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Flexible Printed Circuit Board, FPC Double-sided Board
Tsanangudzo yeFPC (ona nhamba 1 yeruzivo)
1.FPC—Flexible Printed Circuit, inovimbika zvakanyanya uye inochinjika yakadhindwa dunhu rakagadzirwa nekusungirira pafoiri yemhangura uchishandisa polyester firimu kana polyimide se substrate kugadzira dunhu.
2.Chigadzirwa Hunhu : ① Hukuru hudiki uye huremu huremu : kusangana nezvinodiwa zvehurefu-density, miniaturization, huremu, hutete uye kuvimbika kwakakwirira nzira dzekusimudzira; ② High flexibility: inogona kufamba uye kuwedzera zvakasununguka mu 3D nzvimbo, kuwana yakasanganiswa yechikamu musangano uye waya yekubatanidza.
FPC classification ＋FPC basic materials (ona mufananidzo 2 kuti uwane ruzivo)
Zvinoenderana nehuwandu hwema conductive layers, inogona kukamurwa kuita single-sided board, kaviri-sided board uye akawanda-layer board.
Single-sided board: conductor kune rimwe divi chete.
Bhodhi rine mativi maviri: kune maviri maconductor pamativi ese, uye kumisikidza kubatanidza magetsi pakati pemakondakita maviri neburi (via) sebhiriji. A through hole igomba diki rakavharwa nemhangura pamadziro egomba rinokwanisa kubatanidzwa nemaseketi mativi ese.
•Multi-layer board : ine zvikamu zvitatu kana kupfuura zvemakondakita, ane marongerwo akanyatsojeka.
•Kunze kwebhodhi rine divi rimwe chete, huwandu hwezvikamu zvebhodhi rakaomarara kazhinji, senge 2, 4, 6, 8 zvidimbu, zvakanyanya nekuti iyo isinganzwisisike dhizaini stacking chimiro iasymmetric uye inogara kubhodhi warping. Kune rimwe divi, inochinjika PCB yakasiyana sezvo pasina dambudziko re warping, saka 3-layer, 5-layer, nezvimwe zvakajairika.
Copper foil inokamurwa kuita Electro-Deposited mhangura (ED Copper) uye Rolled Annealed mhangura (RA Copper)
| Kuenzanisa pakati peRA mhangura uye ED mhangura | ||
| Mutengo | high | low |
| Kuchinja-chinja | kugona | varombo |
| Kuchena | 99.90% | 99.80% |
| Microscopic chimiro | sheet-like | columnar |
Saka iko kushandiswa kwekupeta kwesimba kunofanirwa kushandisa RA mhangura, senge ndiro yekubatanidza yekupeta/kutsvedza mafoni uye nekuwedzera & kubatanidza zvikamu zvemakamera edhijitari. Pamusoro pemutengo wayo mukana, ED mhangura inonyanya kukodzera kugadzirwa kwemadiki maseketi nekuda kweiyo colomnar chimiro.
| Adhesive Substrate | Adhesiveless Substrate | |||
| PI | AD | WITH | PI | WITH |
| 0.5mil | 12um | 1/3OZ | 0.5mil | 1/3OZ |
| 13um | 0.5OZ | 0.5OZ | ||
| 1mil | 13um | 0.5OZ | 1mil | 1/3OZ |
| 20um | 1OZ | 0.5OZ | ||
Yakajairika Substrate Configuration
Iwo anowanzo shandiswa ukobvu maratidziro ehwaro mhangura yemabhodhi akapfava anosanganisira 1/3oz, 0.5oz, 1oz uye mamwe makushe ekutemerwa. Ukobvu hwemhangura husina kujairika hunosanganisira 1/4oz, 3/4oz uye 2oz, nezvimwe.
Application
Kamera, vhidhiyo kamera, CD-ROM, DVD, hard drive, laptop, runhare, mbozhanhare, printa, fax muchina, TV, midziyo yekurapa, mota dzemagetsi, aerospace uye maindasitiri kutonga, zvigadzirwa zvesimba idzva.
