Umahluko phakathi kweePCB zeCeramic kunye neePCB zezeMveli zeFR4

Phambi kokuba sixoxe ngalo mba, masiqale siqonde ukuba zeziphi ii-PCB zeceramic kwaye zithini ii-FR4 PCBs.

Ibhodi yeSekethe yeCeramic ibhekiselele kuhlobo lwebhodi yesekethe eyenziwe ngokusekwe kwimathiriyeli yeceramic, eyaziwa ngokuba yiCeramic PCB (ibhodi yesekethe eprintiweyo). Ngokungafaniyo ne-fiber yeglasi eqhelekileyo eyomeleziweyo (FR-4) substrates, iibhodi zeesekethe ze-ceramic zisebenzisa i-ceramic substrates, ezinokubonelela ngokuzinza okuphezulu kobushushu, amandla angcono omatshini, iipropati ezingcono ze-dielectric, kunye nobomi obude. IiPCB zeCeramic zisetyenziswa ikakhulu kumaqondo obushushu aphezulu, amaza aphezulu, kunye neesekethe zamandla aphezulu, ezinje ngezibane ze-LED, izikhulisi zamandla, iisemiconductor lasers, iitransceivers zeRF, izinzwa, kunye nezixhobo zemicrowave.

Ibhodi yeSekethe ibhekisa kwizinto ezisisiseko kumacandelo e-elektroniki, eyaziwa ngokuba yiPCB okanye ibhodi yesekethe eprintiweyo. Ingumthwali wokudibanisa amacandelo e-elektroniki ngokuprinta iipateni zesekethe yesinyithi kwii-non-conductive substrates, kwaye emva koko udale iindlela zokuqhuba ngeenkqubo ezifana nokubola kweekhemikhali, ubhedu lwe-electrolytic, kunye nokugrumba.

Oku kulandelayo kuthelekiso phakathi kwe-ceramic CCL kunye ne-FR4 CCL, kubandakanywa ukungafani kwabo, inzuzo kunye nokungalunganga.

I-PCB yeCeramic

Iinkalo zokusetyenziswa kwezinto ezahlukeneyo:

I-Alumina Ceramic (Al2O3): Ine-insulation egqwesileyo, ukuzinza kobushushu obuphezulu, ukuqina, kunye namandla omatshini ukuze ilungele izixhobo zombane eziphezulu.

I-Aluminium Nitride Ceramics (i-AlN): Nge-conductivity ephezulu ye-thermal kunye nokuzinza okulungileyo kwe-thermal, ifanelekile kwizixhobo zombane eziphezulu zamandla kunye neendawo zokukhanyisa i-LED.

I-Zirconia ceramics (i-ZrO2): ngamandla amakhulu, ubunzima obuphezulu kunye nokuxhatshazwa kokugqoka, ifanelekile kwizixhobo zombane eziphezulu.

Imimandla yokusetyenziswa kweenkqubo ezahlukeneyo:

I-HTCC (i-High Temperature Co fired Ceramics): Ifanelekile kwi-high-temperature kunye nezicelo zamandla aphezulu, ezifana ne-electronics power, i-aerospace, unxibelelwano lwe-satellite, unxibelelwano lwe-optical, izixhobo zonyango, i-automotive electronics, i-petrochemical kunye namanye amashishini. Imizekelo yeemveliso ibandakanya ii-LED eziphezulu zamandla, i-amplifiers yamandla, i-inductors, i-sensor, i-capacitors yokugcina amandla, njl.

I-LTCC (i-Low Temperature Co fired Ceramics): Ifanelekile ukuveliswa kwezixhobo ze-microwave ezifana ne-RF, i-microwave, i-antenna, i-sensor, i-filter, i-power divider, njl. Ukongeza, ingasetyenziselwa unyango, i-automotive, i-aerospace, unxibelelwano, elektroniki kunye namanye amacandelo. Imizekelo yeemveliso ibandakanya iimodyuli ze-microwave, iimodyuli ze-antenna, izinzwa zoxinzelelo, izinzwa zegesi, i-acceleration sensors, izihlungi ze-microwave, izahluli zamandla, njl.

I-DBC (i-Direct Bond Copper): Ifanelekile ukutshatyalaliswa kobushushu bezixhobo eziphezulu ze-semiconductor (ezifana ne-IGBT, i-MOSFET, i-GaN, i-SiC, njl.) kunye ne-thermal conductivity egqwesileyo kunye namandla omatshini. Imizekelo yeemveliso ibandakanya iimodyuli zamandla, ii-elektroniki zamandla, abalawuli bezithuthi zombane, njl.

I-DPC (i-Direct Plate Copper Multilayer Printed Circuit Board): ikakhulu isetyenziselwa ukutshatyalaliswa kobushushu bezibane ze-LED ezinamandla kunye neempawu eziphezulu, ukuhanjiswa kwe-thermal, kunye nokusebenza kombane ophezulu. Imizekelo yeemveliso ibandakanya izibane ze-LED, ii-LED ze-UV, ii-COB LEDs, njl.

I-LAM (i-Laser Activation Metallization ye-Hybrid Ceramic Metal Laminate): ingasetyenziselwa ukutshatyalaliswa kobushushu kunye nokulungiswa kokusebenza kombane kwizibane eziphezulu zamandla e-LED, iimodyuli zamandla, izithuthi zombane kunye nezinye iinkalo. Imizekelo yeemveliso ibandakanya izibane ze-LED, iimodyuli zamandla, abaqhubi bezithuthi zombane, njl.

FR4 PCB

Iibhodi zokuthwala i-IC, iibhodi zeRigid-Flex kunye ne-HDI iimfama / ezingcwatywe ngeebhodi ziqhele ukusetyenziswa kwiintlobo zePCB, ezisetyenziswa kumashishini ahlukeneyo kunye neemveliso ngolu hlobo lulandelayo:

Ibhodi ye-IC carrier: Yibhodi yesekethe esetyenziswa ngokuqhelekileyo, isetyenziselwa ukuvavanya i-chip kunye nemveliso kwizixhobo zombane. Izicelo eziqhelekileyo ziquka ukuveliswa kwe-semiconductor, ukuveliswa kwe-elektroniki, i-aerospace, umkhosi, kunye nezinye iinkalo.

Ibhodi ye-Rigid-Flex: Yibhodi yezinto ezidibeneyo ezidibanisa i-FPC kunye ne-PCB eqinile, kunye neenzuzo zombini iibhodi zesekethe eziguquguqukayo neziqinileyo. Usetyenziso oluqhelekileyo lubandakanya i-elektroniki yabathengi, izixhobo zonyango, ii-elektroniki zemoto, i-aerospace, kunye nezinye iindawo.

I-HDI ingaboni / ingcwatywe ngebhodi: Yibhodi yesekethe eprintiweyo yoxinaniso oluphezulu olunoxinaniso lwelayini ephezulu kunye nokuvula okuncinci ukuphumeza ukupakishwa okuncinci kunye nokusebenza okuphezulu. Usetyenziso oluqhelekileyo lubandakanya unxibelelwano oluphathwayo, iikhompyuter, i-elektroniki yabathengi, kunye nezinye iinkalo.