0102030405
Lo ngumhlathi
Yintoni nge-PCB?
2024-07-25 21:51:41
Yintoni nge-PCB?
IiVias zezona mingxunya zixhaphakileyo kwimveliso yePCB. Badibanisa iileya ezahlukeneyo zothungelwano olufanayo kodwa zidla ngokungasetyenziselwa amacandelo e-solder. Ii-Vias zinokwahlulwa zibe ziindidi ezintathu: ngemingxunya, i-vias eyimfama, kunye ne-vias engcwatywayo. Iinkcukacha zolu hambo zintathu lulandelayo:
Indima yeemfama zokuVias kuYilo lwePCB kunye nokuVeliswa
Iindlela ezingaboniyo
I-vias eyimfama yimingxunya emincinci edibanisa umaleko omnye wePCB ukuya kwenye ngaphandle kokudlula kwibhodi yonke. Oku kuvumela abaqulunqi ukuba benze iiPCB ezixineneyo nezixineneyo ngokufanelekileyo nangokuthembekileyo kuneendlela eziqhelekileyo. Ngokusebenzisa i-vias eyimfama, abaqulunqi banokwakha amanqanaba amaninzi kwibhodi enye, ukunciphisa iindleko zecandelo kunye nokukhawulezisa amaxesha okuvelisa. Nangona kunjalo, ubunzulu bemfama ngokudlula ngokwesiqhelo akufunekanga bube ngaphezulu komlinganiselo othile ngokunxulumene nokuvuleka kwayo. Ke ngoko, ulawulo oluchanekileyo lobunzulu bokomba (i-Z-axis) lubalulekile. Ukulawulwa okungafanelekanga kunokukhokelela kubunzima ngexesha lenkqubo ye-electroplating.
Enye indlela yokudala i-vias eyimfama ibandakanya ukugrumba imingxuma eyimfuneko kumaleko wesekethe nganye phambi kokuba i-laminating kunye. Umzekelo, ukuba ufuna imfama ukusuka kwi-L1 ukuya ku-L4, ungaqala ngokugrumba imingxuma kwi-L1 kunye ne-L2, kwaye kwi-L3 kunye ne-L4, emva koko udibanise zonke iileya ezine. Le ndlela ifuna izixhobo ezichanekileyo zokubeka kunye nokulungelelanisa. Omabini amacebo aqaqambisa ukubaluleka kokuchaneka kwinkqubo yokuvelisa ukuqinisekisa ukusebenza kunye nokuthembeka kwePCB.
Ukungcwatywa nge
Kungcwatywa ntoni?
Yintoni umahluko phakathi kwe-micro nge kunye nokungcwatywa?
Ukungcwatywa nge-vias ngamacandelo abalulekileyo kuyilo lwe-PCB, ukudibanisa iisekethe zomaleko wangaphakathi ngaphandle kokwandisa kumaleko angaphandle, ukunikezela ngokungabonakaliyo ngaphandle. Ezi vias zibalulekile kuqhagamshelo lwesignali yangaphakathi. Iingcali kwishishini le-PCB zihlala ziphawula, "I-vias engcwatywayo inciphisa amathuba okuphazamiseka komqondiso, gcina ukuqhubela phambili kwe-impedance yeempawu zomgca wothumelo, kunye nokugcina indawo yocingo." Oku kubenza balungele uxinano oluphezulu kunye neePCB ezinesantya esiphezulu.
Ekubeni vias wangcwatywa ayikwazi yombiwa post-lamination, ukomba kufuneka kwenziwe kumaleko wesekethe ngamnye phambi lamination. Le nkqubo idla ixesha elininzi xa kuthelekiswa ngokusebenzisa-imingxuma kunye vias imfama, okukhokelela iindleko eziphezulu. Ngaphandle koku, ii-vias ezingcwatyiweyo zisetyenziswa ikakhulu kwiiPCB ezinoxinano oluphezulu ukukhulisa indawo enokusebenziseka yezinye iileya zesekethe, ngaloo ndlela ziphucula ukusebenza ngokubanzi kunye nokuthembeka kwePCB.
