I-DPC Ceramic Substrate: inketho ekahle yokupakisha ama-chips e-LiDAR ezimoto
Umsebenzi we-LiDAR (Ukutholwa Kokukhanya Nokukhanya) ukukhipha amasiginali we-laser ye-infrared futhi uqhathanise amasiginali abonisiwe ngemuva kokuhlangabezana nezithiyo namasiginali akhishiwe, ukuze kutholwe imininingwane efana nendawo, ibanga, umumo, isivinini, isimo sengqondo, kanye nokuma kwe okuhlosiwe. Lobu buchwepheshe bungafinyelela ukugwema izithiyo noma ukuzulazula okuzenzakalelayo. Njengenzwa enembayo ephezulu, i-LiDAR ithathwa kabanzi njengesihluthulelo sokuzuza ukushayela okuzihambela okusezingeni eliphezulu, futhi ukubaluleka kwayo kuya ngokuya kugqama.
Imithombo yokukhanya ye-laser igqama phakathi kwezingxenye eziyinhloko ze-LiDAR yezimoto. Njengamanje, umthombo wokukhanya we-VCSEL (i-vertical cavity surface emitting laser) usuyinketho ekhethwayo ye-hybrid solid-state LiDAR kanye ne-flash LiDAR ezimotweni ngenxa yezindleko zayo eziphansi zokukhiqiza, ukwethembeka okuphezulu, i-engeli encane yokuhluka, kanye nokuhlanganiswa okulula kwe-2D. I-chip ye-VCSEL ingakwazi ukuthola ibanga elide lokutholwa, ukuqonda okuphakeme kombono, futhi ithobelane nezindinganiso eziqinile zokuphepha kwamehlo ku-automotive hybrid solid-state LiDAR. Ngaphezu kwalokho, zenza i-Flash LiDAR ifinyelele umbono ovumelana nezimo futhi obanzi, futhi ibe nezinzuzo ezibalulekile zezindleko.
Ama-substrates e-Ceramic asephenduke into ekahle yokupakisha ye-chip yezinhlelo zokusebenza ze-LiDAR zezimoto.
I-DPC (I-Direct Copper Plating) i-ceramic substrates inokuguquguquka okuphezulu kwe-thermal, ukwahlukanisa okuphezulu, ukunemba kwesekethe ephezulu, ukushelela okuphezulu kwendawo, kanye ne-coefficient yokwandisa okushisayo efana ne-chip. Futhi zihlinzeka ngoxhumano oluqondile ukuze kuhlangatshezwane nezimfuneko zokupakisha ze-VCSEL.
1. Ukukhipha ukushisa okuhle kakhulu
I-substrate ye-ceramic ye-DPC inokuxhumana okuqondile, okwenza iziteshi ezizimele zokuqhuba zangaphakathi. Ngenxa yokuthi i-ceramics kokubili i-insulators kanye nama-conductor ashisayo, angakwazi ukufeza ukuhlukaniswa kwe-thermoelectric futhi axazulule ngokuphumelelayo inkinga yokushisa ukushisa kwama-chips e-VCSEL.
2. Ukuthembeka okuphezulu
Ukuminyana kwamandla wama-chips e-VCSEL kuphezulu kakhulu, futhi ukungafani kokwanda okushisayo phakathi kwe-chip ne-substrate kungaholela ezinkingeni zengcindezi. I-thermal expansion coefficient ye-ceramic substrates ihambisana kakhulu ne-VCSEL. Ngaphezu kwalokho, ama-substrates e-ceramic e-DPC angahlanganisa amafreyimu ensimbi nama-substrates e-ceramic ukuze kwakheke imbobo evalekile, enesakhiwo esihlangene, esingenasendlalelo esimaphakathi esibophayo, kanye nokuqina komoya okuphezulu.
3. Ukuxhumana okuqondile
Ukupakishwa kwe-VCSEL kudinga ukufakwa ilensi ngaphezu kwe-chip, ngakho-ke umgodi we-3D udinga ukusethwa ku-substrate. Ama-substrates e-ceramic e-DPC anenzuzo yokuxhumana okuqondile nokuthembeka okuphezulu, afanele ukubopha okuqondile kwe-eutectic.
Esimweni sokuthuthukiswa kwezimoto ezihlakaniphile, izinto zobumba zidlala indima ebaluleke kakhulu ekuthuthukisweni okuhlakaniphile kwezimoto zamandla amasha. Njengesisekelo saso sonke isitaki sobuchwepheshe, ukusungulwa okusha okuqhubekayo kobuchwepheshe bezinto ezibonakalayo kubalulekile ekusekeleni ukuthuthukiswa okuphumelelayo kwayo yonke imboni.