Yintoni umahluko phakathi kwe-AOI kunye ne-SPI20240904

Ukuqonda ukuHlolwa kweSPI : Isitshixo soMveliso woMbane othembekileyo

Kwindawo yokwenziwa kombane, ukuchaneka kunye nokuthembeka kubaluleke kakhulu. ITekhnoloji ye-Surface Mount (SMT) iye yaliguqula ishishini, ivumela ukuveliswa kwezixhobo zombane ezixineneyo nezisebenza kakuhle kakhulu. Nangona kunjalo, ngokunyuka kobunzima beesekethe kunye namacandelo, ukuqinisekisa umgangatho kunye nokusebenza kwezi ndibano ze-elektroniki kuye kwaba ngumngeni. Kulapho i-Solder Paste Inspection (SPI) ingena khona. Ukuhlolwa kwe-SPI yinkqubo ebalulekileyo yokulawula umgangatho kwi-SMT enceda ukugcina imigangatho ephezulu kwimveliso yombane. Kweli nqaku, siza kungena kwiinkcukacha zeUkuhlolwa kweSPI, ukubaluleka kwayo, iindlela, kunye nefuthe layo kumgangatho uwonke weeassemblies zombane.

Yintoni uhlolo lweSPI? 

Ukuhlolwa kwe-Solder Paste (SPI) kubhekiselele kwinkqubo yokuvavanya ukusetyenziswa kwe-solder paste kwibhodi yesekethe eprintiweyo (PCB) phambi kokubekwa kwamacandelo e-elektroniki. I-Solder paste ngumxube we-solder flux kunye ne-solder powder esetyenziselwa ukudala i-solder joints phakathi kwezinto zombane kunye ne-PCB. Ukusetyenziswa okuchanekileyo kwe-solder paste kubalulekile kuba kuchaphazela ukuthembeka kunye nokusebenza kwemveliso yokugqibela. I-SPI iqinisekisa ukuba i-solder paste isetyenziswe ngokuchanekileyo, kwinani elifanelekileyo, kunye nakwiindawo ezichanekileyo, ukunciphisa amathuba okuba neziphene kwindibano yokugqibela.

Kutheni usebenzise ukuhlolwa kwe-SPI kwimveliso yombane?

I-1.Ukuthintelwa kweziphene: I-SPI idlala indima ebalulekileyo ekukhuseleni iziphene eziqhelekileyo ezifana neebhulorho ze-solder, i-solder enganeleyo, kunye nokungahambi kakuhle kwamacandelo. Ngokufumanisa le miba kwangethuba kwinkqubo yokwenziwa kwemveliso, iSPI inceda ukunqanda ukuphinda kusebenze kunye nokulungiswa kweendleko.

I-2.I-Reliability ephuculweyo: Isicelo esifanelekileyo sokunamathisela i-solder siyimfuneko ekudaleni i-solder joints ethembekileyo enokumelana noxinzelelo lomatshini kunye nemijikelezo ye-thermal. I-SPI iqinisekisa ukuba i-solder paste isetyenziswe ngokufanayo nangokuchanekileyo, ekhokelela ekuphuculeni ukuthembeka kunye nobude obude besixhobo sombane.

I-3.Iindleko eziSebenzayo: Ukufumanisa kunye nokujongana nemiba yesicelo sokunamathisela i-solder kwisigaba sokuqala sokuvelisa kuneendleko eziphezulu kunokujongana neengxaki emva kokuba amacandelo abekwe okanye athengiswa. I-SPI inceda ekunciphiseni ixesha lokunciphisa imveliso kunye nokunciphisa inkunkuma yezinto eziphathekayo.

4.Ukuthotyelwa kweMigangatho: Amashishini amaninzi afuna ukuthotyelwa kwemigangatho ethile kunye nemimiselo yomgangatho. I-SPI inceda abavelisi ukuba bahlangabezane nale migangatho ngokuqinisekisa ukuba isicelo se-solder paste siyahlangabezana neenkcukacha eziyimfuneko.

Zeziphi iindlela zokuhlola iSPI?

