I-PCB Surface Finish
| I-Surface Qeda | Inani Elijwayelekile | Umphakeli |
| UMnyango Wezomlilo Wokuzithandela | 0.3 ~ 0.55um, 0.25 ~ 0.35um | Enthone |
| Shikoku chemical | ||
| VUMA | Noma : 0.03~0.12um, Ni : 2.5~5um | I-ATO tech/Chuang Zhi |
| I-ENIG ekhethiwe | Noma : 0.03~0.12um, Ni : 2.5~5um | I-ATO tech/Chuang Zhi |
| UTHISHANHLOKO | Noma : 0.05~0.125um, Pd : 0.05~0.3um, | Chuang Zhi |
| Ku: 3 ~ 10um | ||
| Igolide Eliqinile | Noma : 0.127~1.5um , Ni : min 2.5um | Umkhokhi/EEJA |
| Igolide Elithambile | Noma : 0.127~0.5um , Ni : min 2.5um | EJA |
| I-Tin yokucwiliswa | Ubuncane: 1um | I-Enthone / ATO tech |
| Isiliva Sokucwiliswa | 0.127~0.45um | I-Macdermid |
| Ukuhola i-HASL yamahhala | 1 ~ 25 um | Nihon Superior |
Ngenxa yokuthi ithusi likhona ngesimo sama-oxides emoyeni, lithinta kakhulu ukuthengiswa nokusebenza kukagesi kwama-PCB. Ngakho-ke, kuyadingeka ukwenza isiphetho esingaphezulu sama-PCB. Uma ingaphezulu lama-PCB lingaqediwe, kulula ukubangela izinkinga zokudayiswa kwe-virtual, futhi ezimweni ezinzima, amaphedi e-solder nezingxenye azikwazi ukuthengiswa. I-PCB surface finish isho inqubo yokwenza ungqimba lwangaphezulu ngokuzenzakalelayo ku-PCB. Inhloso yokuqeda i-PCB ukuqinisekisa ukuthi i-PCB inokuthengiselana okuhle noma ukusebenza kukagesi. Kunezinhlobo eziningi zokuqeda okungaphezulu kwama-PCB.
I-Hot Air Solder Leveling (HASL)
Kuyinqubo yokufaka i-solder encibilikisiwe ye-tin lead ebusweni be-PCB, ukuyibeka phansi (ukuyiphephetha) ngomoya ocindezelwe oshisayo futhi kwakhiwe ungqimba lokumboza olukwazi ukumelana ne-oxidation yethusi futhi lunikeze ukuthengiselana okuhle. Phakathi nale nqubo, kuyadingeka ukwazi kahle imingcele ebalulekile elandelayo : ukushisa kwe-soldering, ukushisa kommese womoya oshisayo, ukucindezela kommese womoya oshisayo, isikhathi sokucwiliswa, isivinini sokuphakamisa, njll.
Inzuzo ye-HASL
1. Isikhathi eside sokulondoloza.
2. Ukumanzisa kahle iphedi nokumbozwa ngethusi.
3. Uhlobo olusetshenziswa kakhulu lomthofu (oluhambisana ne-RoHS).
4. Ubuchwepheshe obuvuthiwe, izindleko eziphansi.
5. Ifanele kakhulu ukuhlolwa okubonakalayo nokuhlolwa kukagesi.
Ubuthakathaka be-HASL
1. Ayifanele ukuxhunywa ngocingo.
2. Ngenxa ye-meniscus yemvelo ye-solder encibilikisiwe, i-flatness impofu.
3. Akusebenzi kumaswishi e-capacitive touch.
4. Kumaphaneli amancane kakhulu, i-HASL ingase ingafaneleki. Ukushisa okuphezulu kokugeza kungase kubangele ibhodi lesifunda ukuba ligoqe.
2. UMnyango Wezomlilo Wokuzithandela
I-OSP isifinyezo se-Organic Solderability Preservative, eyaziwa nangokuthi i-solder ngayinye. Ngamafuphi, i-OSP iwukuthi kufanele ifuthwe ebusweni be-solder pads yethusi ukunikeza ifilimu evikelayo eyenziwe ngamakhemikhali e-organic. Le filimu kufanele ibe nezakhiwo ezinjengokumelana ne-oxidation, ukumelana nokushaqeka okushisayo nokumelana nomswakama ukuze kuvikelwe indawo yethusi ekugqwaleni (i-oxidation noma i-vulcanization, njll.) ezindaweni ezivamile. Kodwa-ke, ekufakweni kwe-solder yokushisa okuphezulu okulandelayo, le filimu evikelayo kufanele isuswe kalula yi-flux ngokushesha, ukuze indawo yethusi ehlanzekile evezwe ikwazi ukuhlangana ngokushesha ne-solder encibilikisiwe ukuze yakhe i-solder eqinile ngesikhathi esifushane kakhulu. Ngamanye amazwi, indima ye-OSP iwukuba ivimbe phakathi kwethusi nomoya.
