I-FPC

1.FPC—Flexible Printed Circuit, isekethe ephrintiwe ethembeke kakhulu futhi evumelana nezimo eyenziwe ngokunamathiselwa kucwecwe lethusi kusetshenziswa ifilimu ye-polyester noma i-polyimide njenge-substrate ukuze kwakheke isekethe.

2.Izici Zomkhiqizo: ① Usayizi omncane nesisindo esilula : ukuhlangabezana nezidingo zokuminyana okuphezulu, ukwenza okuncane, okungasindi, ukuzacile kanye nezikhombisi-ndlela zokuthuthukiswa kokwethembeka; ② Ukuvumelana nezimo okuphezulu : inganyakaza futhi inwebe ngokukhululekile esikhaleni se-3D, izuze ukuhlanganiswa kwengxenye edidiyelwe noxhumo lwezintambo.

Isicelo se-FPC:

ikhamera, ikhamera yevidiyo, i-CD-ROM, i-DVD, i-hard drive, ikhompuyutha ephathekayo, ucingo, umakhalekhukhwini, iphrinta, umshini wefeksi, i-TV, imishini yezokwelapha, ugesi wezimoto, i-aerospace nemikhiqizo yezempi.

Ngokuya ngenani lezendlalelo ze-conductive, lingahlukaniswa libe ibhodi elinohlangothi olulodwa, ibhodi elinamahlangothi amabili kanye nebhodi elinezingqimba eziningi.

Ibhodi elinohlangothi olulodwa : umqhubi ohlangothini olulodwa kuphela

Ibhodi elinezinhlangothi ezimbili : kukhona amakhondaktha angu-2 ezinhlangothini zombili, kanye nokusungula uxhumano lukagesi phakathi kwamakhondatha angu-2 ngembobo (nge-) njengebhuloho. Imbobo edlula imbobo iyimbobo encane efakwe ithusi odongeni lwembobo engaxhunywa kumasekhethi nhlangothi zombili.

Ibhodi lezendlalelo eziningi : liqukethe izendlalelo ezi-3 noma ngaphezulu zamakhondatha, anesakhiwo esinembe kakhudlwana.

Ngaphandle kwebhodi elinohlangothi olulodwa, inani lezendlalelo zebhodi eliqinile ngokuvamile lilingana, njengezendlalelo ezingu-2, 4, 6, 8, ikakhulukazi ngenxa yokuthi uhlaka oluyinqaba lokunqwabelanisa luyi-asymmetric futhi luthambekele ekujikeni kwebhodi. Ngakolunye uhlangothi, i-PCB eguquguqukayo ihlukile njengoba ingekho inkinga yokungqubuzana, ngakho-ke ungqimba olu-3, ungqimba olu-5, njll.

I-copper foil ihlukaniswa ibe yi-Electro-Deposited copper (ED Copper) kanye ne-Rolled Annealed copper (RA Copper)

1oz ≈ 35um

I-OZ empeleni iyiyunithi yesisindo, elingana no-1/16 phawundi, cishe u-28.35g.

Embonini yebhodi lesekethe, ukujiya kwethusi elingu-1oz elibekwe lacaba ngaphakathi kwe-wquare foot eyodwa kuchazwa ngokuthi 1oz. Ngakho-ke ngezinye izikhathi amaklayenti acela u-28.35g wethusi, kufanele siqaphele ngokushesha ukuthi lokhu kuyimfuneko ye-1oz yethusi.

Umsebenzi we-solder mask : ① ukufakwa kwe-solder ② vikela isekethe futhi uvimbele ukulimala kwesekhethi ③ vimbela izinto zangaphandle ezishintshayo ukuthi zingaphumeleli kusekethe futhi zibangele amasekhethi amafushane

Kunezinhlobo ezi-2 zezinto zokwakha imaski ye-solder: uyinki kanye nesembozo

Uyinki osetshenziselwa imaski ye-solder ngokuvamile uyazwela futhi ubizwa nge-liquid photo imagealble, efushanisiwe njenge-LPI. Ngokuvamile kutholakala ngombala oluhlaza okotshani, omnyama, omhlophe, obomvu, ophuzi, oluhlaza okwesibhakabhaka, njll.

I-Coverlay, ngokuvamile etholakala ngokuphuzi (ezinye zibizwa ngokuthi inhlaka), omnyama nomhlophe. Okumnyama kunokumnyama okuhle futhi okumhlophe kunokubonakala okuphezulu, okungangena esikhundleni sikayinki omhlophe kumabhodi avumelana nezibani zangemuva.

Endabeni yebhodi eguquguqukayo, kokubili uyinki kanye ne-coerlay kungasetshenziselwa imaski ye-soler. Ngakho-ke yini ukuqhathanisa phakathi kwezinzuzo kanye nokubi kokubili? Sicela ubheke ithebula elingezansi:

Umsebenzi we-surface finish ukuvimbela i-copper surface oxidation, ukuhlinzeka nge-welding noma isendlalelo sokubopha.

Ngokuvamile kunezindlela ezimbalwa zokuqeda indawo engezansi: ukucaciswa kokuqedwa kwendawo.

I-OSP: Izilondolozi ze-Organic solderability OSP:0.2-0.5um

I-Ni/Au Plating Tin:4-20um

ENIG: Electroless Nickel Immersion Gold ENIG:0.05-0.1um

I-Plating Sn/Tin Plating gold:0.1-1um

Ukucwiliswa kwe-Sn/Tin Immersion Tin:0.3-1.2um

I-Immersion Ag Immersion Ag:0.07-0.2um.

Ukuqhathanisa izindleko : Plating Ni/Au(ENIG) > Immersion Ag > Plating Sn/Tin (Immersion Sn/Tin) > OSP.

