Ibhodi yeSekethe eShicileleyo eguquguqukayo, iBhodi yeFPC enamacala amabini
Inkcazo ye-FPC (jonga umfanekiso 1 ngeenkcukacha)
I-1.FPC-Flexible Printed Circuit, isekethe eprintiweyo ethembekileyo kakhulu kwaye eguquguqukayo eyenziwe ngokubethelela kwifoyile yobhedu usebenzisa ifilimu yepolyester okanye i-polyimide njenge-substrate ukwenza isekethe.
2. Iimpawu zeMveliso : ① Ubungakanani obuncinci kunye nobunzima obulula : Ukwanelisa iimfuno zoxinzelelo oluphezulu, i-miniaturization, ubunzima, ukubhitya kunye nokuthembeka okuphezulu komkhombandlela wophuhliso; ② Ukuguquguquka okuphezulu : inokuhamba kwaye yandise ngokukhululekileyo kwindawo ye-3D, ifezekise indibano yecandelo elidibeneyo kunye nokudibanisa ucingo.
Ukuhlelwa kweFPC ＋FPC imathiriyeli esisiseko (jonga umfanekiso 2 ngeenkcukacha)
Ngokutsho kwenani leengqimba eziqhubayo, zinokuhlulwa zibe yibhodi enye, ibhodi enamacala amabini kunye nebhodi ye-multi-layer.
Ibhodi enecala elinye : umqhubi kwicala elinye kuphela.
Ibhodi enamacala amabini : kukho iikondaktara ezi-2 kumacala omabini, kunye nokuseka uqhagamshelo lombane phakathi kweekondaktara ezi-2 ngomngxuma (udlula) njengebhulorho. Umngxuma odlulayo ngumngxuma omncinci wobhedu obekwe eludongeni lomngxuma onokudityaniswa neesekethe kumacala omabini.
•Ibhodi yomaleko amaninzi : iqulathe umaleko o-3 okanye ngaphezulu weconductors, noyilo oluchaneke ngakumbi.
•Ngaphandle kwebhodi enecala elinye, inani leeleya zebhodi ezomeleleyo ziqhelekile, ezinje nge-2, 4, 6, 8 umaleko, ngakumbi ngenxa yokuba ulwakhiwo olumnqakathi lokupakisha lune-asymmetric kwaye luqhelene nokujika kwebhodi. Kwelinye icala, i-PCB eguquguqukayo yahlukile njengoko kungekho ngxaki yokulwa, ngoko ke i-3-layer, i-5-layer, njl.
Ifoyile yobhedu yahlulwa ibe yi-Electro-Deposited copper (ED Copper) kunye neRolled Annealed copper (RA Copper)
| Ukuthelekisa phakathi kwe-RA yobhedu kunye ne-ED yobhedu | ||
| Iindleko | phezulu | phantsi |
| Ukuba bhetyebhetye | kulungile | ihlwempu |
| Ubunyulu | 99.90% | 99.80% |
| Ubume beMicroscopic | njengephepha | ikholamu |
Ke usetyenziso lokugoba okuguquguqukayo kufuneka lusebenzise ubhedu lwe-RA, olufana nepleyiti yoqhagamshelo lokusonga/ukutyibilika kweefowuni kunye nolwandiso kunye neenxalenye zokufinyela kweekhamera zedijithali. Ukongeza kwinzuzo yexabiso layo, i-ED yobhedu nayo ifanelekile ngakumbi ukuveliswa kweesekethe ezincinci ngenxa yesakhiwo sayo se-colomnar.
| I-Adhesive Substrate | I-Adhesiveless Substrate | |||
| PI | AD | KUNYE | PI | KUNYE |
| 0.5mil | 12um | 1/3OZ | 0.5mil | 1/3OZ |
| 13um | 0.5OZ | 0.5OZ | ||
| 1mil | 13um | 0.5OZ | 1mil | 1/3OZ |
| 20um | 1OZ | 0.5OZ | ||
Uqwalaselo lweSiqithi esiqhelekileyo
Iimpawu zobukhulu obusetyenziswa ngokuqhelekileyo kwisiseko sobhedu lweebhodi ezithambileyo ziquka i-1/3oz, 0.5oz, 1oz kunye nezinye iinkcukacha zobukhulu. Ubunzima bobhedu obungaqhelekanga bubandakanya i-1/4oz, 3/4oz kunye ne-2oz, njl.
Isicelo
Ikhamera, ikhamera yevidiyo, i-CD-ROM, i-DVD, i-hard drive, i-laptop, ifowuni, ifowuni ephathwayo, umshicileli, umatshini wefeksi, iTV, izixhobo zonyango, i-automotive electronics, i-aerospace kunye nokulawulwa kwemizi-mveliso, iimveliso zamandla amatsha.
