Kosemi-Flex Board
Imọ-ẹrọ To ti ni ilọsiwaju diẹ sii & Solusan pipe.
Awọn anfani ti kosemi-Flex Board
Lasiko yi, oniru ti wa ni increasingly tele miniaturization, kekere iye owo ati ki o ga iyara ti awọn ọja, paapa ni awọn mobile ẹrọ oja , eyi ti o maa je ga-iwuwo itanna iyika. Lilo Awọn igbimọ Rigid-Flex yoo jẹ yiyan ti o tayọ fun awọn ẹrọ agbeegbe ti o sopọ nipasẹ IO. Awọn anfani pataki meje ti a mu nipasẹ awọn ibeere apẹrẹ ti iṣakojọpọ awọn ohun elo igbimọ rọ ati awọn ohun elo igbimọ ti kosemi ninu ilana iṣelọpọ, apapọ awọn ohun elo sobusitireti 2 pẹlu prepreg, ati lẹhinna iyọrisi asopọ itanna interlayer ti awọn oludari nipasẹ awọn iho tabi afọju / ti sin nipasẹ awọn ọna isalẹ wa bi isalẹ. :
3D ijọ lati din iyika
Igbẹkẹle asopọ to dara julọ
Din awọn nọmba ti irinše ati awọn ẹya ara
Dara impedance aitasera
Le ṣe ọnà gíga eka stacking be
Ṣe imuse apẹrẹ irisi ṣiṣan diẹ sii
Din iwọn
A rigid-flex ni a ọkọ ti o daapọ rigidity ati irọrun, processing mejeeji awọn rigidity ti kosemi ọkọ ati ni irọrun ti rọ ọkọ.
Ologbele FPC
Agbara Roadmap
| Nkan | Flex - Rigidi | Regal | Ologbele-Flex |
| Olusin |  |  |  |
| Ohun elo to rọ | Polyimide | FR4 + Ideri (Polyimide) | FR4 |
| Yiyi sisanra | 0.025 ~ 0.1mm (Yato si bàbà) | 0.05 ~ 0.1mm (Yato si bàbà) | Sisanra ti o ku: 0.25+/-0.05mm(ohun elo igbẹhin: EM825(I)) |
| Igun atunse | O pọju 180° | O pọju 180° | O pọju 180°(Layer Flex≤2) O pọju 90°(Flex Layer>2) |
| Ifarada Flexural; IPC-TM-650, Ọna 2.4.3. | NAA | ||
| Idanwo atunse; 1) Mandrel diam: 6.25mm | |||
| Ohun elo | Flex lati fi sori ẹrọ & Yiyi (ẹgbẹ ẹyọkan) | Flex lati fi sori ẹrọ | Flex lati fi sori ẹrọ |
| Dada Ipari | Iye Aṣoju | Olupese | |
| Volunteer Fire Department |  | 0.2 ~ 0.6um; 0.2 ~ 0.35um | Enthone Shikoku kemikali |
| GBA |  | Au: 0.03 ~ 0.12um, Ni: 2.5 ~ 5um | ATO tekinoloji / Chuang Zhi |
| ENIG yiyan |  | Au: 0.03 ~ 0.12um, Ni: 2.5 ~ 5um | ATO tekinoloji / Chuang Zhi |
| OLÓGÚN |  | Au : 0.05~0.125um, Pd: 0.05~0.125um, Ni :5~10um | Chuang Zhi |
| wura lile |  | Au: 0.2 ~ 1.5um, Ni: min 2.5um | Olusanwo |
| Asọ Gold |  | Au: 0.15 ~ 0.5um, Ni: min 2.5um | EEJA |
| Immersion Tin |  | min: 1um | Entone / ATO tekinoloji |
| Fadaka immersion |  | 0.15 ~ 0.45um | Macdermid |
| HASL & Asiwaju HASL(OS) ọfẹ |  | 1 ~ 25um | Nihon Superior |
Au/Ni Iru
● Fifun goolu le pin si wura tinrin ati wura ti o nipọn gẹgẹbi sisanra. Ni gbogbogbo, goolu ti o wa ni isalẹ 4u”(0.41um) ni a pe ni goolu tinrin, lakoko ti goolu loke 4u” ni a pe ni goolu ti o nipọn. ENIG le ṣe goolu tinrin nikan, kii ṣe goolu ti o nipọn. Pipa goolu nikan le ṣe mejeeji tinrin ati wura nipọn. Iwọn ti o pọju ti wura ti o nipọn lori igbimọ rọ le jẹ ju 40u ". Wura ti o nipọn jẹ lilo ni akọkọ ni awọn agbegbe iṣẹ pẹlu isunmọ tabi wọ awọn ibeere resistance.
