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Good news | Received patent for mounting jig of military integrated circuit chips

2021-10-13

An integrated circuit chip is an electronic component comprising a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring, and at least one protective ring. The circuit is formed on the silicon substrate, and the circuit has at least one output/input pad. The fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the output/input pad. The grounding ring is formed between the silicon substrate and the output/input pad, and is electrically connected to the fixed sealing ring. The protective ring is set on the silicon substrate and surrounds the output/input pad to be electrically connected to the fixed sealing ring. However, the existing jig for military integrated circuit chip mounting is difficult to adjust, which makes it impossible to adjust it as needed during use, affecting the mounting efficiency. Therefore, our company proposes "a jig for military integrated circuit chip mounting" to solve the existing problem.

A mounting jig for military integrated circuit chips 14624945.jpg

Rich Full Joy Technical Solution

1.Adopting advanced mechanical structure and control system, precise control of chip mounting position is achieved through the combination of servo motor and electric telescopic rod.

2.By setting a motor slot on the base of the jig, the servo motor is fixedly connected to the motor slot, and the output end drives the placement plate for lifting motion. The movable connecting pulleys on the lower surface of the placement board allow for smooth movement of the placement board.

3.By setting a second sliding groove on the front of the placement plate, the telescopic end of the electric telescopic rod is fixedly connected to the sliding block, which slides inside the sliding groove, thereby driving the clamping arm and clamping block to move left and right. The inner side of the clamping arm is fixedly connected to the clamping block, which is used to clamp the chip.

4.Through the combination of servo motor and electric telescopic rod, precise adjustment of chip mounting position has been achieved.

5.The second electric telescopic rod drives the slider to slide left and right at the bottom of the second sliding groove. The slider drives the clamping block to slide left and right through the clamping arm, clamping the chip. The external controller starts the servo motor to work, and the servo motor drives the placement plate to rotate. The stability of the placement plate can be increased through the set pulley. The external controller opens the first electric telescopic rod to extend and retract, and the first electric telescopic rod can fix the placement plate, achieving the purpose of easy adjustment.

Rich Full Joy Innovation Points

1.The design of the pulley enables the placement plate to move smoothly, improving the convenience and stability of adjustment.

2.Based on the characteristics and requirements of military equipment, customized design has been carried out on the jigs to improve their performance and adaptability. Adjust the size and shape of the clamp block according to different models of chips to adapt to different specifications of chips.

3.Enhanced encryption and protection measures for jigs, set access permissions and encrypted transmission security measures to prevent data leakage and illegal access, ensuring data security and privacy.

4.The use of advanced technology and materials to manufacture jigs has improved the stability and reliability of the jigs.

5.This project solves the problem of difficulty in adjusting existing jigs for military integrated circuit chip mounting, which prevents them from being adjusted as needed during use and affects mounting efficiency.

Problems solved by Rich Full Joy

1.Solvedthe problem of inconvenient adjustment of existing jigs.

2.Solvedthe problem of existing jigs being unstable during use, leading to vibration during installation and affecting installation accuracy.

Expected Goals of Rich Full Joy

1.Be able toadapt to chip mounting requirements of different specifications and sizes.

2.Capable of automated installation, reducing manual operations and the occurrence of human errors.

3.Compliant with military standards and requirements, able to maintain stability and reliability in complex environments.