Inzuzo ye-OSP
1. Ilula futhi iyathengeka; Isiphetho esingaphezulu siwukugcotshwa kwesifutho kuphela.
2. Ingaphezulu le-solder pad libushelelezi kakhulu, linokucabana okuqhathaniswa ne-ENIG.
3. Ukuhola mahhala (okuhambisana namazinga e-RoHS) futhi ayihambisani nemvelo.
4. Isebenza kabusha.
Ubuthakathaka be-OSP
1. Ukungemanzi kahle.
2. Imvelo ecacile nencane yefilimu isho ukuthi kunzima ukukala ikhwalithi ngokuhlola okubonakalayo kanye nokwenza ukuhlola ku-inthanethi.
3. Impilo yesevisi emfushane, izidingo eziphezulu zokugcina nokuphatha.
4. Ukuvikelwa okungekuhle kokufakwa emigodini.
Isiliva Sokucwiliswa
Isiliva linezinto zamakhemikhali ezizinzile. I-PCB ecutshungulwa ubuchwepheshe bokucwiliswa kwesiliva isenganikeza ukusebenza okuhle kukagesi ngisho nalapho ibekwe endaweni eshisa kakhulu, enomswakama nengcolile, kanye nokugcina i-solderability enhle ngisho noma ingase ilahlekelwe ukucwebezela kwayo. I-Immersion Silver iyindlela yokusabela lapho ungqimba lwesiliva oluhlanzekile lufakwa khona ethusi. Kwesinye isikhathi, isiliva lokucwiliswa lihlanganiswa nezingubo ze-OSP ukuvikela isiliva ukuthi lingasabeli nama-sulfide endaweni.
Inzuzo Yesiliva Yokucwiliswa
1. I-solderability ephezulu.
2. Ukubukeka kahle kwendawo.
3. Izindleko eziphansi nokuhola mahhala (okuhambisana nezindinganiso ze-RoHS).
4. Isebenza ku-Al wire bonding.
Ubuthakathaka bokucwiliswa kwesiliva
1. Izimfuneko zokugcina eziphezulu futhi kulula ukungcoliswa.
2. Isikhathi esifushane sokuhlanganisa iwindi ngemuva kokukhipha emaphaketheni.
3. Kunzima ukwenza ukuhlolwa kukagesi.
I-Tin yokucwiliswa
Njengoba yonke i-solder isekelwe ku-tin, ungqimba lwethini lungafanisa nanoma yiluphi uhlobo lwe-solder. Ngemva kokwengeza izithasiselo eziphilayo kusixazululo sokucwiliswa kwe-tin, isakhiwo sesendlalelo se-tin sibonisa isakhiwo se-granular, sinqoba izinkinga ezibangelwa amadevu e-tin nokufuduka kwe-tin, kuyilapho futhi kunokusimama okuhle kokushisa nokuqina.
Inqubo ye-Immersion Tin ingakha izinhlanganisela zethusi eziyisicaba ze-intermetallic ukwenza ithini lokucwiliswa libe nokudaleka okuhle ngaphandle kwanoma yikuphi ukucaba noma izinkinga zokusabalalisa kwenhlanganisela ye-intermetallic.
Inzuzo ye-Immersion Tin
1. Isebenza emigqeni yokukhiqiza evundlile.
2. Isebenza ekucutshungulweni kwezintambo ezicolekileyo kanye nokusoda okungenayo umthofu, ikakhulukazi okusebenza enqubweni yokuhlanganisa.
3. Ukucaba kuhle kakhulu, kusebenza ku-SMT.
Ubuthakathaka be-Immersion Tin
1. Imfuneko yesitoreji esiphezulu, ingase ibangele ukuthi izigxivizo zeminwe zishintshe umbala.
2. Amadevu kathayela angabangela amasekhethi amafushane kanye nezinkinga zamalunga e-solder, ngaleyo ndlela anciphise isikhathi sokuphila.