Ngemingxuma
Ngemingxuma isetyenziselwa ukudibanisa zonke iileya ngokusebenzisa umaleko ophezulu kunye nomgangatho ongezantsi. Ukufaka ubhedu ngaphakathi kwemingxunya kungasetyenziswa ekudibaneni kwangaphakathi okanye njengomngxuma wokumisa icandelo. Injongo yokutyhutyha imingxuma kukuvumela ukuhamba kweengcingo zombane okanye ezinye iinxalenye kumphezulu. Ngemingxuma ibonelela ngeendlela zokuxhoma kunye nokukhusela uqhagamshelo lombane kwiibhodi zesekethe eziprintiweyo, iingcingo okanye ii-substrates ezifanayo ezifuna indawo yokuncamathela. Zikwasetyenziswa njengeiankile kunye neziqhoboshi kwiimveliso zemizi-mveliso ezifana nefenitshala, iishelufu, kunye nezixhobo zonyango. Ukongeza, ngokusebenzisa imingxunya kunokubonelela ngokudlula-ngokungena kwiintonga ezifakwe kwimisonto kumatshini okanye kwizinto zesakhiwo. Ngaphaya koko, inkqubo yokuplaga ngemingxuma iyafuneka. IViasion ishwankathela ezi mfuno zilandelayo zokuplaga kwimingxuma.
*Coca imingxunya usebenzisa indlela yokucoca iplasma.
*Qinisekisa ukuba umngxuma ophumela ngaphandle awunankunkuma, ubumdaka nothuli.
*Linganisa imingxunya ukuqinisekisa ukuba iyahambelana nesixhobo sokuplaga
*Khetha imathiriyeli efanelekileyo yokuzalisa emingxunyeni: i-silicone caulk, i-epoxy putty, i-foam eyandisiweyo okanye iglue ye-polyurethane.
*Faka kwaye ucinezele isixhobo sokuplaga kumngxuma odlulayo.
*Yibambe ngokukhuselekileyo kwindawo ubuncinci imizuzu eli-10 phambi kokuba ukhulule uxinzelelo.
*Sula nayiphi na imathiriyeli yokuzalisa engaphezulu ejikeleze imingxunya xa igqityiwe.
*Jonga imingxunya ngamaxesha athile ukuqinisekisa ukuba akukho zivuza okanye konakala.
*Phinda inkqubo njengoko kuyimfuneko ngokusebenzisa imingxuma yobukhulu obahlukeneyo.
Olona setyenziso luphambili kwi- via ludibaniso lombane. Ubungakanani buncinci kuneminye imingxuma esetyenziselwa amacandelo e-solder. Imingxuma esetyenziselwa amacandelo e-solder iya kuba nkulu. Kwiteknoloji yokuvelisa i-PCB, ukugrumba yinkqubo esisiseko, kwaye umntu akanakungakhathali ngayo. Ibhodi yesekethe ayikwazi ukubonelela uqhagamshelo lombane kunye nemisebenzi esisigxina yesixhobo ngaphandle kokubhoboza okufunekayo kwimingxuma kwipleyiti yobhedu. Ukuba umsebenzi wokugaya ongafanelekanga ubangela nayiphi na ingxaki kwinkqubo yokutyhutyha imingxuma, inokuchaphazela ukusetyenziswa kwemveliso, okanye ibhodi yonke iya kuchithwa, ngoko ke inkqubo yokugaya ibaluleke kakhulu.
Iindlela zokomba ze-vias
Kukho ubukhulu becala iindlela ezimbini zokomba ze-vias: ukomba ngoomatshini kunye nokugrumba ngelaser.
Ukugrumba ngoomatshini kwimingxuma yinkqubo ebalulekileyo kushishino lwePCB. Ngemingxuma, okanye ngemingxuma, kukho ukuvuleka kwe-cylindrical okudlula ngokupheleleyo kwibhodi kwaye kudibanise icala elinye kwelinye. Zisetyenziselwa ukunyuswa kwamacandelo kunye nokudibanisa iisekethe zombane phakathi kweengqimba. Ukugrumba ngemingxunya ngoomatshini kubandakanya ukusebenzisa izixhobo ezikhethekileyo ezinje ngobhobhozo, iireamers, kunye neecountersink ukudala ezi zivulo ngokuchanekileyo nangokuchaneka. Le nkqubo inokwenziwa ngesandla okanye ngoomatshini abazenzekelayo ngokuxhomekeke kubunzima boyilo kunye neemfuno zokuvelisa. Umgangatho wokugaya oomatshini uchaphazela ngokuthe ngqo ukusebenza kwemveliso kunye nokuthembeka, ngoko ke eli nyathelo kufuneka lenziwe ngokuchanekileyo rhoqo. Ngokugcina imigangatho ephezulu ngokugrumba ngoomatshini, ngokusebenzisa imingxuma inokwenziwa ngokuthembekileyo nangokuchanekileyo ukuqinisekisa uxhulumaniso olusebenzayo lombane.
