I-High-frequency Hybrid ecindezela i-PCB, imbobo yepulaki ye-resin engu-6L
Isendlalelo esiphezulu/noma yimuphi umkhiqizi we-HDI yesendlalelo
Ikhwalithi
Uhlelo Lokuphatha Ikhwalithi: ISO 9001: 2015, ISO14001:2015,IATF16949: 2016,OHSAS 18001: 2007,QC080000:2012SGS,RBA,CQC,WCA & ESA,SQGA MARK,Canon,SQGA MARK,Canon
Izinga lezinga le-PCB: IPC 1, IPC 2, IPC 3, GJB 362C-2021, AS9100
Inqubo yokukhiqiza enkulu yePCB:IL/lmage,PatternPlating,I/L AOI,B/Oxide,Layup,Cindezela,LaserDrilling,Drilling,PTH,PanelPlating,O/Llmage,PanelPlating,SESEtching,O/L AOI,S/Mask,Legend ,SurfaceFinshed(ENIGENEPIG,Hard Gold,Soft Gold,HASL,LF-HASL,lmm Tin,lmm Silver,OSP),Rout,ET,FV
Izinto zokuhlola izinto zokusebenza
Ihhavini: ukuhlolwa kwesitoreji samandla ashisayo
Umshini wokuhlola izinga lokungcoliswa kwe-Ion: Ukuhlolwa kokuhlanzeka kwe-Ionic
umshini wokuhlola isifutho sikasawoti: Ukuhlolwa kwesifutho sikasawoti
I-DC high-voltage tester: i-voltage ukumelana nokuhlolwa
i-megger: ukumelana ne-insulation
umshini we-universal tensile: ukuhlolwa kwamandla wepeel
I-CAF: Ukuhlolwa kokufuduka kwe-Ion, ukuthuthukisa ama-PCB substrates, ukuthuthukisa ukucutshungulwa kwe-PCB, njll.
I-OGP :Kusetshenziswa amathuluzi okulinganisa izithombe ze-3D okungaxhunywana naye, kuhlanganiswe neplathifomu ye-XYZ eksisi kanye nesibuko sokusondeza okuzenzakalelayo, kusetshenziswa izimiso zokuhlaziya isithombe ukucubungula amasignali esithombe ngekhompyutha, ukukalwa kobukhulu bejometri nokubekezelelana kwendawo kungatholwa ngokushesha nangokunembile, kanye ne-CPK. amanani angahlaziywa.
Umshini wokulawula ukumelana nomugqa:ukulawula ukumelana nokuhlolwa kwe-TCT Izindlela zokwehluleka ezivamile, ukuqonda izinto ezingase zidale umonakalo kumishini yesistimu nezingxenye zokuqinisekisa ukuthi umkhiqizo uklanywe kahle noma wakhiwe ngendlela efanele.
ibhokisi lokushaqeka elibandayo nelishisayo: ukuhlolwa kokushaqeka okubandayo nokushisayo, izinga lokushisa eliphezulu neliphansi
izinga lokushisa elingashintshi kanye negumbi lomswakama: ukugqwala kwe-Electrochemical & ukuhlolwa kokumelana nokufakwa kwendawo
ibhodwe solder: solderability test
I-RoHS: Ukuhlolwa kwe-RoHS
umhloli we-impedance: i-AC impedance kanye namanani okulahlekelwa amandla
okokusebenza kokuhlola ugesi: Hlola ukuqhubeka komjikelezo womkhiqizo
umshini yenaliti endizayo: Ukufakwa kwamandla kagesi aphezulu kanye nokuhlolwa kokumelana okuphansi
Umshini wokuhlola izimbobo ozenzakalelayo ngokugcwele:Hlola izinhlobo zemigodi ehlukahlukene engajwayelekile, okuhlanganisa izimbobo eziyindilinga, izimbobo zembobo ezimfishane, izimbobo ezinde, izimbobo ezinkulu ezingajwayelekile, izimbobo, izimbobo ezimbalwa, izimbobo ezinkulu nezincane, kanye nemisebenzi yokuhlola ipulaki.
I-AOI:I-AOI iskena ngokuzenzakalelayo imikhiqizo ye-PCBA ngamakhamera e-CCD anencazelo ephezulu, iqoqa izithombe, iqhathanise amaphuzu okuhlola namapharamitha afanelekayo kusizindalwazi, futhi ngemva kokucubungula isithombe, ihlola ukukhubazeka okuncane okungenzeka kunganakwa ku-PCB eqondiwe. Akukho ukuphunyuka kuzinkinga zesekethe
Isicelo (bheka inombolo enamathiselwe ukuze uthole imininingwane)
Ama-HDI PCB asetshenziswa emikhakheni eyahlukene efana nomakhalekhukhwini, amakhamera edijithali, i-AI, abathwali be-IC, imishini yezokwelapha, ukulawula izimboni, amalaptop, ugesi wezimoto, amarobhothi, ama-drones, njll.
Isicelo
Ama-HDI PCB asetshenziswa emikhakheni eyahlukene efana nomakhalekhukhwini, amakhamera edijithali, i-AI, abathwali be-IC, imishini yezokwelapha, ukulawula izimboni, amalaptop, ugesi wezimoto, amarobhothi, ama-drones, njll.