Ngokungafani nebhodi eliqinile, ibhodi eliguquguqukayo alinakho ukuqina okufanayo namandla omshini njengebhodi eliqinile, ngakho alikwazi ukulungiswa kahle ngezikulufu noma ukufaka izikhala zekhadi. Ngokuvamile, kuyadingeka ukuyilungisa kudivayisi nge-adhesive ezinhlangothini ezimbili ukuvimbela i-FPC ukuthi inganyakazi ngemva kokuhlanganiswa. Ngaphezu kwalokho, okunamathelayo okunezinhlangothi ezimbili kungasetshenziswa futhi ukunamathisela ukuqina ku-FPC.

I-DST (i-Double-Sided Tape), eyaziwa nangokuthi i-Pressure-Sensitive Adhesive (PSA), ingcina enezinhlangothi ezimbili esetshenziselwa i-FPC.

I-Pressure Sensitive Adhesive ingahlukaniswa ibe yi-adhesive evamile, i-high-temperature resistant adhesive, i-conductive adhesive kanye ne-thermal conductive adhesive.

Izinamathiselo ezijwayelekile zifaka i-3M467,3M468, izinamathiselo eziqhutshwayo zifaka i-3M9703,3M9713

Izinamathiselo ezishisayo ezishisayo zifaka i-3M8805,3M9882

Okunamathelayo okumelana nokushisa okuphezulu kubhekisela kwinto enamathelayo ekwazi ukumelana nezinga lokushisa eliphezulu le-SMT isikhathi esifushane, esetshenziselwa amabhodi adinga ukukhwezwa kwe-SMT. Ama-adhesive asetshenziswa kakhulu afaka i-3M9460,3M9077,3M9079,TESA8853, njll.

Kunezinhlobo eziningana zama-stiffener njengoba ngezansi:

Insimbi Engagqwali (SS) : Amanye amaklayenti abonisa i-SUS emidwebeni yawo, kodwa empeleni, lokhu ukuqina kwensimbi. I-SUS wuhlobo olusetshenziswa kakhulu lwamashidi ensimbi.

AL:Aluminium

FR4

I-Polyimide

I-polyester

I-Electro-Magnetic Interference (EMI) yinto evamile, ikakhulukazi kumasekhethi anemvamisa ephezulu, ukuze kuqinisekiswe ubuqotho besignali ngaphandle kokuhlanekezela, ukuvikela ngogesi kuyadingeka.Izinto ezisetshenziselwa ukuvikela i-electromagnetic ye-FPC ikakhulukazi zihlanganisa uyinki oyisiliva nefilimu eyinki eyisiliva. .

Uyinki oyisiliva uyinto efana nokunamathisela enezinhlayiya zesiliva zensimbi neresin. Ingaphrintwa ku-FPC njengoyinki wesikrini sikasilika ebhodini eliqinile, bese ibhakwa futhi iqiniswe. Ukuvimbela i-oxidation yesiliva emoyeni, ungqimba lukayinki noma ifilimu evikelayo ngokuvamile inyatheliswa kuyinki yesiliva ukuze ivikeleke.

Izibunjwa ezivame ukusetshenziswa zihlukaniswe zibe isikhunta sommese nesikhunta sensimbi. Ukunemba kwesikhunta sommese kuphansi, nokubekezelela okucishe kube ngu-+/-0.3mm. Ukunemba kwesikhunta sensimbi kuphakeme, kunesikhunta sensimbi esijwayelekile esingaba ngu-+/-0.1mm kanye nesikhunta sensimbi esinembayo esingafika ku-+/-0.05mm. Isizathu sokuthi intengo yokubunjwa kwensimbi iphindwe izikhathi eziningana noma ngisho namashumi kunezibunjwa zommese.

Izibunzi zommese ezaziwa nangokuthi amathuluzi athambile, kanye nezibunjwa zensimbi ezaziwa nangokuthi amathuluzi aqinile.

Sebenzisa ithuluzi lokuhlola likagesi ukuze unike amandla ngokugcwele emkhiqizweni ukuze uhlole ukonakala okukhulu njengokuvula, okufushane, njll. kumasekhethi omkhiqizo. Esigabeni samasampula, inani lincane uma kuqhathaniswa, ukuze kongiwe izindleko zokuvula uhlaka lokuhlola, i-flying probe isetshenziselwa ukuhlola. Kodwa-ke, ukuhlolwa kwe-flying probe kuyinkimbinkimbi futhi kuthatha isikhathi eside okuholela ekusebenzeni kahle okuphansi. Ngakho-ke, ukuhlolwa kwenziwa kusetshenziswa uhlaka lokuhlola (i-fixture, jig) ngesikhathi sokukhiqiza ngobuningi.

Amaphutha angatholakala ngesikhathi sokuhlolwa kukagesi ahlanganisa: into; vula; kufushane.

Kufanele kuqashelwe ukwenzeka kokukhubazeka ngesikhathi kuhlolwa ugesi : imihuzuko ezingxenyeni ezingaphezulu zokuqeda okubangelwa ama-probe okuhlola kagesi.

Yenza ukuhlolwa okuphelele kwemikhiqizo ngayinye eqediwe ngokuvumelana nezindinganiso zokuhlola

Kunezindlela eziningana zokuhlola ngokuya ngezidingo ezahlukene zomkhiqizo njengoba ngezansi :

① ukuhlolwa okubonakalayo

② ukuhlolwa kwe-microscopic (ubuncane obungu-10X)

Hlola ikakhulukazi ukubukeka, okuhlanganisa ukuklwebheka, amazinyo, imibimbi, i-oxidation, amabhamuza, ukungahambi kahle kwemaski ye-solder, ukubhola ukungahambi kahle, izikhala zesekethe, ithusi eliyinsalela, izinto zangaphandle, njll.