Ukugrumba ngeLaser
Ukugrumba ngoomatshini kwimingxuma yinkqubo ebalulekileyo kushishino lwePCB. Ngemingxuma, okanye ngemingxuma, kukho ukuvuleka kwe-cylindrical okudlula ngokupheleleyo kwibhodi kwaye kudibanise icala elinye kwelinye. Zisetyenziselwa ukunyuswa kwamacandelo kunye nokudibanisa iisekethe zombane phakathi kweengqimba. Ukugrumba ngemingxunya ngoomatshini kubandakanya ukusebenzisa izixhobo ezikhethekileyo ezinje ngobhobhozo, iireamers, kunye neecountersink ukudala ezi zivulo ngokuchanekileyo nangokuchaneka. Le nkqubo inokwenziwa ngesandla okanye ngoomatshini abazenzekelayo ngokuxhomekeke kubunzima boyilo kunye neemfuno zokuvelisa. Umgangatho wokugaya oomatshini uchaphazela ngokuthe ngqo ukusebenza kwemveliso kunye nokuthembeka, ngoko ke eli nyathelo kufuneka lenziwe ngokuchanekileyo rhoqo. Ngokugcina imigangatho ephezulu ngokugrumba ngoomatshini, ngokusebenzisa imingxuma inokwenziwa ngokuthembekileyo nangokuchanekileyo ukuqinisekisa uxhulumaniso olusebenzayo lombane.
Imiqathango yePCB ngoyilo
Qinisekisa ukuba i-vias ayisondelanga kakhulu kumacandelo okanye ezinye ii-as.
I-Vias yinxalenye ebalulekileyo yoyilo lwePCB kwaye kufuneka ibekwe ngononophelo ukuqinisekisa ukuba azibangeli nakuphi na ukuphazamiseka kwamanye amacandelo okanye nge-vias. Xa i-vias isondele kakhulu, kukho umngcipheko we-short-circuiting, enokonakalisa kakhulu i-PCB kunye nawo onke amacandelo axhunyiwe. Ngokutsho amava Viasion, ukunciphisa lo mngcipheko, vias kufuneka ibekwe ubuncinane 0.1 intshi kude amacandelo, kwaye vias kufuneka ibekwe kufutshane ngaphezu 0.05 intshi omnye komnye.
Qinisekisa ukuba i-vias ayithungelani ngemikhondo okanye iipads kumaleko angabamelwane.
Xa uyila vias ibhodi yesekethe, kubalulekile ukuqinisekisa vias musa ukutyhoboza nayiphi na imikhondo okanye pads kwezinye maleko. Kungenxa yokuba i-vias inokubangela iibhulukhwe zombane, ezikhokelela kukungasebenzi kakuhle kwenkqubo kunye nokusilela. Njengoko iinjineli zethu zicebisa, i-vias kufuneka ibekwe ngobuchule kwiindawo ezingenalo umkhondo okanye iipads ukunqanda lo mngcipheko. Ukongeza, iya kuqinisekisa ukuba vias musa ukuphazamisana nezinye izinto kwi PCB.
Thatha ingqalelo yangoku kunye neqondo lobushushu xa uyila vias.
Qinisekisa ukuba i-vias ine-plating yobhedu elungileyo ukulungiselela ukuthwala kwangoku.
ukuqholwa kwee-vias kufuneka kuqwalaselwe ngononophelo, kuthintelwe iindawo apho kunokuba nzima okanye kungenzeki.
Qonda iimfuno zoyilo phambi kokuba ukhethe ngobungakanani kunye neentlobo.
Soloko ubeka nge-0.3mm ukusuka kwincam yebhodi ngaphandle kokuba kuchazwe ngenye indlela.
Ukuba ii-vias zibekwe kufutshane kakhulu kwenye, zinokuyonakalisa ibhodi xa yombiwa okanye ihanjiswa.
Kubalulekile ukuqwalasela umlinganiselo we-vias ngexesha loyilo, njengoko i-vias enomlinganiselo ophezulu inokuchaphazela ingqibelelo yomqondiso kunye nokutshatyalaliswa kobushushu.
Qinisekisa ii-vias ukuba zivulwe ngokwaneleyo kwezinye vias, amacandelo kunye nemiphetho ibhodi ngokwemithetho yoyilo.
Xa ii-vias zibekwe ngababini okanye amanani abaluleke ngakumbi, kubalulekile ukuwasasaza ngokulinganayo ukuze usebenze ngokufanelekileyo.
Qaphela i-vias enokuthi isondele kakhulu kumzimba wecandelo, njengoko oku kunokubangela ukuphazamiseka kweempawu ezidlulayo.
