Zeziphi iintlobo ze-IC Substrate PCB ezikhoyo?
Ngokwezinto eziphathekayo, zinokwahlulwa zibe: I-Rigid, flexible, ceramic, polyimide, BT, njl.
Ngokutsho kweteknoloji, inokwahlulwa ibe: BGA, CSP, FC, MCM, njl.
Ziziphi ii-Ic Substrate Applications?
Umvelisi we-BGA substrates
Ukubanjwa ngesandla, iMobile, iNethiwekhi
I-Smart phone, i-Consumer electronics kunye ne-DTV
I-CPU, iGPU kunye neChipset yesicelo sePC
CPU, GPU for Game Console (umz. X-Box, PS3, Wii…)
I-DTV Chip Controller, iBlu-Ray Chip Controller
Usetyenziso lwezibonelelo (umzekelo. Uthungelwano, iSikhululo esiSiseko…)
Ii-ASIC ze-ASIC
Digital Baseband
Ulawulo lwamandla
Umzobo weProsesa
Umlawuli wemultimedia
Iprosesa yesicelo
Ikhadi lememori yeemveliso ze-3C (umzekelo. Iselula/DSC/PDA/GPS/Pocket PC/NoteBook)
Ukusebenza okuphezulu kwe-CPU
GPU, ASIC Izixhobo
Idesktop / iseva
Uthungelwano
Yintoni iPackage Substrate ye-CSP yesicelo?
Imemori, i-analog, i-ASICs, ingqiqo, izixhobo zeRF,
Incwadi yamanqaku, iSubnotebook, iiKhompyutha zoBuqu,
I-GPS, iPDA, inkqubo yonxibelelwano engenazingcingo
Zeziphi iingenelo zokusebenzisa i-PCB yesekethe edibeneyo yesekethe?
Ii-substrates zesekethe ezidityanisiweyo ii-PCBs zibonelela ngombane ogqwesileyo kunye nendawo yebhodi encitshisiweyo, evumela ukuhlanganiswa kwee-ICs ezininzi kwibhodi yesekethe enye. Ii-substrates zesekethe ezidityanisiweyo ze-PCBs zikwabonisa ukusebenza okuphuculweyo kwe-thermal ngenxa yokungaguquguquki kwe-dielectric ephantsi, ekhokelela ekuthembekeni okungcono kunye nemijikelo yobomi obude. Ii-substrates zesekethe ezidityanisiweyo ze-PCB zineempawu ezibalaseleyo zombane, kubandakanywa neempawu ze-high-frequency, kunye ne-signal attenuation encinci kunye namanqanaba e-crosstalk.
Zeziphi izinto ezingeloncedo ngokusebenzisa i-IC Substrate PCB?
Iisubstrates ze-IC zifuna ubuchwephesha kunye nobuchule bokwenza, njengoko ziqulethe iileya ezininzi zeentambo ezintsonkothileyo, iikhomponenti, kunye neepakethe ze-IC.
Ukongeza, ii-substrates ze-IC zihlala zibiza kakhulu ukwenza ngenxa yokuntsokotha kwazo.
Okokugqibela, ii-substrates ze-IC zikwathanda ukungaphumeleli ngenxa yobungakanani bazo obuncinci kunye neentambo ezintsonkothileyo.
Yintoni umahluko phakathi kwe-IC Substrate PCB kunye ne-PCB eqhelekileyo?
I-IC substrate PCBs yahlukile kwii-PCB eziqhelekileyo kuba ziyilelwe ngokukodwa ukuxhasa iitshiphusi ze-IC kunye namalungu apakishwe nge-IC. Ngokuphathelele kwimveliso ye-PCB, i-IC Substrate Manufacturing inzima kakhulu kune-PCB eqhelekileyo ngenxa yokuba i-drill kunye nomkhondo wayo ophezulu.
Ngaba i-IC Substrate PCB ingasetyenziselwa ukwenza iprototyping?
Ewe, i-PCB yephakheji ye-IC ingasetyenziselwa ukwenza iprototyping.
Yintoni iPBGA Package Substrate Isicelo
I-ASIC, i-DSP kunye neMemori, i-Gate Arrays,
Microprocessors / Abalawuli / Graphics
Iichipset zePC kunye neeperipherals
Iiprosesa zemizobo
Iibhokisi zokuseta-Phezulu
IiConsoles zeMidlalo
Gigabit Ethernet
Bubuphi ubunzima bokwenziwa kwebhodi ye-IC substrate?
Owona mceli mngeni mkhulu kakhulu kukuxinana okuphezulu okufana ne-0.1 mm ye-dias eyimfama kunye nokungcwatywa ngokudlula, ukupakishwa nge-micro kuxhaphake kakhulu kukwenziwa kwee-PCB zesekethe ezidityanisiweyo. Kwaye indawo yokulandelela kunye nobubanzi ingaba yincinci njenge-0.025 mm. Ke kubaluleke kakhulu ukufumana iifektri ze-IC ezithembekileyo zohlobo olunjalo lweebhodi zesekethe eziprintiweyo.