I-SPI inokuqhutywa kusetyenziswa iindlela ezahlukeneyo, nganye ineseti yayo yeenzuzo kunye nokusetyenziswa. Iindlela eziphambili ziquka:

1.Uhlolo oluzenzekelayo lwaMacho (AOI): Le yeyona ndlela ixhaphakileyo ye-SPI, esebenzisa iikhamera ze-high-resolution kunye ne-algorithms yokucubungula umfanekiso ukuhlola isicelo sokunamathisela i-solder. Iisistim ze-AOI zinokubona izinto ezingaqhelekanga ezinje ngokugqithisileyo okanye ukungonelanga kwentlama ye-solder, ukulungelelaniswa kakuhle, kunye nokubopha ibhulorho. Ezi nkqubo zisebenza kakuhle kwaye ziyakwazi ukucubungula umthamo omkhulu wePCB ngokukhawuleza.

2.Ukuhlolwa kweX-reyi: Ukuhlolwa kwe-X-ray kusetyenziselwa ukufumanisa imiba engabonakali kwiso lenyama okanye ngeendlela eziqhelekileyo zokukhanya. Kuluncedo kakhulu ekuhloleni izakhiwo zangaphakathi zee-PCB ezinamanqwanqwa amaninzi kunye nokufumanisa imiba efana neebhulorho ezifihliweyo ze-solder okanye i-voids.

I-3.Ukuhlolwa kwe-Manual: Nangona kuncinci kwimveliso ephezulu, ukuhlolwa ngesandla kunokusetyenziswa kwimveliso encinci okanye njengendlela eyongezelelweyo. Abahloli abaqeqeshiweyo bahlola ngokubonakalayo isicelo sokuncamathisela i-solder kwaye basebenzise izixhobo ezinjengeeglasi zokukhulisa ukuchonga iziphene.

I-4.Ukuhlolwa kweLaser: Iinkqubo ze-SPI ezisekelwe kwi-Laser zisebenzisa i-laser ukulinganisa ubude kunye nomthamo we-solder paste deposits. Le ndlela ibonelela ngemilinganiselo echanekileyo kwaye iyasebenza ekufumaneni imiba enxulumene nokuncamathisela umthamo kunye nokufana.

Zeziphi iiparamitha eziphambili kuHlolo lweSPI?

Iiparamitha ezininzi ezibalulekileyo zivavanywa ngexesha lokuhlolwa kwe-SPI ukuze kuqinisekiswe isicelo esifanelekileyo sokunamathisela i-solder. Ezi parameters ziquka:

1.I-Solder Paste Volume: Isixa se-solder paste efakwe kwi-pad nganye kufuneka ibe phakathi kwemida echaziweyo. Ukuncamathisela okuninzi okanye okuncinci kunokukhokelela kwiziphene kumalungu e-solder.

2.Namathisela Ukutyeba: Ubukhulu be-solder paste layer kufuneka buhambelane ukuze kuqinisekiswe ukumanzisa okufanelekileyo kunye nokunamathela kwamacandelo. Ukwahluka kobunzima bokuncamathisela kunokuchaphazela umgangatho odibeneyo we-solder.

3.Ulungelelwaniso: I-solder paste kufuneka ihambelane ngokuchanekileyo kunye neepads zePCB. Ukungalungelelanisi kakuhle kunokukhokelela ekubunjweni kakubi kwe-solder kunye nemiba enokubakho yokubeka icandelo.

I-4.Usasazo lwe-Paste: Ukusabalalisa okufanayo kwe-solder paste kwi-PCB kubalulekile kwi-solder engaguqukiyo. Iinkqubo zeSPI zivavanya ukulingana kokusasazwa kwencama ukukhusela imiba efana ne-solder voids okanye ibhuloho.

Indlela yokuqinisekisa uMgangatho woShicilelo we-Solder Paste?