Ukuqwalasela ngokudlula kufutshane neenqwelomoya.
Kufuneka zibekwe ngononophelo ukunciphisa umqondiso kunye nengxolo yamandla.
Cinga ngokubeka i-vias kumaleko afanayo njengemiqondiso apho kunokwenzeka, njengoko oku kunciphisa iindleko ze-vias kunye nokuphucula ukusebenza.
Ukunciphisa ukubalwa kwe-vias ukunciphisa ukuntsokotha koyilo kunye neendleko.
Iimpawu zoomatshini zePCB ngomngxuma
Ngedayamitha yomngxuma
Idayamitha yemingxuma kufuneka igqithe i-diameter ye-plug-in component pin kwaye ugcine umda othile. Ubuncinci bedayimitha enokuthi i-wiring ifikelele kwimingxuma inqunyelwe ngokubhola kunye neteknoloji ye-electroplating. Incinci ngedayamitha yomngxuma, isithuba esincinci kwi-PCB, incinci i-parasitic capacitance, kwaye ngcono ukusebenza kwe-high-frequency, kodwa iindleko ziya kuba phezulu.
Iphedi yomngxuma
I-pad iqaphela uxhulumaniso lombane phakathi komgangatho wangaphakathi we-electroplating we- through-hole kunye ne-wiring kumphezulu webhodi yesekethe eprintiweyo (okanye ngaphakathi).
Ubunakho bomngxuma
i-ach emngxunyeni inamandla e-parasitic emhlabeni. I-capacitance ye-parasitic capacitance iya kucotha okanye yonakalise umda onyukayo wesignali yedijithali, engathandekiyo ukuhanjiswa kwesignali ye-high-frequency. Yeyona mpembelelo imbi ye- through-hole parasitic capacitance. Nangona kunjalo, kwiimeko eziqhelekileyo, impembelelo ye-capacitance ye-parasitic capacitance yi-minute kwaye ingaba yinto engathandabuzekiyo-i-diameter encinci ye-capacitance encinci, encinci ye-parasitic capacitance.
Ukwenziwa komngxuma
Ngokusebenzisa imingxunya edla ngokusetyenziswa kwiiPCBs ukudibanisa izinto zombane, kodwa zinokuba nesiphumo esingalindelekanga: inductance.
I-inductance yipropathi yemingxuma eyenzeka xa umbane uqukuqela kuyo kwaye ibangela umhlaba wamagnetic. Lo mmandla wemagnethi unokubangela ukuphazamiseka kolunye uqhagamshelo lomngxuma, okukhokelela ekulahlekeni komqondiso okanye ukugqwetheka. Ukuba sifuna ukunciphisa ezi ziphumo, kubalulekile ukuqonda ukuba i-inductance isebenza njani kwaye ngawaphi amanyathelo oyilo onokuwathatha ukunciphisa impembelelo yawo kwiiPCB zakho.
Idayamitha yemingxuma kufuneka igqithe i-diameter ye-plug-in component pin kwaye ugcine umda othile. Ubuncinci bedayimitha enokuthi i-wiring ifikelele kwimingxuma inqunyelwe ngokubhola kunye neteknoloji ye-electroplating. Incinci ngedayamitha yomngxuma, isithuba esincinci kwi-PCB, incinci i-parasitic capacitance, kwaye ngcono ukusebenza kwe-high-frequency, kodwa iindleko ziya kuba phezulu.
Kutheni le nto iPCB kufuneka iplagwe nge-vias?
Nazi ezinye izizathu zokuba kutheni i-PCB vias kufuneka iplagwe, ishwankathelwe yi-Shenzhen Rich Full Joy Electronics Co., Ltd :
I-Shenzhen eTyebileyo yoLuvuyo lwe-Electronics Co., Ltd:
PCB vias zibonelela ikhonkco emzimbeni ukuya amacandelo entabeni kwaye uqhagamshele umaleko PCB ezahlukeneyo, ngaloo ndlela ivumela ibhodi ukwenza umsebenzi ocetyiweyo efficiently.PCB vias nazo zisetyenziselwa ukuphucula ukusebenza thermal PCB kunye nokunciphisa ilahleko uphawu. Njengoko PCB vias umbane umbane ukusuka kwelinye umaleko PCB ukuya kwenye, kufuneka iplagwe ukuqinisekisa uqhagamshelwano phakathi umaleko ezahlukeneyo PCB.Okokugqibela, PCB vias ukunceda ukuthintela imijikelezo ezimfutshane ngokuphepha ukudibana nawo nawaphi na amanye amacandelo evezwe kwi PCB.Ngoko ke, I-PCB vias kufuneka iplagwe ukuthintela nakuphi na ukungasebenzi kombane okanye umonakalo kwi-PCB.
