FPC

I-1.FPC-Flexible Printed Circuit, isekethe eprintiweyo ethembekileyo kakhulu kwaye eguquguqukayo eyenziwe ngokubethelela kwifoyile yobhedu usebenzisa ifilimu yepolyester okanye i-polyimide njenge-substrate ukwenza isekethe.

2. Iimpawu zeMveliso: ① Ubungakanani obuncinci kunye nobunzima obulula : Ukwanelisa iimfuno zoxinzelelo oluphezulu, i-miniaturization, ubunzima, ukubhitya kunye nokuthembeka okuphezulu komkhombandlela wophuhliso; ② Ukuguquguquka okuphezulu : inokuhamba kwaye yandise ngokukhululekileyo kwindawo ye-3D, ifezekise indibano yecandelo elidibeneyo kunye nokudibanisa ucingo.

Isicelo seFPC:

ikhamera, ikhamera yevidiyo, i-CD-ROM, iDVD, i-hard drive, i-laptop, ifowuni, ifowuni ephathwayo, umshicileli, umatshini wefeksi, i-TV, izixhobo zonyango, i-automotive electronics, i-aerospace kunye neemveliso zomkhosi.

Ngokwenani leeleya zokuqhuba, zinokwahlulwa zibe yibhodi enecala elinye, ibhodi enamacala amabini kunye nebhodi enemigangatho emininzi.

Ibhodi enecala elinye : umqhubi kwicala elinye kuphela

Ibhodi enamacala amabini : kukho iikondaktara ezi-2 kumacala omabini, kunye nokuseka uqhagamshelo lombane phakathi kweekondaktara ezi-2 ngomngxuma (udlula) njengebhulorho. Umngxuma odlulayo ngumngxuma omncinci wobhedu obekwe eludongeni lomngxuma onokudityaniswa neesekethe kumacala omabini.

Ibhodi ye-Multi-layer : iqulethe i-3 okanye ngaphezulu kwee-conductors, kunye noyilo oluchanekileyo.

Ngaphandle kwebhodi enecala elinye, inani leeleya zebhodi eyomeleleyo ziqhelekile, ezinje nge-2, 4, 6, 8 umaleko, ngakumbi ngenxa yokuba ulwakhiwo olumnqakathi lokupakisha luyi-asymmetric kwaye luthambekele kwi-warping yebhodi. Kwelinye icala, i-PCB eguquguqukayo yahlukile njengoko kungekho ngxaki yokulwa, ngoko ke i-3-layer, i-5-layer, njl.

Ifoyile yobhedu yahlulwa ibe yi-Electro-Deposited copper (ED Copper) kunye neRolled Annealed copper (RA Copper)

1oz ≈ 35um

I-OZ ngokwenene yiyunithi yobunzima, ilingana ne-1/16 yeponti, malunga ne-28.35g.

Kushishino lwebhodi yesekethe, ubukhulu be-1oz copper ebekwe mcaba ngaphakathi kwewquare foot enye ichazwa njenge-1oz. Ngoko ngamanye amaxesha abathengi bacela i-28.35g yobhedu, kufuneka siqonde ngokukhawuleza ukuba oku kuyimfuneko ye-1oz yobhedu.

Umsebenzi wemaski ye-solder: ① ukugqunyelelwa komphezulu ② khusela isekethe kwaye uthintele umonakalo kwisekethe ③ uthintele izinto zangaphandle eziqhubayo ekusileleni kwisekethe kwaye zibangele iisekethe ezimfutshane

Kukho iintlobo ezimbini zezixhobo zemaski ze-solder : i-inki kunye ne-coverlay

I-inki esetyenziselwa i-solder imaski idla ngokuba yifotoensitive kwaye ibizwa ngokuba yi-liquid photo imageableble, efinyeziweyo njenge-LPI. Ifumaneka ngokubanzi ngombala oluhlaza, omnyama, omhlophe, obomvu, omthubi, oluhlaza okwesibhakabhaka, njl.

I-Coverlay, efumaneka ngetyheli (ezinye zibizwa ngokuba yi-amber), emnyama namhlophe. Umnyama unomnyama olungileyo kwaye umhlophe unokubonakala okuphezulu, okunokungena endaweni ye-inki emhlophe kwiibhodi eziguqukayo zesibane.

Kwimeko yebhodi eguquguqukayo, zombini i-inki kunye ne-coerlay ingasetyenziselwa imaski ye-soler. Ngoko ke yintoni uthelekiso phakathi kwezinto eziluncedo nezingeloncedo kwezi zimbini? Nceda ujonge le theyibhile ingezantsi:

Umsebenzi wokugqitywa kwendawo kukukhusela i-oxidation yobhedu, ukubonelela nge-welding okanye i-bonding layer.

Ngokuqhelekileyo kukho iindlela ezininzi zokugqiba umphezulu njengoko kungezantsi: iinkcukacha zokugqiba umphezulu.

OSP: Organic solderability preservatives OSP:0.2-0.5um

UkuTyala i-Ni/Au yokuTyala iTin: 4-20um

ENIG: Electroless Nickel Immersion Gold ENIG: 0.05-0.1um

I-Plating Sn / Tin Ukufakwa kwegolide: 0.1-1um

Ukuntywiliselwa kwe-Sn / iTin yokuntywiliselwa kwiTin: 0.3-1.2um

Ukuntywiliselwa Ag Ukuntywiliselwa Ag: 0.07-0.2um.

Uthelekiso lweendleko : UkuPlating Ni/Au(ENIG) > Ukuntywiliselwa Ag > UkuPlating Sn/Tin (Ukuntywila Sn/Tin) > OSP.

