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Chero Layer High Density Yakabatana PCB
BASIC CONCEPT YEHDI
HDI inomiririra High Density Interconnector, inova PCB yekugadzira mhando (tekinoroji), ichishandisa micro blind/kuvigwa kuburikidza nehunyanzvi hwekuona mutsara wekugovera density. Inogona kuwana zviyero zviduku, kushanda kwepamusoro uye mari shoma. HDI PCB ndiko kutsvaga kwevagadziri, vachigara vachigadzira kune yakakwira density uye nemazvo. Iyo inonzi "yakakwirira" haingonatsiridza mashandiro emuchina, asiwo inoderedza saizi yemuchina. High Density Integration (HDI) tekinoroji inogona kuita kuti kugadzirwa kwechigadzirwa kuwedzere kudiki, uku ichisangana nemazinga epamusoro ekuita kwemagetsi uye kugona.
HDI PCB inowanzo sanganisira laser drilling bofu kuburikidza uye mechini yekuchera bofu kuburikidza. Tekinoroji yekuitisa pakati pemukati nekunze matanda anowanzo kuwanikwa kuburikidza nemaitiro sekuvigwa kuburikidza, bofu kuburikidza, makomba akaturikidzana, makomba akadzedzereka, kuyambuka bofu / kuvigwa kuburikidza, nemumakomba, bofu kuburikidza nekuzadza electroplating, waya yakanaka nzvimbo diki uye maburi madiki. mune disc, nezvimwewo.
Kune akati wandei mhando dzeHDI PCB: 1 layer, 2 layer, 3layer, 4 layer uye chero layer yekubatanidza.
● Chimiro che1 layer HDI : 1+N+1 (kudzvanya kaviri, laser drilling kamwe chete).
● Chimiro che 2 layer HDI : 2 + N + 2 (kudzvanya 3 nguva, laser drilling kaviri).
● Chimiro che 3 layer HDI : 3 + N + 3 (kudzvinyirira 4 nguva, laser drilling 3 nguva).
● Chimiro che 4 layer HDI : 4 + N + 4 (kudzvanya 5 nguva, laser drilling 4 times).
Kubva pane zvimiro zviri pamusoro, zvinogona kugumiswa kuti kuchera laser kamwe ndeye 1 layer HDI, kaviri ndeye 2 layer HDI, zvichingodaro. Chero dhizaini Interconnection inogona kutanga laser kuchera kubva kune yakakosha bhodhi. Mune rimwe izwi, chii chinoda kudhirwa laser usati watsikirira chero layer HDI.
Dhizaini Pfungwa yeHDI
1.Patinosangana nekugadzirwa nemakomba munzvimbo yeBGA yePCB yakawanda, asi nekuda kwezvipingamupinyi zvemuchadenga, tinofanira kushandisa mapedhi e-ultra maduku eBGA uye maburi maduku kuti tiwane kupindira kwebhodhi rakazara, tinofanira kuzviita sei? Iye zvino tinoda kuunza iyo HDI yakakwira chaiyo PCB inotaurwa kazhinji muPCB sekutevera.
Iko kuchera kwechinyakare kwePCB kunokanganiswa nemudziyo wekuchera. Kana iyo gomba rekuchera saizi inosvika 0.15mm, mutengo watove wakakwira zvakanyanya uye zvakaoma kuvandudza zvimwe. Nekudaro, nekuda kwenzvimbo shoma, apo chete 0.1mm gomba saizi inogona kugamuchirwa, iyo dhizaini pfungwa yeHDI inodiwa.
2. Kucherwa kweHDI PCB hakuchatsamira pakuchera kwechinyakare, asi kunoshandisa tekinoroji yekuboora laser (dzimwe nguva inozivikanwawo sebhodhi relaser). Huwandu hwegomba rekuchera HDI kazhinji 3-5mil (0.076-0.127mm), hupamhi hwemutsara i3-4mil (0.076-0.10mm), saizi yemapedhi ekutengesa anogona kudzikiswa zvakanyanya, saka kugovera kwemutsara kwakawanda kunogona kuwanikwa pa unit area, zvichiita kuti high density interconnection.
Kubuda kweHDI tekinoroji yakajairana nekusimudzira kusimukira kwePCB indasitiri, zvichiita kuti yakawanda yakaonda BGA, QFP, nezvimwe kurongeka paHDI PCB. Parizvino, tekinoroji yeHDI yakashandiswa zvakanyanya, pakati peiyo 1 layer HDI yakashandiswa zvakanyanya mukugadzira PCB ine 0.5pitch BGA. Kuvandudzwa kweHDI tekinoroji kuri kufambisa kuvandudzwa kwehunyanzvi hwechip, izvo zvinozofambisa kuvandudzwa uye kufambira mberi kweHDI tekinoroji.
Mazuva ano 0.5pitch BGA machipi zvishoma nezvishoma akagamuchirwa zvakanyanya neanogadzira mainjiniya, uye majoini ekutengesa eBGA akachinja zvishoma nezvishoma kubva panzvimbo yakachekwa kana kuti yakadzika fomu kuita fomu ine chiratidzo chekuisa uye kubuda pakati inoda waya.
3. HDI PCB inowanzogadzirwa uchishandisa stacking nzira. Iyo yakawanda nguva iyo stacking inoitwa, iyo yakakwirira yehunyanzvi level yebhodhi. Zvakajairwa HDI PCB yakarongedzerwa kamwe chete, nepo yakakwirira layer HDI inoshandisa kaviri kana kupfuura stacking tekinoroji, pamwe nepamusoro PCB tekinoroji senge gomba stacking, gomba kuzadza ne electroplating uye yakananga laser drilling, nezvimwe.
HDI PCB inokodzera kushandiswa kwehunyanzvi hwekugadzira gungano, uye kuita kwemagetsi uye kurongeka kwechiratidzo kwakakwira kupfuura yechinyakare PCB. Pamusoro pe. HDI ine kuvandudzwa kuri nani muredhiyo frequency interference, electromagnetic wave interference, electrostatic discharge uye thermal conduction, nezvimwe.
Application
HDI PCB ine huwandu hwakasiyana hwemashandisirwo ezviitiko mumunda wemagetsi, senge:
-Big Data & AI: HDI PCB inogona kuvandudza mhando yechiratidzo, hupenyu hwebhatiri uye kushanda kwekubatanidza o mbozha nhare, uku ichidzikisa huremu hwavo uye ukobvu. HDI PCB inogonawo kutsigira kuvandudzwa kwetekinoroji nyowani senge 5G kutaurirana, AI neIoT, nezvimwe.
-Motokari: HDI PCB inogona kusangana nekuoma uye kuvimbika zvinodiwa zvemotokari dzemagetsi masisitimu, uku ichivandudza kuchengetedzwa, nyaradzo uye hungwaru hwemotokari. Inogona zvakare kuiswa kumabasa akadai semotokari radar, kufamba, varaidzo uye rubatsiro rwekutyaira.
-Medical : HDI PCB inogona kuvandudza kurongeka, kunzwisiswa uye kugadzikana kwemidziyo yekurapa, ichideredza saizi yavo uye simba rekushandisa. Inogona zvakare kushandiswa muminda yakadai sekufungidzira kwekurapa, kutarisa, kuongororwa uye kurapwa.
Iwo makuru mashandisirwo eHDI PCB ari munharembozha, madhijitari makamera, AI, IC vatakuri, malaptop, mota dzemagetsi, marobhoti, drones, nezvimwewo, zvichishandiswa zvakanyanya muminda yakawanda.