● Fifun goolu le pin si goolu rirọ ati wura lile nipasẹ iru. Wura rirọ jẹ goolu lasan lasan, nigba ti goolu lile jẹ koluboti ti o ni goolu ninu. O jẹ deede nitori koluboti ti ṣafikun pe líle ti Layer goolu pọ si pupọ ju 150HV lati pade awọn ibeere resistance yiya.
| Ohun elo Iru | Awọn ohun-ini | Olupese | |
| Ohun elo kosemi | Ipadanu deede | DK> 4.2, DF>0.02 | NanYa / EMC / TUC / ITEQ / ShengYi / Isola / Doosan ati bẹbẹ lọ. |
| Aarin Isonu | DK> 4.1, DF: 0.015 ~ 0.02 | NanYa / EMC / TUC / ITEQ ati be be lo. | |
| Ipadanu Kekere | DK: 3.8 ~ 4.1, DF: 0.008 ~ 0.015 | EMC / NanYa / TUC / Isola / Panasonic ati be be lo. | |
| Gidigidi Isonu Isonu | DK: 3.0 ~ 3.8, DF: 0.004 ~ 0.008 | EMC / Panasonic / Rogers / TUC / Isola / ITEQ / NanYa ati be be lo. | |
| Ultra Low Isonu | DK | Rogers / TUC / ITEQ / Panasonic / Isola ati bẹbẹ lọ. | |
| BT | Awọ: funfun / dudu | MGC / Hitachi / NanYa / ShengYi ati be be lo. | |
| Ejò bankanje | Standard | Roughness (RZ) = 6.34um | NanYa, KB, LCY |
| RTF | Roughness (RZ) = 3.08um | NanYa, KB, LCY | |
| VLP | Roughness (RZ) = 2.11um | MITSUI, Circuit bankanje | |
| HVLP | Roughness (RZ) = 1.74um | MITSUI, Circuit bankanje | |
| Ohun elo Iru | DK/DF deede | DK/DF kekere | |||
| Awọn ohun-ini | Olupese | Awọn ohun-ini | Olupese | ||
| Ohun elo Flex | FCCL (Pẹlu ED & RA) | Polyimide deede DK: 3.0 ~ 3.3 DF: 0.006 ~ 0.009 | Thinflex / Panasonic / Taiflex | Atunṣe Polyimide DK: 2.8 ~ 3.0 DF: 0.003 ~ 0.007 | Thinflex / Taiflex |
| Ibori (Dudu/Ofeefee) | Deede alemora DK:3.3~3.6 Df:0.01~0.018 | Taiflex / Dupont | Adhesive Atunṣe DK: 2.8 ~ 3.0 DF: 0.003 ~ 0.006 | Taiflex / Arisawa | |
| Fiimu iwe adehun (Sisanra: 15/25/40 um) | Iposii deede DK: 3.6 ~ 4.0 DF: 0.06 | Taiflex / Dupont | Iposii Atunṣe DK: 2.4 ~ 2.8 DF: 0.003 ~ 0.005 | Taiflex / Arisawa | |
| S/M Inki | Solder boju;Awọ: Alawọ ewe / Blue / Dudu / Funfun / Yellow / Pupa | Iposii deede DK: 4.1 DF: 0.031 | Taiyo / OTC / AMC | Atunṣe iposii DK: 3.2 DF: 0.014 | Taiyo |
| Àlàyé inki | Awọ iboju: Dudu / Funfun / Yellow Inkjet Awọ: funfun | AMC | |||
| Awọn ohun elo miiran | IMS | Awọn sobusitireti Metallic ti o ya sọtọ (pẹlu Al tabi Cu) | EMC / Ventec | ||
| Ga Gbona Conductive | 1.0 / 1.6 / 2.2 (W/M*K) | ShengYi / Ventec | |||
| EMI | Fadaka bankanje (SF-PC6000-U1 / SF-PC8600-C) | Tatsuta | |||
Iyara giga & Ohun elo Igbohunsafẹfẹ Giga (Irọrun)
| DK | Df | Ohun elo Iru | |
| FCCL (Polyimide) | 3.0 ~ 3.3 | 0.006 ~ 0.009 | Panasonic R-775 jara; Thinflex A jara; Thinflex W jara; Taiflex 2up jara |
| FCCL (Polyimide) | 2.8 ~ 3.0 | 0.003 ~ 0.007 | Thinflex LK jara; Taiflex 2FPK jara |
| FCCL (LCP) | 2.8 ~ 3.0 | 0.002 | Thinflex LC jara; Panasonic R-705T se; Taiflex 2CPK jara |
| Ibori | 3.3 ~ 3.6 | 0.01 ~ 0.018 | Dupont FR jara; Taiflex FGA jara; Taiflex FHB jara; Taiflex FHK jara |
| Ibori | 2.8 ~ 3.0 | 0.003 ~ 0.006 | Arisawa C23 jara; Taiflex FFU jara |
| Idera dì | 3.6 ~ 4.0 | 0.06 | Taiflex BT jara; Dupont FR jara |
| Idera dì | 2.4 ~ 2.8 | 0.003 ~ 0.005 | Arisawa A23F jara; Taiflex BHF jara |
Back lu Technology
● Awọn itọpa Microstrip yẹ ki o ko ni nipasẹ, wọn gbọdọ ṣe iwadii lati ẹgbẹ itọpa.
● Wa kakiri ni ẹgbẹ keji yẹ ki o ṣe iwadii lati ẹgbẹ keji (Ẹgbẹ ifilọlẹ yẹ ki o wa ni ẹgbẹ yẹn).