Ngokungafani nebhodi eqinile, ibhodi eguquguqukayo ayinakho ukuqina okufanayo kunye namandla omatshini njengebhodi eqinile, ngoko ayikwazi ukulungiswa kakuhle ngezikrufu okanye ukufaka i-slots yekhadi. Ngokuqhelekileyo, kuyimfuneko ukuyilungisa kwisixhobo kunye ne-adhesive-side adhesive ukukhusela i-FPC ukuba ingagungqi emva kokuhlanganisana. Ukongeza, i-adhesive enamacala amabini ingasetyenziselwa ukuncamathisela into eqinileyo kwi-FPC.

I-DST (i-Double-Sided Tape), eyaziwa ngokuba yi-Adhesive-Sensitive Adhesive (PSA), i-adhesive ephindwe kabini esetyenziselwa i-FPC.

I-Adhesive Sensitive Adhesive inokwahlulwa ibe yi-adhesive eqhelekileyo, i-high-temperature resistant adhesive, i-adhesive conductive kunye ne-thermal conductive adhesive.

I-adhesives eqhelekileyo ibandakanya i-3M467,3M468, i-adhesive conductive iquka i-3M9703,3M9713

I-adhesives ye-thermal conductive iquka i-3M8805,3M9882

I-adhesive-resistant resistant adhesive ibhekisela kwi-adhesive enokumelana nokushisa okuphezulu kwe-SMT ixesha elifutshane, elisetyenziselwa iibhodi ezifuna ukunyuswa kwe-SMT. I-adhesives esetyenziswa ngokuqhelekileyo iquka i-3M9460,3M9077,3M9079,TESA8853, njl.

Kukho iintlobo ezininzi zee-stiffeners ezingezantsi:

I-Stainless Steel (SS) : Abanye abathengi babonisa i-SUS kwimizobo yabo, kodwa ngokwenene, oku kukuqina kwentsimbi. I-SUS luhlobo oluqhelekileyo olusetyenziswayo lwamashiti ensimbi.

AL:Aluminiyam

FR4

Polyimide

Ipolyester

I-Electro-Magnetic Interference (EMI) yinto eqhelekileyo, ngakumbi kwiisekethe eziphezulu ze-frequency, ukuqinisekisa ingqibelelo yesiginali ngaphandle kokuphazamiseka, ukukhuselwa kwe-electromagnetic kuyimfuneko.Izixhobo ezisetyenziselwa ukukhusela i-electromagnetic ye-FPC ikakhulu ziquka i-inki yesilivere kunye nefilimu ye-inki yesilivere. .

I-inki yesilivere yinto efana nentlama kunye namasuntswana esilivere esinyithi kunye nentlaka. Inokuprintwa kwi-FPC njenge-inki yesikrini sesilika kwibhodi eqinileyo, kwaye emva koko iyabhakwa kwaye iqiniswe. Ukuthintela i-oxidation yesilivere emoyeni, umaleko we-inki okanye ifilimu yokukhusela idla ngokuprintwa kwi-inki yesilivere ukukhusela.

Iimbumba ezisetyenziswa ngokuqhelekileyo zohlulwe zibe ngundo lwemela kunye nokungunda kwentsimbi. Ukuchaneka kokungunda kweemela kuphantsi, kunye nokunyamezela kokubumba malunga +/-0.3mm. Ukuchaneka kobunjwa bensimbi kuphezulu, kunye nobumba obuqhelekileyo bensimbi malunga ne-+/-0.1mm kunye nentsimbi echanekileyo yokubumba ukuya ku-+/-0.05mm. Isizathu sokuba ixabiso lokubumba intsimbi liphindaphindwe kaninzi okanye amashumi amatyeli exabiso lokungunda kweemela.

Imibumbo yeemela ikwabizwa ngokuba zizixhobo ezithambileyo, kunye nokubumba intsimbi kwaziwa ngokuba zizixhobo eziqinileyo.

Sebenzisa isixhobo sokuhlola umbane ukunika amandla ngokupheleleyo kwimveliso ukujonga iziphene ezinzulu ezifana nokuvula, okufutshane, njl njl kwiisekethe zemveliso. Kwinqanaba lesampulu, ubungakanani buncinci, ukwenzela ukugcina iindleko zokuvula isakhelo sokuvavanya, i-flying probe isetyenziselwa uvavanyo. Nangona kunjalo, uvavanyo lweprobe yokubhabha luntsonkothile kwaye luthatha ixesha elide lukhokelela ekusebenzeni okuphantsi. Ngoko ke, uvavanyo luqhutyelwa ngokusebenzisa isakhelo sokuvavanya (ukulungiswa, i-jig) ngexesha lokuvelisa ubuninzi.

Iziphene ezinokufunyanwa ngexesha lokuhlolwa kombane ziquka: into; vula mfutshane.

Ingqalelo kufuneka ihlawulwe kwisenzeko seziphene ngexesha lokuhlolwa kombane : imikrwelo kwindawo yokugqiba umphezulu ebangelwa ziiprobe zokuhlola umbane.

Ukuqhuba uhlolo olubanzi lweemveliso ezigqityiweyo zomntu ngamnye ngokwemigangatho yokuhlola

Kukho iindlela ezininzi zokuhlola ngokweemfuno ezahlukeneyo zemveliso njengalapha ngezantsi:

① ukuhlolwa okubonakalayo

② uhlolo lwemicroscopic (ubuncinci 10X)

Ukujonga ubukhulu becala inkangeleko, kubandakanywa imikrwelo, izibonda, imibimbi, i-oxidation, i-blistering, i-solder mask misalignment, i-drilling misalignment, izithuba zesekethe, i-copper eseleyo, izinto zangaphandle, njl.