I-Multilayer PCB, noma yisiphi isendlalelo se-HDI PCB
Isendlalelo esiphezulu/noma yimuphi umkhiqizi we-HDI yesendlalelo
Incazelo yebhodi lesifunda le-HDI (High Density lnterconnection) ibhekisela ku-Microvia PCB enembobo engaphansi kuka-6mm, i-Hole Pad engaphansi kuka-0.25mm, ukuminyana kokuxhumana okungaphezu kwamaphoyinti angu-130/ihora lesikwele, ukuminyana kwezintambo okungaphezulu. kunamaphuzu ayi-117/ihora lesikwele, kanye nobubanzi bomugqa/isikhala esingaphansi kuka-3mi/3mi.
Ukuhlelwa kwe-HDI PCB : Isendlalelo esingu-1, isendlalelo esingu-2, isendlalelo esingu-3 nanoma yisiphi isendlalelo se-HDI
Uhlaka olu-1 lwe-HDI : 1+N+1 (cindezela kabili, i-laser kanye).
2 ungqimba HDI isakhiwo : 2+N+2 (cindezela izikhathi 3, laser kabili).
3 ungqimba HDI isakhiwo : 3+N+3 (cindezela izikhathi 4, laser izikhathi 3).
Noma iyiphi i-HDI yongqimba ibhekisela ku-HDI engacubungula ukumba nge-laser kusuka ku-PCB ewumgogodla, kwelinye igama, kusho ukuthi ukubhola nge-laser kuyadingeka ngaphambi kokucindezela.
Izinzuzo ze-HDI PCB
1. Kunganciphisa izindleko ze-PCB. Lapho ukuminyana kwe-PCB kukhula kuya kwezingqimba ezingaphezu kwezingu-8, kukhiqizwa ngendlela ye-HDI futhi izindleko zayo zizoba ngaphansi kunezinqubo zokucindezela zendabuko eziyinkimbinkimbi.
2. Khulisa ukuminyana kwesekethe ngokuxhumanisa amabhodi wesifunda wendabuko kanye nezingxenye
3. Kuyazuzisa ukusetshenziswa kobuchwepheshe bokupakisha obuphambili
4. Isebenza kangcono kagesi kanye nokunemba kwesignali
5. Ukwethembeka okungcono
6. Ingathuthukisa ukusebenza kokushisa
7. Inganciphisa ukuphazamiseka kwefrikhwensi yomsakazo, ukuphazamiseka kwamagagasi kagesi, kanye nokukhishwa kwe-electrostatic (RFI/EMI/ESD)
8. Khulisa ukusebenza kahle kokuklama
Umehluko omkhulu phakathi kwe-HDI ne-PCB evamile
1. I-HDI inevolumu encane nesisindo esilula
I-HDI PCB yenziwe nge-PCB yendabuko enamaceleni amabili njengomongo, ngokwakhiwa okuqhubekayo nokufakwa kwe-lamination. Lolu hlobo lwebhodi lesifunda elenziwe ngokwendlaleka okuqhubekayo laziwa nangokuthi i-Build-up Multilayer (BUM). Uma kuqhathaniswa namabhodi wesifunda wendabuko, amabhodi wesifunda we-HDI anezinzuzo ezinjengokukhanya, mncane, amafushane futhi amancane.
Ukuxhumana kukagesi phakathi kwamabhodi esekethe e-HDI kufinyelelwa ngokusebenzisa imbobo eqhutshwayo, ukugqitshwa/ukuphuphuthekiswa ngezixhumo, ezihluke ngokwesakhiwo kumabhodi esekethe anezingqimba eziningi. I-Micro engcwatshwe/impumputhe nge-isetshenziswa kabanzi kuma-HDI PCB. I-HDI isebenzisa i-laser drilling eqondile, kuyilapho ama-PCB ajwayelekile evamise ukusebenzisa ukubhola ngomshini, ngakho inani lezendlalelo ne-aspect ratio ngokuvamile liyehla.
2. Inqubo Yokukhiqiza yebhodi elikhulu le-HDI
Ukuthuthukiswa kokuminyana okuphezulu kwama-HDI PCB kubonakala ikakhulukazi ekumineni kwezimbobo, amasekhethi, amaphedi e-solder kanye nogqinsi lwama-interlayer.
● Izimbobo zokudlula ezincane: Ama-HDI PCB aqukethe izimbobo eziyizimpumputhe kanye neminye imiklamo emincane yembobo, ebonakala kakhulu ezidingweni eziphezulu zobuchwepheshe bokwakha imbobo encane enosayizi wembotshana ongaphansi kuka-150um, kanye nezindleko, ukusebenza kahle kokukhiqiza kanye nokuma kwembobo. ukulawula ukunemba. Emabhodini esifunda anezingqimba eziningi, kunezimbobo kuphela futhi azikho izimbobo ezincane ezingcwatshiwe/eziyimpumputhe
● Ukucolisiswa kobubanzi/isikhala somugqa: ikakhulukazi kubonakaliswa ezidingweni eziqinile eziqinile zokulimala kwezintambo kanye nobuhwaqane bendawo yezintambo. Ububanzi/isikhala somugqa ojwayelekile angeqi ku-76.2um
● Ukuminyana kwephedi ephezulu: Ukuminyana kwamajoyinti e-solder kukhulu kuno-50/cm2
● Ukuncipha kogqinsi lwe-dielectric: Lokhu kubonakala kakhulu kuthrendi yokuqina kwe-interlayer dielectric ethuthukayo iye ku-80um nangaphansi, futhi imfuneko yokufana kogqinsi iya ngokuya iba qinile, ikakhulukazi kuma-PCB anobukhulu obuphezulu kanye nama-substrates okupakisha anokulawula okuphawulekayo kokuqina.