● Apẹrẹ ti o dara ni pe awọn itọpa ila yẹ ki o ṣe iwadii lati ẹgbẹ eyikeyi ti o dinku julọ nipasẹ stub.
● Awọn esi to dara julọ fun ila ila yoo ṣee gba nipa lilo awọn ọna kukuru kukuru ti o jẹ sẹhin.
Ohun elo ọja:Sensọ radar adaṣe
Awọn alaye ọja:
4 PCB Layer pẹlu ohun elo arabara (Hydrocarbon + Standard FR4)
Iṣakojọpọ: 4L HDI / aibaramu
Ipenija:
Ohun elo igbohunsafẹfẹ giga pẹlu Standard FR4 Lamination
Liluho ijinle iṣakoso
Ohun elo ọja:Sensọ radar adaṣe
Awọn alaye ọja:
4 PCB Layer pẹlu ohun elo arabara (Hydrocarbon + Standard FR4)
Iṣakojọpọ: 4L HDI / aibaramu
Ipenija:
Ohun elo igbohunsafẹfẹ giga pẹlu Standard FR4 Lamination
Liluho ijinle iṣakoso
Ohun elo ọja:
Ibudo ipilẹ
Awọn alaye ọja:
Awọn fẹlẹfẹlẹ 30 (ohun elo isokan)
Iṣakojọpọ: Iwọn Layer giga / Symmetric
Ipenija:
Iforukọsilẹ fun kọọkan fẹlẹfẹlẹ
Ipin abala ti o ga julọ ti PTH
Lominu ni paramita lamination
Ohun elo ọja:
Iranti
Awọn alaye ọja:
Akopọ soke: 16 Layer Anylayer
Idanwo IST: Ipo: 25-190 ℃ Aago: 3 min, 190-25 ℃ Aago: 2 min, 1500 Cycles. Oṣuwọn iyipada resistance≤10%, Ọna idanwo: IPC-TM650-2.6.26. Esi: Pass.
Ipenija:
Laminating diẹ ẹ sii ju 6 igba
Lesa vias išedede
Ohun elo ọja:
Iranti
Awọn alaye ọja:
Akopọ: iho
Ohun elo: Standard FR4
Ipenija:
Lilo imọ-ẹrọ De-cap lori PCB Rigid
Iforukọ laarin awọn fẹlẹfẹlẹ
Fun pọ diẹ si ni agbegbe igbesẹ
Lominu ni ilana beveling fun G/F
Ohun elo ọja:
Kamẹra Module / Notebook
Awọn alaye ọja:
Akopọ: iho
Ohun elo: Standard FR4
Ipenija:
Lilo imọ-ẹrọ De-cap lori PCB Rigid
Eto lesa to ṣe pataki ati awọn paramita ni ilana De-cap
Ohun elo ọja:
Awọn atupa ọkọ ayọkẹlẹ
Awọn alaye ọja:
Iṣakojọpọ: IMS / Heatsink
Ohun elo: Irin + Lẹ pọ / Prepreg + PCB
Ipenija:
Ipilẹ aluminiomu ati ipilẹ bàbà (Layer ẹyọkan)
Gbona elekitiriki
FR4 + lẹ pọ / Prepreg + Al lamination
Awọn anfani:
Nla Ooru Iyapa
Awọn alaye ọja:
Ohun elo iyara to gaju (Iṣọkan)
akopọ soke: Ifibọ Ejò owo / Symmetric
Ipenija:
Yiye ti iwọn owo
Yiye ti lamination šiši
Lominu ni resini sisan
Ohun elo ọja:
Oko / ise / mimọ ibudo
Awọn alaye ọja:
Ti abẹnu Layer mimọ Ejò 6OZ
Ipilẹ Layer ita Ejò 3OZ/6OZ Iṣakojọpọ:
6OZ Ejò àdánù ni ti abẹnu Layer
Ipenija:
6OZ Ejò aafo kun ni kikun pẹlu iposii
Ko si fiseete ni lamination processing
Ohun elo ọja:
Smart foonu / SD Kaadi / SSD
Awọn alaye ọja:
Iṣakojọpọ: HDI / Anylayer
Ohun elo: Standard FR4
Ipenija:
Gan kekere profaili / RTF Cu bankanje
Plating uniformity
Ga o ga gbẹ film
Ifihan LDI (Aworan Taara Lesa)
Ohun elo ọja:
ibaraẹnisọrọ / SD Kaadi / Optical Module
Awọn alaye ọja:
Iṣakojọpọ: HDI / Anylayer
Ohun elo: Standard FR4
Ipenija:
Ko si aafo ni eti ika nigbati PCB ni fifi goolu ṣiṣẹ
Special sooro film
Ohun elo ọja:
Ilé iṣẹ́
Awọn alaye ọja:
Iṣakojọpọ: Rigidi-Flex
Pẹlu Eccobond ni Rigid-Flex iyipada
Ipenija:
Iyara gbigbe pataki ati ijinle fun ọpa
Lominu ni air titẹ paramita