Naliphi na iLayer High Density High Interconnected PCB
INGQONGQO ESISISEKO ye-HDI
I-HDI imele i-High Density Interconnector, eyi-PCB yokuvelisa uhlobo (iteknoloji), isebenzisa i-micro blind / ingcwatywe ngeteknoloji ukuqonda ubuninzi bokusabalalisa umgca ophezulu. Inokufikelela kwimilinganiselo emincinci, ukusebenza okuphezulu kunye neendleko eziphantsi. I-HDI PCB kusukelo lwabaqulunqi, abaqhubekayo bephuhlisa ukuxinana okuphezulu kunye nokuchaneka. Okubizwa ngokuba "phezulu" akuphuculi kuphela ukusebenza komatshini, kodwa kunciphisa ubungakanani bomatshini. Itekhnoloji ye-High Density Integration (HDI) inokwenza uyilo lwemveliso yokuphela lube luncinci ngakumbi, ngelixa idibana nemigangatho ephezulu yokusebenza kwe-elektroniki kunye nokusebenza kakuhle.
I-HDI PCB ibandakanya ukugrumba okungaboniyo ngelaser ngokusebenzisa kunye nomatshini wokomba oyimfama ngokudlula. Itekhnoloji yokuqhuba phakathi kwamaleya angaphakathi nangaphandle ngokuqhelekileyo iphunyezwa ngeenkqubo ezinje ngokungcwatywa ngokudlula, ukungaboni, ukudlula, imingxunya egqunyiweyo, imingxunya egxadazelayo, ukuwela umfama / ukungcwatywa, ngokusebenzisa imingxunya, ukungaboni ngokuzalisa i-electroplating, ucingo olucolekileyo indawo encinci kunye nemingxuma emincinci. kwidiski, njl.
Kukho iindidi ezininzi ze-HDI PCB : umaleko o-1, u-2 umaleko, u-3 umaleko, umaleko o-4 kunye naluphi na uqhagamshelwano.
● Isakhiwo se-1 umaleko we-HDI : 1+N+1 (ucinezela kabini, i-laser drilling kanye).
● Isakhiwo se-2 layer HDI : 2 + N + 2 (ucinezela amaxesha ama-3, i-laser drilling kabini).
● Isakhiwo se-3 layer HDI : 3 + N + 3 (ucinezela amaxesha ama-4, i-laser drilling 3 amaxesha).
● Isakhiwo se-4 layer HDI : 4 + N + 4 (ucinezela amaxesha ama-5, i-laser drilling 4 amaxesha).
Ukususela kwezi zakhiwo zingentla, kunokugqitywa ukuba i-laser drilling kanye i-HDI ye-HDI, kabini i-HDI ye-2, njalo njalo. Naluphi na umaleko we-Interconnection unokuqalisa ukugrumba i-laser kwibhodi engundoqo. Kwelinye igama, yintoni ekufuneka igrunjwe ngelaser ngaphambi kokucinezela nakuphi na umaleko we-HDI.
Ingcamango yoYilo yeHDI
1.Xa sidibana noyilo olunemingxuma kwindawo ye-BGA ye-PCB eninzi, kodwa ngenxa yokunyanzeliswa kwendawo, kufuneka sisebenzise i-ultra encinci ye-BGA pads kunye ne-ultra imingxuma emincinci ukufezekisa ukungena kwebhodi epheleleyo, kufuneka siyenze njani? Ngoku singathanda ukwazisa i-HDI echanekileyo ephezulu yePCB ekhankanywe rhoqo kwiiPCB njengokulandelayo.
Ukombiwa kwePCB yemveli kuchatshazelwa sisixhobo sokomba. Xa ubungakanani bomngxuma wokugaya bufikelela kwi-0.15mm, iindleko sele ziphezulu kakhulu kwaye kunzima ukuphucula ngakumbi. Nangona kunjalo, ngenxa yesithuba esilinganiselweyo, xa kuphela ubungakanani be-0.1mm yomngxuma ingamkelwa, ingcamango yoyilo lwe-HDI iyafuneka.