3. I-HDI PCB inokusebenza kagesi okungcono
I-HDI ayikwazi nje ukunciphisa ukwakheka komkhiqizo wokugcina, kodwa futhi ihlangabezana namazinga aphezulu okusebenza kwe-elekthronikhi nokusebenza kahle ngesikhathi esisodwa.
Ukuminyana kokuxhumana okukhuphukile kwe-HDI kuvumela amandla esignali athuthukisiwe nokuthembeka okuthuthukisiwe. Ngaphezu kwalokho, ama-HDI PCB anokuthuthukiswa okungcono kakhulu ekunciphiseni ukuphazamiseka kwefrikhwensi yomsakazo, ukuphazamiseka kwamagagasi kagesi, ukukhishwa kwe-electrostatic kanye nokuqhutshwa kokushisa, njll. I-HDI iphinde yamukele ubuchwepheshe bokulawula isignali yedijithali ngokugcwele (i-DSP) kanye nobuchwepheshe obunamalungelo obunikazi amaningi, obunamandla okuzivumelanisa nezimo. ukulayisha ebangeni eligcwele kanye nomthamo oqinile wokugcwala wesikhashana esifushane.
4. Ama-PCB we-HDI anezidingo eziphakeme kakhulu zokungcwatshwa nge/plug hole
Njengoba kungabonwa kulokhu okungenhla, kokubili ngokosayizi webhodi nokusebenza kukagesi, i-HDI iphakeme kunama-PCB avamile. Uhlamvu lwemali ngalunye lunezinhlangothi ezimbili, kanti olunye uhlangothi lwe-HDI, njenge-PCB esezingeni eliphezulu, umkhawulo wayo wokukhiqiza nobunzima benqubo buphakeme kakhulu kunama-PCB ajwayelekile, futhi kukhona nezindaba eziningi okufanele uzinake ngesikhathi sokukhiqiza, ikakhulukazi ukungcwatshwa nge-PCB. kanye nembobo yokuxhuma.
Njengamanje, iphoyinti lobuhlungu eliyinhloko nobunzima ekukhiqizeni nasekukhiqizeni i-HDI ukugqitshwa ngembobo yokuxhuma. Uma i-HDI egqitshwe ngembobo yepulaki ingenziwanga kahle, izinkinga zekhwalithi eziphawulekayo zizokwenzeka, okuhlanganisa imiphetho engalingani, ukushuba okuphakathi okungalingani kanye nemigodi ku-solder pad.
● Ukungalingani kwebhodi kanye nemigqa engalingani kungabangela izenzakalo zolwandle ezindaweni ezishonelwe, okuholela kumaphutha njengamagebe emigqa nokuphuka.
● I-impedance yesici ingase futhi iguquguquke ngenxa yokushuba kwe-dielectric engalingani, kubangele ukungasebenzi kwesignali
● Amaphedi e-solder angalingani abangela ikhwalithi ephansi yokupakisha elandelayo, okuholela ekulahlekelweni okuhlangene kanye nokulahlekelwa okuningana kwezingxenye.
Ngakho-ke, akuzona zonke izimboni ze-PCB ezinekhono namandla okwenza i-HDI kahle, futhi i-RICH PCBA ibisebenza kanzima kulokhu ngaphezu kweminyaka engama-20.
Sithole imiphumela emihle emiklameni ekhethekile njengokunemba okuphezulu, ukuminyana okuphezulu, imvamisa ephezulu, isivinini esikhulu, i-TG ephezulu, amapuleti enkampani yenethiwekhi kanye ne-RF PCB. Siphinde sibe nolwazi olucebile lokukhiqiza ezinqubweni ezikhethekile ezinjengokuqina okukhulu, usayizi omkhulu, ithusi eliwugqinsi, umfutho we-hybrid we-high-frequency, amabhulokhi afakwe ngethusi, izimbobo eziwuhhafu, izimbobo zangemuva, izimbobo zokulawula ukujula, iminwe yegolide, amabhodi okulawula ukunemba okuphezulu. , njll.
Isicelo (bheka inombolo enamathiselwe ukuze uthole imininingwane)
Ama-HDI PCB asetshenziswa emikhakheni eyahlukene efana nomakhalekhukhwini, amakhamera edijithali, i-AI, abathwali be-IC, imishini yezokwelapha, ukulawula izimboni, amalaptop, ugesi wezimoto, amarobhothi, ama-drones, njll.
Isicelo
Ama-HDI PCB asetshenziswa emikhakheni eyahlukene efana nomakhalekhukhwini, amakhamera edijithali, i-AI, abathwali be-IC, imishini yezokwelapha, ukulawula izimboni, amalaptop, ugesi wezimoto, amarobhothi, ama-drones, njll.