Isishwankathelo
Ngamafutshane, i-PCB vias zizinto ezibalulekileyo ze-PCBs, ezivumela ukuba zihambise imiqondiso ngendlela esebenzayo phakathi kweemaleko kunye nokudibanisa izinto ezahlukeneyo zebhodi. Ngokuqonda iintlobo zazo ezahlukeneyo kunye neenjongo, unokuqinisekisa ukuba uyilo lwePCB yakho lulungiselelwe ukusebenza kunye nokuthembeka.
I-Shenzhen Rui Zhi Xin Feng Electronics Co., Ltd. ibonelela ngokwenziwa kwe-PCB ebanzi, ukufumana icandelo, indibano ye-PCB, kunye neenkonzo zokwenza i-elektroniki. Ngaphezulu kweminyaka engama-20 yamava, siye sazisa izisombululo ezikumgangatho ophezulu wePCBA ngamaxabiso akhuphisanayo kubathengi behlabathi abangama-6,000. Inkampani yethu ineziqinisekiso ezahlukeneyo zoshishino kunye nemvume ye-UL. Zonke iimveliso zethu zihlolwa i-100% yovavanyo lwe-E, i-AOI, kunye neX-RAY ukuhlangabezana neyona migangatho iphezulu yoshishino. Sizimisele ukubonelela ngomgangatho obalaseleyo kunye nokuthembeka kuyo yonke iprojekthi yendibano yePCB.
PCB Laser Drilling PCB Mechanical Drilling
Laser Drilling for PCBs PCB Drilling
PCB Laser Umngxuma Drilling Mechanical Drilling for PCBs
PCB Microvia Laser Drilling PCB Hole Hole
PCB Laser Drilling Technology PCB Drilling Inkqubo
Intshayelelo yeNkqubo yoKwemba:
1. UkuPina, Ukugrumba, kunye nokuFunda uMngxuma
Injongo:Ukwemba imingxunya kumphezulu we-PCB ukuseka uqhagamshelo lombane phakathi kweeleya ezahlukeneyo.
Ngokusebenzisa izikhonkwane eziphezulu zokomba kunye nezikhonkwane ezisezantsi zokufunda umngxuma, le nkqubo iqinisekisa ukudalwa kwee-vias eziququzelela uqhagamshelwano lwesekethe ye-interlayer kwibhodi yesekethe eprintiweyo (PCB).
Ukugrunjwa kwe-CNC:
Injongo:Ukwemba imingxunya kumphezulu we-PCB ukuseka uqhagamshelo lombane phakathi kweeleya ezahlukeneyo.
Izixhobo ezingundoqo:
Amasuntswana oKwemba:Yenziwe nge-tungsten carbide, i-cobalt, kunye ne-organic adhesives.
Ipleyiti ye-cover:Ngokuyintloko i-aluminiyam, esetyenziselwa ukubeka i-drill bit, ukutshatyalaliswa kobushushu, ukunciphisa ii-burrs, kunye nokuthintela umonakalo wonyawo loxinzelelo ngexesha lenkqubo.
Ipleyiti yokuxhasa:Ikakhulu ibhodi edibeneyo, esetyenziselwa ukukhusela itafile yomatshini wokomba, ukuthintela ukuphuma kwe-burrs, ukunciphisa ubushushu be-drill bit, kunye nokucoca intsalela yentlaka evela kwi-drill bit flutes.
Ngokusebenzisa i-CNC echanekileyo ephezulu, le nkqubo iqinisekisa uqhagamshelwano oluchanekileyo noluthembekileyo lwe-interlayer kwiibhodi zesekethe eziprintiweyo (PCBs).
Ukuhlolwa komngxuma:
Injongo:Ukuqinisekisa ukuba akukho ziphazamiso ezifana nokugrumba ngokugqithisileyo, ukugrunjwa ngaphantsi, imingxuma evalekileyo, imingxuma emikhulu, okanye imingxuma engaphantsi kobukhulu emva kwenkqubo yokomba.
Ngokuqhuba uhlolo olucokisekileyo lomngxuma, siqinisekisa umgangatho kunye nokuhambelana kwendlela nganye, ukuqinisekisa ukusebenza kombane kunye nokuthembeka kwebhodi yesekethe eprintiweyo (PCB).