2. Ukugrunjwa kwe-HDI PCB akusaxhomekekanga kukomba koomatshini besintu, kodwa kusebenzisa iteknoloji yokomba yelaser (ngamanye amaxesha ikwabizwa ngokuba yibhodi yelaser). Ubungakanani bomngxuma wokugrumba we-HDI ngokuqhelekileyo yi-3-5mil (0.076-0.127mm), ububanzi bomgca yi-3-4mil (0.076-0.10mm), ubungakanani beepads ze-solder zinokuncitshiswa kakhulu, ngoko ke ukuhanjiswa komgca ngakumbi kunokufumaneka indawo yeyunithi, ekhokelela kuqhagamshelo loxinaniso oluphezulu.
Ukuvela kobuchwephesha be-HDI bulungelelanise kwaye bukhuthaze uphuhliso lweshishini le-PCB, okwenza ukuba i-BGA exinene ngakumbi, i-QFP, njl. njl. ukuba ilungiselelwe kwi-HDI PCB. Okwangoku, iteknoloji ye-HDI isetyenziswe ngokubanzi, phakathi kwayo i-1 layer HDI isetyenziswe ngokubanzi kwimveliso ye-PCB kunye ne-0.5pitch BGA. Ukuphuhliswa kobuchwepheshe beHDI kuqhuba uphuhliso lobuchwepheshe be-chip, obuthi buqhubele phambili uphuculo kunye nenkqubela phambili yobuchwepheshe beHDI.
Namhlanje iitshiphusi ze-0.5pitch ze-BGA ziye zamkelwa ngokubanzi ziinjineli zokuyila, kwaye iindawo ezithengiswayo ze-BGA ziye zatshintsha ngokuthe ngcembe ukusuka kwiziko elinomngxuma ngaphandle okanye kwifomu ephantsi komhlaba ukuya kwifom enegalelo lomqondiso kunye nemveliso kwiziko elifuna iingcingo.
3. I-HDI PCB yenziwa ngokubanzi kusetyenziswa indlela yokupakisha. Amaxesha amaninzi ukupakishwa kwenziwa, inqanaba lobugcisa lebhodi liphezulu. I-HDI ye-PCB eqhelekileyo ibekwe kanye, ngelixa i-HDI ephezulu isebenzisa amaxesha amabini okanye ngaphezulu iteknoloji yokupakisha, kunye nobuchwepheshe be-PCB obuphambili obufana nokupakishwa komngxuma, ukugcwaliswa komngxuma nge-electroplating kunye ne-laser drilling ngqo, njl.
I-HDI PCB ilungele ukusetyenziswa kobuchwepheshe bendibano obuphambili, kwaye ukusebenza kombane kunye nokuchaneka komqondiso kuphezulu kune-PCB yemveli. Ukwengeza. I-HDI inophuculo olungcono kuphazamiso lwamaza kanomathotholo, ukuphazamiseka kwamaza e-electromagnetic, ukukhutshwa kwe-electrostatic kunye ne-thermal conduction, njl.
Isicelo
I-HDI PCB inoluhlu olubanzi lweemeko zesicelo kwintsimi ye-elektroniki, njenge:
-Idatha enkulu kunye ne-AI : I-HDI PCB inokuphucula umgangatho wesignali, ubomi bebhetri kunye nokudibanisa okusebenzayo o iifowuni eziphathwayo, ngelixa zinciphisa ubunzima kunye nobukhulu bazo. I-HDI PCB inokuxhasa ukuphuhliswa kobuchwepheshe obutsha obufana nonxibelelwano lwe-5G, i-AI kunye ne-IoT, njl.
-Imoto : I-HDI PCB inokuhlangabezana nobunzima kunye nokuthembeka kweemfuno zeenkqubo zombane zemoto, ngelixa iphucula ukhuseleko, intuthuzelo kunye nobukrelekrele beemoto. Isenokusetyenziswa kwimisebenzi efana nerada yeemoto, ukuhamba, ukuzonwabisa kunye noncedo lokuqhuba.
-Medical : I-HDI PCB inokuphucula ukuchaneka, uvakalelo kunye nokuzinza kwezixhobo zonyango, ngelixa ukunciphisa ubukhulu kunye nokusetyenziswa kwamandla. Isenokusetyenziswa nakwiinkalo ezinjengomfanekiso wonyango, ukubeka iliso, ukuxilongwa kunye nonyango.
Usetyenziso oluphambili lwe-HDI PCB lukwiiselfowuni, iikhamera zedijithali, i-AI, abathwali be-IC, iilaptops, i-automotive electronics, iirobhothi, iidrones, njl., ezisetyenziswa ngokubanzi kwiinkalo ezininzi.
