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Comparison of Differences between IPC2 and IPC3 standards
2024-06-13
| Comparison of Differences between IPC2 and IPC3 standards | ||
| Comparison of differences between IPC2 and IPC3 standards for automotive PCBs: | ||
| The IPC level reflects the quality level of each type of printed circuit board, and some electronic manufacturers only have the ability to produce IPC first and second level products. In the short term, there may not be a noticeable difference, but over time, product quality issues become more prominent. If your product belongs to industrial grade and you focus on the long-term value of the product, please be sure to choose a higher level standard. The quality standards comprise IPC1, IPC2, IPC3, GJB362C-2021,AS9100 | ||
| metal plating (surface and hole): average thickness of copper | ||
| IPC2 | IPC3 | |
| ●20um | ●25um | |
| metal plating (surface and hole): min thickness of copper | ||
| IPC2 | IPC3 | |
| ●18um | ●20um | |
| voids inside the copper plating layer | ||
| IPC2 | IPC3 | |
| ●There should be no more than one void inside the hole. ●The number of holes containing voids shall not exceed 5%. ●The length of the void shall not exceed 5% of the hole length. ●The circular degree of the void shall not exceed 90°. | ●There shall be no voids inside the hole. | |
| Coating voids in the finished coating layer | ||
| IPC2 | IPC3 | |
| ●There should be no more than 3 voids inside the hole. ●The number of holes containing voids shall not exceed 5%. ●The length of the void shall not exceed 5% of the hole length. ●The circular degree of the void shall not exceed 90°. | ●There should be no more than one void inside the hole, and the number of holes containing voids should not exceed 5%. ●The length of the void shall not exceed 5% of the hole length. ●The circular length of the void shall not exceed 90°. | |
| General rules for surface coating | ||
| IPC2 | IPC3 | |
| ●The overlapping area of exposed copper/coating shall not exceed 1.25mm. | ●The overlapping area of exposed copper/coating shall not exceed 0.8mm. | |
| etching mark | ||
| IPC2 | IPC3 | |
| ●As long as the line width that forms characters can be recognized, it can be reduced to 50%. | ●The edges of the lines that form characters can be allowed for slight irregularities. | |
| Silkscreen or ink stamping mark | ||
| IPC2 | IPC3 | |
| ●As long as the characters are clear, the ink can be allowed to stack on the outside of the character lines.
●As long as the required orientation is still clear, the outline of the component orientation symbol can tolerate parial detachment. ●The ink for mark of the component hole solder pad shall not penetrate into the component installation hole or cause the righ width to be lower than the minimum ring width. |
●As long as the characters are clear, the ink can be allowed to stack on the outside of the character lines. | |
| Soda strawing | ||
| IPC2 | IPC3 | |
| ●A soda strawing appears along the side edge of the conductive pattern, causing a reduction in line spacing that shall not be lower than the minimum specified requirement. At the same time, this soda strawing shall have not yet extended to the entire edge of the conductive pattern. | ●Soda strawing is not allowed. | |
| Line spacing | ||
| IPC2 | IPC3 | |
| ●Any combination of defects such as rough line edges and copper spikes shall not result in a reduction of more than 30% of the minimum line spacing in isolated areas. | ●Any combination of defects such as rough line edges and copper spikes shall not result in a reduction of more than 20% of the minimum line spacing in isolated areas. | |
| Outer ring width of supported hole | ||
| IPC2 | IPC3 | |
| ●The degree of breakage shall not exceed 90°and shall meet the minimum lateral spacing requirement.
●If the reduction of line width in the connection area between the solder pad and the line is not greater than 20% of the nominal minimum line width specified in the engineering drawing or production base, a -90°break is allowed. The line connection should not be less than 0.05mm(0.0020 in) or the minimum line width, whichever is smaller. |
●The hole is not located in the center of the solder pad, but the ring width shall not be less than 0.05mm(0.0020in).
●Due to defects such as pitting, pits, notches, pinholes or oblique holes, the minimum outer ring width within an isolated area is allowed to be reduced by 20%. |
|
| Ring width of unsuported hole | ||
| IPC2 | IPC3 | |
| ●The hole ring width is not broken. | ●The rign width in any direction shall not be less than 0.15mm(0.00591 in). For the hole ring in the inclined area, due to defects such as pitting, pits, notches, pinholes or oblique holes, the minimum outer ring width is allowed to be reduced by 20%. | |
| Negative etching | ||
| IPC2 | IPC3 | |
| ●Negative etching shall be less than 0.025mm(0.000984in). | ●Negative etching shall be less than 0.013mm(0.000512in). | |
| Inner ring width | ||
| IPC2 | IPC3 | |
| ●The degree of breakage should not exceed 90°. | ●The minimum ring width shall not be less than 0.025mm(0.000984in). | |
| Core suction effect | ||
| IPC2 | IPC3 | |
| ●Core suction effect should not exceed 0.10mm(0.0040in). | ●Core suction effect should not exceed 0.08mm(0.0031in). | |
| Core suction effect of the isolation hole | ||
| IPC2 | IPC3 | |
| ●Core suction effect should not exceed 0.10mm(0.0040in). | ●Core suction effect should not exceed 0.08mm(0.0031in). | |
| Coverage of the coverlay | ||
| IPC2 | IPC3 | |
| ●There should be sodlerable hole rings within a range of at least 270°around the circumference. | ●The minimum width of the solderable hole on the entire circumference is 0.13mm(0.00512in). | |
| The overlap of clearance holes on the coverlay and stiffener board | ||
| IPC2 | IPC3 | |
| ●There should be at least one solderable hole ring within a 270°range on the circumference. |
●The minimum width of the solderable hole on the entire circumference is 0.13mm.
●For unsupported hole, the ring width of the solderable hole shall not be less than 0.25mm. |
|
| Connection between metal core and plated hole wall | ||
| IPC2 | IPC3 | |
| ●The separation at the interconnection point shall not exceed 20% of the thickness of the metal core. If a copper clad metal core is used, there shall not be no seperation in the copper interconncetion part. | ●There shall be no seperation at the interconnection part. | |
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