● Squeegee Speed: Isantya sokuhamba sokucudisa sinquma ukuba lingakanani ixesha elikhoyo lokuba i-solder paste "iqengqele" kwiindawo zokuvula i-stencil kunye neepads ze-PCB. Ngokuqhelekileyo, ukusetwa kwe-25mm ngesekhondi kusetyenziswa kodwa oku kuyaguquguquka kuxhomekeke kubukhulu beendawo zokuvula ngaphakathi kwestencil kunye ne-solder paste esetyenzisiweyo.

● Uxinzelelo lwe-Squeegee: Ngethuba lomjikelezo wokushicilela, kubalulekile ukufaka uxinzelelo olwaneleyo kulo lonke ubude be-squeeze blade ukuqinisekisa ukucoca okucocekileyo kwe-stencil. Uxinzelelo oluncinci kakhulu lunokubangela "ukuthambisa" kwi-stencil, ukubekwa kakubi, kunye nokudluliselwa okungaphelelanga kwi-PCB. Uxinzelelo oluninzi lunokubangela "ukukhupha" intlama kwimibhobho emikhulu, ukuguga ngokugqithiseleyo kwi-stencil kunye ne-squeegees, kwaye kunokubangela "ukopha" kwe-paste phakathi kwe-stencil kunye ne-PCB. Isimo esiqhelekileyo soxinzelelo lwe-squeegee yi-500 grams yoxinzelelo nge-25mm ye-squeegee blade.

● Cofa iEngile: I-angle ye-squeegee ngokuqhelekileyo iseti ye-60 ° ngabagcini abaxhomekeke kubo. Ukuba i-angle inyusiwe inokubangela ukuba "i-scooping" ye-holder paste ukusuka kwi-stencil apertures kwaye ngoko ke i-solder encinci ifakwe. Ukuba i-angle iyancitshiswa, inokubangela ukuba i-residu ye-solder paste ishiywe kwi-stencil emva kokuba i-squeeze igqibe ukuprinta.

● Isantya sokwahlula iStencil: Esi sisantya iPCB esahlula ngaso kwistencil emva kokushicilela. Ukumiselwa kwesantya ukuya kuthi ga kwi-3mm ngesibini kufuneka kusetyenziswe kwaye kulawulwe ubukhulu beendawo zokuvula ngaphakathi kwe-stencil. Ukuba oku kukhawuleza ngokukhawuleza, kuya kubangela ukuba i-solder paste ingakhululeki ngokupheleleyo kwi-apertures kunye nokuqulunqwa kwemida ephezulu ejikeleze iidiphozithi, eyaziwa nangokuthi "iindlebe zezinja".

● Ukucocwa kweestencil: I-stencil kufuneka icocwe rhoqo ngexesha lokusetyenziswa okunokwenziwa ngesandla okanye ngokuzenzekelayo. Umatshini wokuprinta ngokuzenzekelayo unenkqubo enokuthi isetyenziswe ukucoca i-stencil emva kwenani elimiselweyo lokuprinta usebenzisa i-lint-free material efakwe kwikhemikhali yokucoca njenge-Isopropyl Alcohol (IPA). Inkqubo yenza imisebenzi emibini, eyokuqala ikukucocwa komphantsi westencil ukunqanda ukugquma, okwesibini kukucocwa kwemingxuma kusetyenziswa ivacuum ukumisa izithintelo.

● I-Stencil kunye ne-Squeegee Condition: Zombini iistencils kunye ne-squeegees kufuneka zigcinwe ngononophelo kwaye zigcinwe njengoko nawuphi na umonakalo owenziwe ngoomatshini kuwo unokukhokelela kwiziphumo ezingafunekiyo. Zombini kufuneka zihlolwe ngaphambi kokusetyenziswa kwaye zicocwe ngokucokisekileyo emva kokusetyenziswa, ngokufanelekileyo kusetyenziswa inkqubo yokucoca ngokuzenzekelayo ukuze nayiphi na intsalela ye-solder paste isuswe. Ukuba kukho nawuphi na umonakalo obonwayo kwi-squeegee okanye i-stencils, kufuneka zitshintshwe ukuze kuqinisekiswe inkqubo ethembekileyo neyiphindayo.

