I-R&D ye-Beidou chip mounting amacandelo

I-chip ye-BeiDou ibandakanya i-chipset yeRFiitshiphusi, iitshiphusi ze-baseband, kunye ne-microprocessors. Izixhobo ezifanelekileyo zinokufumana iimpawu ezithunyelwa ngeesathelayithi ze-BeiDou nge-chip ye-BeiDou, ngaloo ndlela igqibezela imisebenzi yokubeka kunye nokuhamba. Iichips zokubeka i-BeiDou zisetyenziswa ngokubanzi kwiinkalo ezininzi zoluntu lwanamhlanje, kwaye kufuneka zifakwe kwiibhodi zesekethe ukuze zisetyenziswe.

Okwangoku, ukufakwa kweetshiphusi zeBeidou kuhlala kugqitywa ngokusebenza koomatshini. Ngexesha lofakelo, iitshiphusi zihlala zibhengezwa ngeekomityi zokufunxa, kwaye emva koko zifuduselwe kwibhodi yesekethe ukuze zidibanise. Nangona kunjalo, iikomityi zangoku zokufunxa azinazo izixhobo zokubeka, ezinokushenxa ngokulula kumbindi wetshiphu xa zibhengezwa. Oku kunokukhokelela ekuphambukeni ngexesha lofakelo lwe-chip, okukhokelela ekungaphumeleli kwe-welding. Ke ngoko, inkampani yethu icebise nge-R&D ye-Beidou yofakelo lwetshiphu ukusombulula iingxaki ezikhoyo.

Rich Full Uvuyo Solution Technical

I-1.Ukwamkela iteknoloji yokubeka i-precision ephezulu ukufezekisa ukubeka okuphezulu kwe-chips ye-Beidou, ukuqinisekisa ukuchaneka kweendawo zokunyuka.

2.Ngokuseta ipleyiti yokubeka, isixhobo siqalisa imotor xa sithatha itshiphu, kwaye sisebenzise imotor ukuqhubela umva Screw ukujikeleza. Umkhono wesikrufu utyibilika ngokuthe tye phantsi kwesenzo somsonto womphezulu wesikrufu esingasemva. Ngolu seto, isithuba phakathi kweepleyiti zokumisa singalungelelaniswa kwindawo efanelekileyo ngokobungakanani betshiphu, emva koko ingalo yomatshini ihambisa ikomityi yokufunxa ngaphezulu kwetshiphu.

3.Ibhodi yokumisa ibeka itshiphu ukuze ikomityi yokufunxa ibekwe kumbindi womphezulu wetshiphu. Emva koko, i-cylinder yombane iqala ukuthoba ikomityi yokufunxa kwaye idibanise nomphezulu we-chip. Kwangaxeshanye, impompo yokufunxa iqala ukuvelisa uxinzelelo olubi kwikomityi yokufunxa kwaye ibhengeze itshiphu. Xa unyuka, ibhodi yokumisa ibekwe kwindawo yokubeka i-chip, kwaye emva koko i-cylinder yombane ikhupha ukubeka i-chip kwibhodi yesiphaluka.

4.Ngokuseta i-fan, umoya ovuthelwe ngumlandeli emva kokuqala udluliselwe kwi-groove yomoya yebhodi yokumisa nge-duct yomoya, kwaye uvuthelwe ngaphandle kwi-outlet yomoya engaphantsi kwebhodi yokumisa. Esi sicwangciso sivumela ukususwa kothuli lwebhodi yesekethe phambi kofakelo lwe-chip, ukuthintela uthuli ukuba lunamathele kumphezulu webhodi yesekethe ukuchaphazela ukufakwa okuqhelekileyo kwetshiphu.

Rich Full Uvuyo Amanqaku Innovative

1. Ngokusebenzisa ipleyiti yokubeka indawo ukuze ufumane kwaye ubuyise itshiphu, ikomityi yokufunxa inokuqhotyoshelwa embindini wetshiphu, nto leyo ephucula ukuchaneka kokunyuswa kwetshiphu kwaye ithintele ukuwisa ngempazamo kwetshiphu ngenxa yokufuduswa kwesincamatheliso sekomityi yokufunxa. isikhundla.

2.Ngokumisela i-fan, ibhodi yesekethe inothuli phambi kokufakwa kwe-chip, ukuthintela uthuli ukuba lunamathele kumphezulu webhodi yesekethe ukuchaphazela ukufakwa okuqhelekileyo kwe-chip.

3.Ukupolisha udonga lwangaphakathi lwepleyiti yokubeka inokuthintela ukungquzulana phakathi kwepleyiti yokubeka kunye neekona ze-chip, ezinokubangela ukunxiba kwe-chip.

Imiba eshukuxwa nguRich Full Joy

1.Isonjululwe ingxaki yokungachaneki kokubekwa kweetekhnoloji ezikhoyo.

2.Isonjululwe ingxaki yokunxitywa kwetshiphu okubangelwa bubuchwephesha obukhoyo ngexesha lokwenziwa kwetshiphu.

I-3.Inomsebenzi wokumisa ochanekileyo kunye nokulungelelaniswa kokusingqongileyo.

4.Realizedefficient kunye nomgangatho ophezulu inkqubo yokufaka ukuqinisekisa ukuthembeka kunye nokuzinza amacandelo.