphezulu ngala:
① Ukuthumela itshiphu yokuphela (ukupakishwa kunye nePCB nge)
② Ikhadi eliphantsi locingo lwePCB
③ Isidibanisi sekhadi eliphantsi
④ Iingcingo zePCB yangasemva
⑤ Isiqhagamshelo sekhadi elisezantsi elichaseneyo
⑥ Icala elichaseneyo nekhadi elincinci le-PCB yocingo
⑦ I-AC coupling capacitance
⑧ Itshiphu yomamkeli (ukupakishwa kunye nePCB nge)
Uqhagamshelo lwesantya esiphezulu sonxibelelwano lweemveliso ze-elektroniki luntsonkothile, kwaye iingxaki zokungahambelani kwe-impedance zidla ngokuvela kwiindawo ezahlukeneyo zokudityaniswa kwecandelo, okukhokelela ekuphumeni komqondiso.
Amanqaku aqhelekileyo okuyeka ukunyanzeliswa kunxibelelwano olunesantya esiphezulu:
(1) Ukupakishwa kwe-chip: Ngokuqhelekileyo, ububanzi be-PCB be-wiring ngaphakathi kwe-substrate yokupakisha i-chip buncinci kakhulu kune-PCB eqhelekileyo, okwenza kube nzima ukulawula i-impedance;
(2) I-PCB nge: I-PCB nge-PCB idla ngokuba neziphumo ze-capacitive kunye ne-impedance yeempawu eziphantsi, kwaye kufuneka ibe yeyona nto igxininise kwaye iphuculwe kuyilo lwe-PCB;
(3) Isidibanisi: Uyilo lwekhonkco lokudibanisa ubhedu ngaphakathi kwekhonkco luphenjelelwa kukuthembeka komatshini kunye nokusebenza kombane, ngoko ke kufuneka kufuneke ukulingana phakathi kwezi zibini.
I-PCB idlula idla ngokuyilwa njengemingxuma edlulayo (ukusuka phezulu ukuya kumaleko asezantsi). Xa umgca we-PCB odibanisa i-pass uhanjiswe kufutshane nomgangatho ophezulu, i-"stub" bifurcation iya kwenzeka nge-PCB yoqhagamshelo lwekhonkco, ibangela ukubonakaliswa komqondiso kunye nokuchaphazela umgangatho womqondiso. Le mpembelelo inempembelelo enkulu kwiimpawu kwizantya eziphezulu.
Troduction to Backdrill Processing Methods
Itekhnoloji yokugrumba ngasemva ibhekisa kusetyenziso lweendlela zokulawula ubunzulu bokomba, kusetyenziswa indlela yesibini yokomba ukugqobhoza umngxuma weStub iindonga zesinxibelelanisi okanye umqondiso nge.
Njengoko kubonisiwe kulo mzobo ungezantsi, emva kokuba kwenziwe umngxuma wokutyhutyha, i-Stub engaphezulu ye-PCB ngokusebenzisa umngxuma iyasuswa ngokugrumba okwesibini ukusuka "kwicala elingasemva". Kakade ke, ububanzi be-backdrill bit kufuneka bube bukhulu kunobukhulu bomngxuma wokutyhutyha, kwaye ubunzulu benqanaba lonyamezelo lwenkqubo yokomba kufuneka lusekelwe kumgaqo "wongonakalisi unxibelelwano phakathi komngxuma wePCB kunye neengcingo", ukuqinisekisa ukuba "ubude obushiyekileyo be-stub buncinci kangangoko kunokwenzeka", okubizwa ngokuba yi "depth control drilling".
Umzobo wesicwangciso secandelo le-BackDrill ephumela kumngxuma
Oku kungasentla ngumzobo wesicwangciso secandelo le-BackDrill ephuma kumngxuma. Icala lasekhohlo ngumqondiso oqhelekileyo ngomngxuma, ngasekunene ngumzobo oqingqiweyo womngxuma wokutyhutyha emva kwe-BackDrill, ebonisa ukugrumba ukusuka kumaleko asezantsi ukuya kumaleko wesiginali apho umkhondo ukhoyo.
Itekhnoloji yokugaya i-back back inokususa i-parasitic capacitance effect ebangelwa yi-stubs eludongeni lomngxuma, ukuqinisekisa ukuhambelana phakathi kwe-wiring kunye ne-impedance kwi- through-hole kwikhonkco lesiteshi, ukunciphisa ukubonakalisa umqondiso, kwaye ngaloo ndlela kuphuculwe umgangatho wesignali.
I-Backdrill okwangoku yeyona teknoloji ingabizi kakhulu eyona isebenzayo ekuphuculeni ukuhanjiswa kwejelo. Ukusetyenziswa kweteknoloji yokomba umva kuya kwandisa iindleko zemveliso yePCB ukuya kumlinganiselo othile.
Ukuhlelwa kweBhodi eNye kuBolwa ngasemva
Ukugaya ngasemva kuqulethwe iindidi ezi-2 : ukugaya ngasemva kwicala elinye kunye nokugaya ngasemva ngasemva.
Ukugrumba icala elinye kunokohlulwa kukwembiwa ngasemva ukusuka phezulu okanye kumphezulu osezantsi. Umngxuma we-PIN we-pin yeplagi yokudibanisa unokuphinda ubuyele umva ukusuka kwicala elichasene nobuso apho uqhagamshelwano lukhoyo. Xa iziqhagamshelo zomqondiso wesantya esiphezulu zicwangciswe kuzo zombini iindawo eziphezulu nezisezantsi zePCB, umqolo omacala mabini uyafuneka.
Izinto eziluncedo zokomba ngasemva
1) Ukunciphisa ukuphazamiseka kwengxolo;
2) Ukuphucula imfezeko yomqondiso;
3) Ubukhulu bebhodi yendawo buyancipha;
I-4) Nciphisa ukusetyenziswa kokungcwatywa / ukungaboniyo ngokunciphisa ubunzima bemveliso ye-PCB.
Ithini indima yokomba ngasemva?
Umsebenzi wokugaya ngasemva kukukhupha amacandelo emingxuma angenalo naluphi na uxhumano okanye umsebenzi wokuhambisa ukuphepha ukubonakalisa, ukusabalalisa, ukulibaziseka, njl. kwi-high-speed signal transmission.
Inkqubo yokwemba ngasemva
a. Kukho imingxunya yokubeka kwi-PCB, esetyenziselwa indawo yokuqala yokomba kunye nokugrumba umngxuma wokuqala we-PCB;
b. I-Electroplate i-PCB emva kokugrumba umngxuma wokuqala, kunye nefilimu eyomileyo itywine umngxuma wokumisa phambi kwe-electroplating;
c. Yenza ipateni yangaphandle kwi-PCB ene-electroplated;
d. Yenza ipateni ye-electroplating kwi-PCB emva kokwenza ipateni yomaleko yangaphandle;
e. Sebenzisa umngxuma wokumisa oye wasetyenziswa kukomba wokuqala wokugrumba ngasemva, kwaye usebenzise ibhleyidi yokubhola ukugrumba ngasemva;
f. Hlamba umngxuma ogrunjiweyo ngasemva ngamanzi ukuze ususe nayiphi na inkunkuma eseleyo ngaphakathi.