● Shicilela iStroke: Lo ngumgama ohanjwa yi-squeegee ukunqumla i-stencil kwaye kucetyiswa ukuba ubuncinane ube yi-20mm udlule kweyona ndawo ikude kakhulu. Umgama odlula kweyona ndawo ikude ibalulekile ukuvumela isithuba esaneleyo sokuba intlama iqengqeleke kwi-stroke yokubuya njengoko iqengqeleka i-solder paste bead eyenza amandla asezantsi aqhubela intlama kwimingxuma.

Loluphi uhlobo lweePCB ezinokushicilelwa?

Noba kutheningqongqo,I-IMS,eqinile-flexokanyePCB eguqukayo(jonga wethuPCB Manufacturing), ukuba amandla ePCB awanelanga ukuxhasa iPCB ngokwayo njengeflethi epheleleyo njengemfuneko kwiintsimbi zeelayini ze-SMT, umenzi wendibano yePCB uyakucela ukwenza ngokusesikweni.Umthwali we-SMTokanye umthwali (owenziwe ngeDurostone).

Le yinkalo ebalulekileyo yokuqinisekisa ukuba i-PCB ibanjwe tyaba ngokuchasene ne-stencil ngexesha lenkqubo yoshicilelo. Ukuba i-PCB, kungakhathaliseki ukuba i-rigid, i-IMS, i-rigid-flex okanye i-flex, ayixhaswanga ngokupheleleyo, inokukhokelela ekushicileleni iziphene, ezifana ne-deposit paste engafanelekanga kunye ne-smudging. Iinkxaso ze-PCB zibonelelwa ngokubanzi ngoomatshini bokushicilela abanobude obusisigxina kwaye baneendawo ezicwangcisiweyo zokuqinisekisa inkqubo ehambelanayo. Kukwakho PCB eguquguqukayo kwaye iluncedo kwindibano enamacala amabini.

PUHlolo lwe-Solder Paste eprintiweyo (SPI)

Inkqubo yoshicilelo lwe-solder paste yenye yezona ndawo zibalulekileyo zenkqubo yokuhlanganisa umphezulu. Isiphene sichongiwe kwangaphambili kuya kuba neendleko eziphantsi ukulungisa - umgaqo oluncedo ekufuneka uqwalaselwe kukuba isiphene esichongiweyo emva kokuhanjiswa kwakhona kuya kuxabisa amaxesha ali-10 isixa-mali sokuphinda sisetyenziselwe lelo lichongiweyo ngaphambi kokuhanjiswa kwakhona-impazamo echongiweyo emva kovavanyo iya kuxabisa ngaphezulu kwe-10. amaxesha amaninzi okusebenza kwakhona. Kuyaqondwa ukuba inkqubo yoshicilelo ye-solder paste inikezela ngamathuba amaninzi kwiziphene kunaye nawuphi na omnye umntu.IiNkqubo zokuVelisa i-Surface Mount Technology (SMT).. Ukongeza, ukutshintshela kwi-lead-free solder paste kunye nokusetyenziswa kwamacandelo amancinci, kuye kwandisa ubunzima benkqubo yokushicilela. Kuye kwangqinwa ukuba i-lead-free solder pastes ayisasazeki okanye "imanzi" kunye ne-tin lead solder paste. Ngokubanzi, inkqubo yoshicilelo ichaneke ngakumbi iyafuneka kwinkqubo engenalo ukhokelo. Oku kuye kwatyhala umenzi ukuba aphumeze uhlobo oluthile lohlolo lwasemva koshicilelo. Ukuqinisekisa inkqubo, uhlolo oluzenzekelayo lwe-solder paste lungasetyenziselwa ukujonga ngokuchanekileyo iidiphozithi ze-solder paste. E-RICHFULLJOY, sinokubona ezinye iziphene zokuncamathisela kwe-solder eprintiweyo, iidiphozithi ezingonelanga umgca, iidiphozithi ezigqithisileyo, ukuguqulwa kwemilo, intlama engekhoyo, ukuncamathisela, ukuthambisa, ukubopha ibhuloho kunye nokunye.