Umehluko phakathi kwama-Ceramic PCBs nama-Traditional FR4 PCB

Ngaphambi kokuxoxa ngalolu daba, ake siqale siqonde ukuthi ayini ama-PCB e-ceramic nokuthi ayini ama-FR4 PCB.

I-Ceramic Circuit Board ibhekisela ohlotsheni lwebhodi lesifunda elakhiwe ngokusekelwe ezintweni zobumba, ezaziwa nangokuthi i-Ceramic PCB (ibhodi lesekethe eliphrintiwe). Ngokungafani nama-substrates epulasitiki enziwe ngengilazi eqinile (FR-4), amabhodi esekethe e-ceramic asebenzisa ama-ceramic substrates, anganikeza ukuzinza okuphezulu kwezinga lokushisa, amandla angcono emishini, izakhiwo ezingcono ze-dielectric, nokuphila isikhathi eside. Ama-Ceramic PCB asetshenziswa kakhulu kumasekhethi okushisa aphezulu, ama-high-frequency, kanye namandla aphezulu, njengezibani ze-LED, izikhulisamandla, ama-semiconductor lasers, ama-RF transceivers, izinzwa, namadivayisi we-microwave.

Ibhodi Lesekethe libhekisela ezintweni eziyisisekelo zezingxenye ze-elekthronikhi, ezaziwa nangokuthi i-PCB noma ibhodi lesekethe eliphrintiwe. Ingumthwali wokuhlanganisa izingxenye ze-elekthronikhi ngokuphrinta amaphethini wesekethe yensimbi kuma-non-conductive substrates, bese idala izindlela ezisebenzayo ngezinqubo ezifana nokugqwala kwamakhemikhali, ithusi le-electrolytic, kanye nokubhoboza.

Okulandelayo isiqhathaniso phakathi kwe-ceramic CCL ne-FR4 CCL, okuhlanganisa ukuhluka kwazo, izinzuzo kanye nokubi.

I-Ceramic PCB

Izinkambu zohlelo lokusebenza zezinto ezahlukahlukene:

I-Alumina Ceramic (Al2O3): Inokwahlukanisa okuhle kakhulu, ukuzinza kwezinga lokushisa eliphezulu, ubulukhuni, namandla emishini ukuze ifaneleke kumadivayisi kagesi anamandla amakhulu.

I-Aluminium Nitride Ceramics (i-AlN): Ngokusebenza okuphezulu kwe-thermal kanye nokuzinza okuhle kokushisa, ifaneleka kumadivayisi kagesi anamandla amakhulu kanye nezinkambu zokukhanyisa ze-LED.

I-Zirconia ceramics (ZrO2): inamandla amakhulu, ubulukhuni obuphezulu nokumelana nokugqoka, ifanele imishini kagesi ene-voltage ephezulu.

Izinkambu zohlelo lokusebenza zezinqubo ezahlukahlukene:

I-HTCC (I-High Temperature Co fired Ceramics): Ifanele ukusetshenziswa kwezinga lokushisa eliphezulu namandla aphezulu, njengama-electronics amandla, i-aerospace, ukuxhumana ngesathelayithi, ukuxhumana ngokubona, okokusebenza kwezokwelapha, ugesi wezimoto, i-petrochemical nezinye izimboni. Izibonelo zomkhiqizo zihlanganisa ama-LED aphezulu, izikhulisamandla, ama-inductors, izinzwa, ama-capacitor okugcina amandla, njll.

I-LTCC (Low Temperature Co fired Ceramics): Ifanele ukwenziwa kwemishini ye-microwave efana ne-RF, i-microwave, i-antenna, inzwa, isihlungi, isihlukanisi samandla, njll. Ngaphezu kwalokho, ingasetshenziswa futhi kwezokwelapha, izimoto, i-aerospace, ukuxhumana, electronics kanye neminye imikhakha. Izibonelo zomkhiqizo zifaka amamojula e-microwave, amamojula we-antenna, izinzwa zokucindezela, izinzwa zegesi, izinzwa zokusheshisa, izihlungi ze-microwave, izihlukanisi zamandla, njll.

I-DBC (I-Direct Bond Copper): Ifanele ukuchithwa kokushisa kwamadivayisi we-semiconductor yamandla aphezulu (afana ne-IGBT, MOSFET, GaN, SiC, njll.) ane-thermal conductivity enhle kakhulu namandla omshini. Izibonelo zomkhiqizo zihlanganisa amamojula amandla, amandla kagesi, izilawuli zemoto kagesi, njll.

I-DPC (I-Direct Plate Copper Multilayer Printed Circuit Board): isetshenziselwa ikakhulukazi ukuqeda ukushisa kwezibani ze-LED ezinamandla amakhulu anezici zokuqina okuphezulu, ukuqhutshwa kwe-thermal okuphezulu, nokusebenza kukagesi okuphezulu. Izibonelo zomkhiqizo zifaka izibani ze-LED, ama-UV LED, ama-COB LED, njll.

I-LAM (I-Laser Activation Metallization ye-Hybrid Ceramic Metal Laminate): ingasetshenziselwa ukuchithwa kokushisa kanye nokwenza kahle kokusebenza kukagesi ekukhanyeni kwamandla aphezulu e-LED, amamojula amandla, izimoto zikagesi, nezinye izinkambu. Izibonelo zomkhiqizo zihlanganisa izibani ze-LED, amamojula wamandla, abashayeli bezimoto zikagesi, njll.

FR4 PCB

Amabhodi e-IC carrier, amabhodi e-Rigid-Flex kanye ne-HDI eyimpumputhe/engcwatshwe ngamabhodi ayizinhlobo ezivame ukusetshenziswa zama-PCB, asetshenziswa ezimbonini nemikhiqizo ehlukene ngale ndlela elandelayo:

Ibhodi le-IC carrier board: Liyibhodi lesifunda eliphrintiwe elivame ukusetshenziswa, elisetshenziselwa ikakhulukazi ukuhlolwa kwe-chip nokukhiqizwa kumishini kagesi. Izicelo ezijwayelekile zifaka ukukhiqizwa kwe-semiconductor, ukukhiqizwa kwe-elekthronikhi, i-aerospace, ezempi, neminye imikhakha.

Ibhodi le-Rigid-Flex: Liyibhodi lezinto ezibonakalayo elihlanganisa i-FPC ne-PCB eqinile, enezinzuzo zawo womabili amabhodi esekethe aguquguqukayo naqinile. Izicelo ezijwayelekile zifaka izinto zikagesi zabathengi, okokusebenza kwezokwelapha, ugesi wezimoto, i-aerospace, neminye imikhakha.

I-HDI iyimpumputhe/ingcwatshwe ngebhodi: Kuyibhodi lesifunda eliphrintiwe elixhumeke kakhulu elixhumeke kakhulu elinomugqa ophezulu wokuminyana kanye nendawo yokuvula encane ukuze kutholakale ukupakishwa okuncane nokusebenza okuphezulu. Izinhlelo zokusebenza ezijwayelekile zifaka ukuxhumana kweselula, amakhompyutha, izinto zikagesi zabathengi, neminye imikhakha.