Umehluko omkhulu phakathi kwe-HDI ne-PCB evamile - inkathi entsha yokuxhumanisa okuphezulu kwabantu
I-HDI (High Density Interconnection) iyibhodi lesifunda elihlangene elakhelwe abasebenzisi abanevolumu ephansi. Uma kuqhathaniswa nama-PCB ajwayelekile, isici esibaluleke kakhulu se-HDI ukuminyana kwezintambo eziphezulu. Umehluko phakathi kwalokhu okubili ubonakala ngokuyinhloko kulezi zici ezine ezilandelayo.
I-1.HDI incane futhi ilula ngesisindo
Amabhodi e-HDI enziwe ngamabhodi endabuko anezinhlangothi ezimbili njengamabhodi ayisisekelo futhi ahlotshiswe nge-lamination eqhubekayo. Lolu hlobo lwebhodi lesifunda elenziwe nge-lamination eqhubekayo libizwa nangokuthi i-Build-up Multilayer board (BUM). Uma kuqhathaniswa namabhodi esekethe endabuko, ama-HDI anezinzuzo zokuba "alula, azacile, amafushane, futhi amancane".
Ukuxhumana kukagesi phakathi kwezendlalelo zebhodi le-HDI kwenzeka ngokusebenzisa umgodi wokuhamba, ugqitshwe/uphuphutheke ngokuxhunywa. Isakhiwo sawo sihlukile kumabhodi wesifunda anezingqimba eziningi ezijwayelekile. Inani elikhulu lama-vias angcwatshwe kancane/ayimpumputhe asetshenziswa kumabhodi e-HDI. I-HDI isebenzisa i-laser drilling direct, kuyilapho i-PCB evamile ivamise ukusebenzisa ukubhola ngomshini, ngakho inani lezendlalelo ne-aspect ratio kuvame ukuncishiswa.
Inqubo yokukhiqiza ye-motherboard ye-2.HDI
Ukuminyana okuphezulu kwamabhodi e-HDI kubonakala kakhulu ekumineni kwezimbobo, imigqa, amaphedi, nogqinsi lwe-interlayer.
I-Micro through-hole: Ibhodi le-HDI liqukethe imiklamo emincane ngokusebenzisa imbobo efana ne-blind via, ebonakala kakhulu kubuchwepheshe bokwakha izimbobo ezincane ezinobubanzi obungaphansi kuka-150um kanye nezidingo eziphezulu mayelana nezindleko, ukusebenza kahle kokukhiqiza kanye nembobo. ukulawulwa kokunemba kokuma.Kukhona kuphela ngezimbobo kumabhodi esekethe anezendlalelo eziningi futhi awekho ama-vias amancane angcwatshwe/ayimpumputhe.
Ukucolisiswa kobubanzi/isikhala somugqa: Lokhu kubonakala kakhulu ezidingweni eziqinile ezikhulayo zokulimala komugqa kanye nobuhwaqane bomugqa. Ngokuvamile, ububanzi bomugqa/isikhala akumele seqe ku-76.2um.
Ukuminyana kwephedi ephezulu: ukuminyana kokuthintana kwe-solder kukhulu kuno-50/cm2
Ukuncipha kogqinsi lwe-dielectric: Lokhu kubonakala ikakhulukazi kumkhuba wogqinsi lwe-inter-layer dielectric ukuya ku-80um nangaphansi, futhi izidingo zokufana kogqinsi ziya ngokuya ziba nzima kakhulu, ikakhulukazi kumabhodi anomthamo omkhulu kanye nama-substrates okupakisha anokulawula okubambekayo kwesici.
3.Ukusebenza kukagesi kwebhodi le-HDI kungcono
I-HDI ayigcini nje ngokuvumela imiklamo yomkhiqizo wokugcina ukuthi yenziwe ibe mincane kakhulu, kodwa futhi ihlangabezana namazinga aphezulu okusebenza kwe-elekthronikhi nokusebenza kahle.
Ukuminyana kokuxhumana okukhuphukile kwe-HDI kuvumela amandla esignali athuthukisiwe futhi kuthuthukisa ukuthembeka. Ngaphezu kwalokho, amabhodi e-HDI anokuthuthukiswa okungcono kakhulu ekuphazamisekeni kwe-RF, ukuphazamiseka kwamagagasi kagesi, ukukhishwa kwe-electrostatic, ukuqhutshwa kokushisa, njll. I-HDI iphinde isebenzisa ubuchwepheshe obugcwele bokulawula isignali yedijithali (i-DSP) kanye nenani lobuchwepheshe obunelungelo lobunikazi, obuvumelana nezimo eziphelele zomthwalo wokukhokha nokuqina. ikhono lokugcwala ngokweqile kwesikhashana.
Amabhodi we-4.HDI anezidingo eziphakeme kakhulu zokuxhuma nge-plugvia.
Kungakhathaliseki ukuthi usayizi webhodi noma ukusebenza kukagesi, i-HDI iphakeme kune-PCB evamile. Uhlamvu lwemali ngalunye lunezinhlangothi ezimbili. Olunye uhlangothi lwe-HDI ukuthi njengoba yakhiwe njenge-PCB esezingeni eliphezulu, umkhawulo wayo wokukhiqiza nobunzima benqubo buphezulu kakhulu kunaleyo yama-PCB ajwayelekile. Kukhona nezindaba eziningi ezidinga ukunakwa ngesikhathi sokukhiqiza - ikakhulukazi ukungcwatshwa ngokuxhuma.
Njengamanje, iphoyinti lobuhlungu eliyinhloko nobunzima bokukhiqiza i-HDI kungcwatshwa ngokuxhunywa. Uma i-HDI engcwatshwe nge-HDI ingaxhunywanga kahle, kuzokwenzeka izinkinga ezinkulu zekhwalithi, okuhlanganisa imiphetho yebhodi engalingani, ukujiya kwe-dielectric okungalingani, namaphedi anezimbobo, njll.
Ingaphezulu lebhodi alilingani futhi imigqa ayiqondile, okubangela okwenzeka ebhishi ekucindezelekeni, okungase kuholele kumaphutha njengamagebe emigqa nokunqanyulwa.
I-impedance yesici nayo izoguquguquka ngenxa yokuqina kwe-dielectric engalingani, okubangela ukungazinzi kwesignali.
Ukungalingani kwephedi le-soldering kuzoholela kukhwalithi embi yokupakisha okulandelayo kanye nokulahlekelwa okulandelanayo kwezingxenye.
Ngakho-ke, akubona bonke abakhiqizi be-PCB abanamandla namandla okwenza umsebenzi omuhle ku-HDI. Ngesipiliyoni seminyaka engaphezu kwengu-20 ekukhiqizeni i-PCB, i-RICHPCBA ihlinzeka ngobuchwepheshe bakamuva bokukhiqiza ibhodi lesekethe kanye namazinga aphezulu embonini yezogesi. Imikhiqizo ehlanganisa: 1-68 izendlalelo PCB, HDI, PCB multilayer, FPC, pcb eqinile, flex pcb, rigid-flex pcb, pcb ceramic, high frequency pcb, njll Khetha RICHPCBA njengomkhiqizi PCB wakho onokwethenjelwa e-China.