3. Kunzima ukwenza ukuhlolwa kukagesi.
4. Inqubo ihilela ama-carcinogens.
VUMA
I-ENIG (Electroless Nickel Immersion Gold) iyimbongolo yokuqeda esetshenziswa kabanzi eyakhiwe ngezingqimba zensimbi ezi-2, lapho i-nickel ifakwa khona ngqo ethusi bese ama-athomu egolide agxivizwa ethusi ngokusabela kokugudluka. Ugqinsi longqimba lwangaphakathi lwe-nickel luvamise ukuba ngu-3-6um, futhi ugqinsi lwe-deposition yegolide yangaphandle ngokuvamile luyi-0.05-0.1um. I-nickel yakha ungqimba oluvimbela phakathi kwe-solder nethusi. Umsebenzi wegolide ukuvimbela i-nickel oxidation ngesikhathi sokugcinwa, ngaleyo ndlela kunwebe impilo yeshalofu, kodwa inqubo yokucwiliswa kwegolide ingaphinda ikhiqize ukushelela okuphezulu kwendawo.
Ukugeleza kokucubungula kwe-ENIG yilokhu: ukuhlanza-->i-etching-->catalyst-->chemical nickel plating-->gold deposition-->insalela yokuhlanza
Inzuzo ye-ENIG
1. Ifanele i-solder yamahhala (ihambisana ne-RoHS)
2. Ubushelelezi bobuso obuhle kakhulu.
3. Impilo yeshalofu ende nendawo ehlala isikhathi eside.
4. Ifanele i-Al wire bonding.
Ubuthakathaka be-ENIG
1. Kuyabiza ngenxa yokusebenzisa igolide.
2. Inqubo eyinkimbinkimbi, okunzima ukuyilawula.
3. Kulula ukukhiqiza into yephedi emnyama.
I-Electrolytic Nickel/Igolide(igolide eliqinile/igolide elithambile)
Electrolytic nickel gold ihlukaniswe “igolide eliqinile” kanye “negolide elithambile”. Igolide eliqinile linobumsulwa obuphansi futhi livame ukusetshenziswa eminwe yegolide (izixhumi zonqenqema ze-PCB), othintana nabo be-PCB noma ezinye izindawo ezingagugi. Ubukhulu begolide bungahluka kuye ngokwezidingo. Igolide elithambile linobumsulwa obuphakeme futhi livame ukusetshenziswa ekubopheni izintambo.
Inzuzo ye-Electrolytic Nickel/Gold
1. Impilo yeshalofu ende.
2. Ifanele ukushintshwa kothintana naye kanye nokubopha ngocingo.
3. Igolide eliqinile lifanele ukuhlolwa kukagesi.
4. I-lead free (ihambisana ne-RoHS)
Ubuthakathaka be-Electrolytic Nickel/Gold
1. Indawo ebiza kakhulu yokuqeda.
2. Iminwe yegolide ye-Electroplating idinga izintambo ezengeziwe.
3. Ukube igolide alikwazi ukutholakala kalula. Ngenxa yobukhulu begolide, izingqimba eziminyene kunzima kakhulu ukuzithengisa.
UTHISHANHLOKO
I-Electroless Nickel Electroless Palladium Immersion Gold noma i-ENEPIG iya ngokuya isetshenziselwa ukuphela kwe-PCB. Uma kuqhathaniswa ne-ENIG, i-ENEPIG yengeza ungqimba olwengeziwe lwe-palladium phakathi kwe-nickel negolide ukuze kuqhutshekwe nokuvikela ungqimba lwe-nickel ekugqwaleni nokuvimbela ukukhiqiza amaphedi amnyama akha kalula enqubweni yokuqeda indawo ye-ENIG. Ubukhulu be-nickel be-deposition bungaba ngu-3-6um, ubukhulu be-palladium bungaba ngu-0.1-0.5um kanye nogqinsi lwegolide ngu-0.02-0.1um. Nakuba ubukhulu begolide buncane kune-ENIG, i-ENEPIG ibiza kakhulu. Nokho, ukwehla kwakamuva kwezindleko ze-palladium kwenze intengo ye-ENEPIG yafinyeleleka kakhulu.
Inzuzo ye-ENEPIG
1. Inazo zonke izinzuzo ze-ENIG, akukho mkhuba wephedi elimnyama.
2. Ifaneleka kakhulu i-wire bonding kune-ENIG.
3. Ayikho ingozi yokugqwala.
4. Isikhathi eside sokulondoloza, sihola mahhala (ihambisana ne-RoHS)
Ubuthakathaka be-ENEPIG
1. Inqubo eyinkimbinkimbi, okunzima ukuyilawula.
2. Izindleko eziphezulu.
3. Kuyindlela entsha futhi engakavuthwa.