Multilayer PCB, kekahi papa HDI PCB

Hana ʻia ʻo HDI PCB me ka PCB ʻaoʻao ʻelua ma ke ʻano he kumu, ma o ka hoʻomau mau ʻana a me ka lamination. ʻO kēia ʻano papa kaapuni i hana ʻia e ka hoʻopaʻa mau ʻana i kapa ʻia ʻo Build-up Multilayer (BUM). Ke hoʻohālikelike ʻia me nā papa kaapuni maʻamau, loaʻa i nā papa kaapuni HDI nā mea maikaʻi e like me ka māmā, lahilahi, pōkole a liʻiliʻi.

Loaʻa ka pilina uila ma waena o nā papa kaapuni HDI ma o ka conductive through-hole, kanu ʻia/makapō ma o nā pilina, he ʻokoʻa ke ʻano mai nā papa kaapuni multi-layer maʻamau. Hoʻohana nui ʻia ka micro buried/blind via ma HDI PCBs. Hoʻohana ʻo HDI i ka hoʻoheheʻe laser pololei, ʻoiai nā PCB maʻamau e hoʻohana pinepine i ka wili mīkini, no laila e emi pinepine ka helu o nā papa a me ka ratio hiʻohiʻona.

Hōʻike nui ʻia ka hoʻomohala kiʻekiʻe o ka HDI PCB i ka nui o nā lua, nā kaʻa, nā pad solder a me ka mānoanoa interlayer.

● Micro ma-puka: HDI PCBs loaʻa nā puka makapō a me nā micro ma-puka manao, ka mea nui i hoikeia i loko o nā koi kiʻekiʻe o ka micro lua hana 'enehana me ka pore nui emi ma mua o 150um, a me ka uku, hana pono a me ka lua kūlana. mana pololei. I loko o nā papa kaapuni kuʻuna lehulehu, he mau puka puka wale nō a ʻaʻohe puka liʻiliʻi i kanu ʻia/makapō.

● Hoʻomaʻemaʻe i ka laulā laina / spacing: ʻike nui ʻia i nā koi koʻikoʻi no nā hemahema uea a me ka ʻili o ka uea. ʻAʻole ʻoi aku ka laulā o ka laina laina ma mua o 76.2um

● Kiʻekiʻe pad density: ʻOi aku ka nui o nā hui solder ma mua o 50/cm2

● Thinning o dielectric mānoanoa: keia mea nui i hoikeia ma ke au o ka interlayer dielectric mānoanoa e ulu ana i 80um a ma lalo, a me ka pono no ka mānoanoa uniformity ua lilo i increasingly koʻikoʻi, oi aku no ka kiʻekiʻe-density PCBs a me ka pahupaʻi substrates me ka mana impedance hiʻona.

ʻAʻole hiki i ka HDI ke hoʻoemi wale i ka hoʻolālā huahana hope, akā hoʻokō pū i nā kūlana kiʻekiʻe o ka hana uila a me ka pono i ka manawa like.

ʻO ka hoʻonui ʻia o ka interconnect density o HDI hiki ke hoʻonui i ka ikaika hōʻailona a hoʻomaikaʻi i ka hilinaʻi. Eia kekahi, ʻoi aku ka maikaʻi o ka hoʻomaikaʻi ʻana o ka HDI PCB i ka hoʻemi ʻana i ke alapine o ka lekiō, ka hawewe electromagnetic interference, ka hoʻokuʻu electrostatic a me ka conduction wela, a me nā mea ʻē aʻe. e hoʻouka i ka piha piha a me ka ikaika overload wā pōkole.

E like me ka mea i ʻike ʻia ma luna, ma ke ʻano o ka nui o ka papa a me ka hana uila, ʻoi aku ka HDI ma mua o nā PCB maʻamau. ʻO kēlā me kēia kālā he ʻelua ʻaoʻao, a ʻo ka ʻaoʻao ʻē aʻe o HDI, ma ke ʻano he PCB kiʻekiʻe, ʻoi aku ka kiʻekiʻe o kona paepae hana a me ka paʻakikī o ke kaʻina hana ma mua o nā PCB maʻamau, a he nui nō hoʻi nā pilikia e hoʻolohe ai i ka wā hana, ʻoi aku ka kanu ʻia ma o a me ka puka hookui.

I kēia manawa, ʻo ke kumu nui o ka ʻeha a me ka paʻakikī i ka hana ʻana a me ka hana ʻana o HDI, ʻo ia ke kanu ʻia ma o ka lua plug. Inā ʻaʻole i hana maikaʻi ʻia ka HDI ma o / plug hole, e kū mai ana nā pilikia koʻikoʻi, me nā ʻaoʻao like ʻole, ka mānoanoa like ʻole a me nā lua ma ka pā solder.

● Hiki i ka ʻili papa ʻole a me nā laina like ʻole ke hōʻeha i ke kahakai i nā wahi i pohō, e alakaʻi ana i nā hemahema e like me nā laina laina a me nā haki.

● Hiki ke hoʻololi ʻia ka impedance ma muli o ka mānoanoa dielectric like ʻole, e hōʻeha ai ka hōʻailona.

● ʻAʻole maikaʻi ka maikaʻi o ka hoʻopaʻa ʻana ma hope o nā pad solder like ʻole, e alakaʻi ana i ka hui pū ʻana a me kekahi mau poho o nā ʻāpana.

No laila, ʻaʻole i loaʻa i nā hale hana PCB ka mana a me ka ikaika e hana maikaʻi i ka HDI, a ua hana ikaika ʻo RICH PCBA no kēia ma mua o 20 mau makahiki.

Ua loaʻa iā mākou nā hopena maikaʻi ma nā hoʻolālā kūikawā e like me ke kiʻekiʻe kiʻekiʻe, kiʻekiʻe kiʻekiʻe, kiʻekiʻe-frequency, kiʻekiʻe kiʻekiʻe, kiʻekiʻe TG, nā papa lawe a me RF PCB. Loaʻa iā mākou ka ʻike hana waiwai i nā kaʻina hana kūikawā e like me ultra-mānoanoa, oversized, keleawe mānoanoa, high-frequency hybrid pressure, copper inlaid blocks, half hole, back drills, deep-control drills, gold fingers, high-precision impedance control boards. , etc.